Enhanced discharge of high power pulsed magnetron sputtering coupling with high voltage

Wu Zhong-Zhen; Tian Xiu-Bo; Pan Feng; Ricky K. Y. Fu; Paul K. Chu

doi:10.7498/aps.63.185207

Abstract

Plasma source ion implantation and deposition, as an effective technology to produce functional coatings with high adhesion and density, possesses the wide application prospect, especially in the deposition of coatings that work in high loading service conditions. The key component of this technology is the metal plasma source, which is now based on pulsed cathodic arc with complex source structure and magnetic filtration because of the macro-droplets in the ion flux. In this paper, we present another metal plasma source, high power pulsed magnetron sputtering (HPPMS), and investigate the discharge characteristics at different coupling high-voltages by optical emission spectroscopy. The results show that significant improvements are found in the discharge target current and main particles in the plasma. The improvement in gas discharge by the coupling high-voltage is greater than in metal discharge which could increase obviously in the self-sputtering stage with higher target voltage discharge. Last but not least, in this paper we discuss the discharge enhancing mechanism of coupling high-voltage. It is found that the self-excited glow discharge of coupling high-voltage, the hollow-cathodic effect induced by face-to-face negative voltages of HPPMS and coupling high-voltage, and the enhanced ambipolar diffusion of the coupling high-voltage can all play a considerable role in HPPMS discharge.

Keywords:

high power pulsed magnetron sputtering /
coupling high-voltage /
discharge target current /
plasma optical emission spectroscopy

Authors and contacts

1.
School of Advanced Materials, Peking University Shenzhen Graduate School, Shenzhen 518055, China;
2.
State Key Laboratory of Advanced Welding Production and Technology, Harbin Institute of Technology, Harbin 150001, China;
3.
Department of Physics and Materials Science, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong, China
Funds: Project supported by the National Natural Science Foundation of China (Grant Nos. 51301004, U1330110) and the Shenzhen Science and Technology Research Grant, China (Grant Nos. SGLH20120928095706623, JCYJ20120614150338154, CXZZ20120829172325895).

References

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[2]	Li X, Tang Z A, Ma G J, Wu Z M, Deng X L 2003 Chin. Phys. Lett. 20 692
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[18]	Duan W Z 2010 M.S. Dissertation (Harbin: Harbin Institute of Technology) (in Chinese)[段伟赞 2010 硕士学位论文 (哈尔滨: 哈尔滨工业大学)]
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[20]	Carsten E, George C, Chan G, Buscher W, Hieftje G M 2008 Spectrochim. Acta B 7 619
[21]	Duan W Z 2011 M.S. Dissertation (Harbin: Harbin Institute of Technology) (in Chinese)[段伟赞 2011 硕士学位论文 (哈尔滨: 哈尔滨工业大学)]
[22]	Kirsch B, Hanamura S, Wineforder J D 1984 Spectrochim. Acta B 39 955
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[24]	Kadlec S 2007 Plasma Processes Polym. 4 S419
[25]	Gong C Z, Zhu Z T, Shi J W, Yang S Q, Tian X B, Chu P K 2010 Surf. Coat. Technol. 204 2996
[26]	Oks E, Anders A 2010 Rev. Sci. Instrum. 81 02B306
[27]	Wu Z Z, Tian X B, Wang Z M, Gong C Z, Yang S Q 2011 Chin. J. Vac. Sci. Technol. 31 459(in Chinese)[吴忠振, 田修波, 王泽明, 巩春志, 杨士勤 2011 真空科学与技术学报 31 459]
[28]	Mu Z X, Mu X D, Wang C, Jia L, Dong C 2011 Acta Phys. Sin. 60 015204(in Chinese)[牟宗信, 牟晓东, 王春, 贾莉, 董闯 2011 60 015204]
[29]	Wang Z M 2010 M.S. Dissertation (Harbin: Harbin Institute of Technology) (in Chinese)[王泽明 2011 硕士学位论文 (哈尔滨: 哈尔滨工业大学)]
[30]	Anders A, Andersson J Ehiasarian A P 2007 J. Appl. Phys. 102 113303
[31]	Anders A 2010 J. Vac. Sci. Technol. A 28 783
[32]	Wu Z Z, Tian X B, Wei Y Q, Gong C Z, Yang S Q, Pan F, Chu P K 2013 Surf. Coat. Technol. 236 320

Cited By

[1]	Conrad J R, Castagna T, Am B 1986 Phys. Soc. 31 1479
[2]	Li X, Tang Z A, Ma G J, Wu Z M, Deng X L 2003 Chin. Phys. Lett. 20 692
[3]	Man B Y, Zhang Y H, L G H, Liu A H, Zhang Q G, Guzman L, Adami M, Miotello A 2005 Acta Phys. Sin. 54 837(in Chinese)[满宝元, 张运海, 吕国华, 刘爱华, 张庆刚, Guzman L, Adami M, Miotello A 2005 54 837]
[4]	Bilek M M M, McKenziea D R, Tarranta R N, Limb S H M, McCulloch D G 2002 Surf. Coat. Technol. 156 136
[5]	Zhang G L, Wang J L, Liu Y F, Liu C Z, Yang S Z 2004 Chin. Phys. 13 1309
[6]	Liu J, Liu B W, Xia Y, Li C B, Liu S 2012 Acta Phys. Sin. 61 148102(in Chinese)[刘杰, 刘邦武, 夏洋, 李超波, 刘肃 2012 61 148102]
[7]	Anders A 1997 Surf. Coat. Technol. 93 158
[8]	Anders S, Anders A, Dickinson M R, MacGilt R A, Brown I G 1996 Proc. of XVⅡth Int. Symp. Disch. El. Insul. Vacuum Berkeley, USA, July 2-6, 1996 p904
[9]	Kouznetsov V, Maca'k K, Schneider J M, Helmersson U, Petrov I 1999 Surf. Coat. Technol. 122 290
[10]	Bohlmark J, Gudmundsson J T, Alami J, Latteman M, Helmersson U 2005 IEEE Trans. Plasma Sci. 33 346
[11]	Bohlmark J, Lattemann M, Gudmundsson J T, Ehiasarian A P, Gonzalvo Y A, Brenning N, Helmersson U 2006 Thin Solid Films 515 1522
[12]	Horwat D, Anders A 2008 J. Phys. D: Appl. Phys. 41 135210
[13]	Ehiasarian A P, Gonzalvo Y A, Whitmore T D 2007 Plasma Processes Polym. 4 S309
[14]	Tian X B, Wu Z Z, Gong C Z 2010 China Patent 201010213894.4 2010-06 (in Chinese)[田修波, 吴忠振, 巩春志 2010 中国专利 201010213894.4 2010-06]
[15]	Wu Z Z, Tian X B, Shi J W, Gong C Z, Yang S Q, Chu P K 2011 Rev. Sci. Instrum. 69 033511
[16]	Wu Z Z, Tian X B, Gong C Z, Yang S Q 2013 Rare Metal Mater. Eng. 42 405 (in Chinese)[吴忠振, 田修波, 巩春志, 杨士勤2013 稀有金属材料与工程 42 405]
[17]	Wu Z Z, Tian X B, Wang Z M, Gong C Z, Yang S Q, Tan C M 2011 Appl. Surf. Sci. 258 242
[18]	Duan W Z 2010 M.S. Dissertation (Harbin: Harbin Institute of Technology) (in Chinese)[段伟赞 2010 硕士学位论文 (哈尔滨: 哈尔滨工业大学)]
[19]	Tian X B, Wu Z Z, Shi J W, Li X P, Gong C Z, Yang S Q 2010 Chin. Vac. 47 44 (in Chinese)[田修波, 吴忠振, 石经纬, 李希平, 巩春志, 杨士勤 2010 真空 47 44]
[20]	Carsten E, George C, Chan G, Buscher W, Hieftje G M 2008 Spectrochim. Acta B 7 619
[21]	Duan W Z 2011 M.S. Dissertation (Harbin: Harbin Institute of Technology) (in Chinese)[段伟赞 2011 硕士学位论文 (哈尔滨: 哈尔滨工业大学)]
[22]	Kirsch B, Hanamura S, Wineforder J D 1984 Spectrochim. Acta B 39 955
[23]	Poucques L D, Imbert J C, Boisse-Laporte C, Bretagne J, Ganciu M, Teul-Gay L, Touzeau M 2006 Czech. J. Phys. 56 B1300
[24]	Kadlec S 2007 Plasma Processes Polym. 4 S419
[25]	Gong C Z, Zhu Z T, Shi J W, Yang S Q, Tian X B, Chu P K 2010 Surf. Coat. Technol. 204 2996
[26]	Oks E, Anders A 2010 Rev. Sci. Instrum. 81 02B306
[27]	Wu Z Z, Tian X B, Wang Z M, Gong C Z, Yang S Q 2011 Chin. J. Vac. Sci. Technol. 31 459(in Chinese)[吴忠振, 田修波, 王泽明, 巩春志, 杨士勤 2011 真空科学与技术学报 31 459]
[28]	Mu Z X, Mu X D, Wang C, Jia L, Dong C 2011 Acta Phys. Sin. 60 015204(in Chinese)[牟宗信, 牟晓东, 王春, 贾莉, 董闯 2011 60 015204]
[29]	Wang Z M 2010 M.S. Dissertation (Harbin: Harbin Institute of Technology) (in Chinese)[王泽明 2011 硕士学位论文 (哈尔滨: 哈尔滨工业大学)]
[30]	Anders A, Andersson J Ehiasarian A P 2007 J. Appl. Phys. 102 113303
[31]	Anders A 2010 J. Vac. Sci. Technol. A 28 783
[32]	Wu Z Z, Tian X B, Wei Y Q, Gong C Z, Yang S Q, Pan F, Chu P K 2013 Surf. Coat. Technol. 236 320

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Vol. 63, Issue 18 - 2014-09-20

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