-
A circular silicone sheet as a masker was used to cover a glass slide, and then the super-hydrophobic coating was sprayed on the glass slide free of silicone sheet masker, thus a round hydrophilic area surrounded by a super-hydrophobic coating is obtained. The PS colloidal droplets are confined in the hydrophilic area, and the droplet volume can be changed within a large range. Variation of the droplet volume influences the initial apparent contact angle. We investigate the particle deposition behavior of the confined colloidal droplet for a hydrophobic apparent contact angle in evaporation process by using an in situ optical observation system. In the whole evaporation process the contact-line of the confined droplet is pinned at the junction between the hydrophilic area and hydrophobic area. In the particle deposition process the main driving flow is different, and the final deposition pattern is controlled by three flow behaviors. In the early stage, the main flow is the Marangoni flow, which drives the particle clusters float on the droplet surfaces, part of them accumulated at the boundaries. As the evaporation proceeds, when the apparent contact angle decreases (<60°), the evaporation flux becomes singular near the contact line, Capillary flow towards the contact inside the drop as a compensation to the solvent loss at the drop boundary, which drives the particles in the droplet to rapidly accumulate at the contact-line. In the last evaporation stage, the thickness of the film in the hydrophilic area becomes very thin, and there is only one layer of particles in this thin film, the thin liquid film instability triggers the particles in the middle area to rapidly aggregate and then form a kind of network pattern, due to the decrease of distances between the particles. Capillary force between particles also takes part in this aggregate process.
-
Keywords:
- droplet evaporation /
- Marangoni flow /
- capillary flow /
- thin liquid film instability
[1] Norris D J, Arlinghaus E G, Meng L, Heiny R, Scriven L 2004 Adv. Mater. 16 1393
[2] Zhang J, Sun Z, Yang B 2009 Curr. Opin. Colloid Interface Sci. 14 103
[3] Pham H H, Gourevich I, Oh J K, Jonkman J E, Kumacheva E 2004 Adv. Mater. 16 516
[4] Velev O D, Kaler E W 2000 Adv. Mater. 12 531
[5] Velev O D, Kaler E W 1999 Langmuir 15 3693
[6] Luo X, Morrin A, Killard A J, Smyth M R 2006 Electroanalysis 18 319
[7] Fustin C -A, Glasser G, Spiess H W, Jonas U 2003 Adv. Mater. 15 1025
[8] Fan F, Stebe K J 2004 Langmuir 20 3062
[9] Fustin C -A, Glasser G, Spiess H W, Jonas U 2004 Langmuir 20 9114
[10] Reynolds T D, Kalpathy S K, Kumar S, Francis L F 2010 J. Colloid Interface Sci. 352 202
[11] Singh G, Pillai S, Arpanaei A, Kingshott P 2011 Nanotechnology 22 225601
[12] Yu Y X, Jin L 2008 J. Chem. Phys. 128 014901
[13] Yu Y X, You F Q, Tang Y P, Gao G H, Li Y G 2006 J. Phys. Chem. B 110 334
[14] You F Q, Yu Y X, Gao G H 2005 J. Chem. Phys. 123 114705
[15] Zhong C, Chen Z Q, Yang W G, Xia H 2013 Acta. Phys. Sin. 62 214207 (in Chinese) [钟诚, 陈智全, 杨伟国, 夏辉 2013 62 214207]
[16] Yu Y X, Tian A W, Gao G H 2005 Phys. Chem. Chem. Phys. 7 2423
[17] Deegan R D, Bakajin O, Dupont T F, Huber G, Nagel S R, Witten T A 1997 Nature 389 827
[18] Deegan R D 2000 Phys. Rev. E 61 475
[19] Deegan R D, Bakajin O, Dupont T F, Huber G, Nagel S R, Witten T A 2000 Phys. Rev. E 62 756
[20] Zhang W B, Liao L G, Yu T X, Ji A L 2013 Acta Phys. Sin. 62 196102 (in Chinese) [张文彬, 廖龙光, 于同旭, 纪爱玲 2013 62 196102]
[21] Weon B M, Je J H 2013 Phys. Rev. Lett. 110 028303
[22] Xia Y N, Yin Y D, Lu Y, McLellan J 2003 Adv. Funct. Mater. 13 907
[23] Yin Y D, Lu Y, Gates B, Xia Y N 2001 J. Am. Chem. Soc. 123 8718
[24] Hu H, Larson R G 2005 Langmuir 21 3963
[25] Hu H, Larson R G 2005 Langmuir 21 3972
[26] Hu H, Larson R G 2006 J. Phys. Chem. B 110 7090
[27] Xu X, Luo J 2007 Appl. Phys. Lett. 91 124102
[28] Uno K, Hayashi K, Hayashi T, Ito K, Kitano H 1998 Colloid. Polym. Sci. 276 810
[29] Hu H, Larson R G 2002 J. Phys. Chem. B 106 1334
[30] Guena G, Poulard C, Cazabat A M 2007 Colloid J. 69 1
[31] Nguyen T A H, Hampton M A, Nguyen A V 2013 J. Phys. Chem. C 117 4707
[32] Adachi E, Dimitro A S, Nagayama K 1995 Langmuir 11 1057
[33] Bhardwaj R, Fang X, Attinger D 2009 New J. Chem. 11 075020
[34] Lu K Q, Liu J X 2006 Soft Material Physics Introduction (Beijing: Peking University Press) p250 (in Chinese) [陆坤权, 刘寄星 2006 软物质物理学导论(北京: 北京大学出版社)第250页]
[35] Langmuir I 1912 Phys. Rev. 12 368
[36] Cai Y, Zhang Newby B 2008 J. Am. Chem. Soc. 130 6076
[37] Nikolov A D, Wasan D T 2009 Ind. Eng. Chem. Res. 48 2320
[38] Marín á G, Gelderblom H, Lohse D, Snoeijer J H 2011 Phys. Rev. Lett. 107 085502
[39] Denkov N, Velev O, Kralchevski P, Ivanov I, Yoshimura H, Nagayama K 1992 Langmuir 8 3183
[40] Kralchevsky P A, Denkov N D, Paunov V N, Velev O D, Ivanov I B, Yoshimura H, Nagayama K 1994 J. Phys-condens. Mat. 6 395
-
[1] Norris D J, Arlinghaus E G, Meng L, Heiny R, Scriven L 2004 Adv. Mater. 16 1393
[2] Zhang J, Sun Z, Yang B 2009 Curr. Opin. Colloid Interface Sci. 14 103
[3] Pham H H, Gourevich I, Oh J K, Jonkman J E, Kumacheva E 2004 Adv. Mater. 16 516
[4] Velev O D, Kaler E W 2000 Adv. Mater. 12 531
[5] Velev O D, Kaler E W 1999 Langmuir 15 3693
[6] Luo X, Morrin A, Killard A J, Smyth M R 2006 Electroanalysis 18 319
[7] Fustin C -A, Glasser G, Spiess H W, Jonas U 2003 Adv. Mater. 15 1025
[8] Fan F, Stebe K J 2004 Langmuir 20 3062
[9] Fustin C -A, Glasser G, Spiess H W, Jonas U 2004 Langmuir 20 9114
[10] Reynolds T D, Kalpathy S K, Kumar S, Francis L F 2010 J. Colloid Interface Sci. 352 202
[11] Singh G, Pillai S, Arpanaei A, Kingshott P 2011 Nanotechnology 22 225601
[12] Yu Y X, Jin L 2008 J. Chem. Phys. 128 014901
[13] Yu Y X, You F Q, Tang Y P, Gao G H, Li Y G 2006 J. Phys. Chem. B 110 334
[14] You F Q, Yu Y X, Gao G H 2005 J. Chem. Phys. 123 114705
[15] Zhong C, Chen Z Q, Yang W G, Xia H 2013 Acta. Phys. Sin. 62 214207 (in Chinese) [钟诚, 陈智全, 杨伟国, 夏辉 2013 62 214207]
[16] Yu Y X, Tian A W, Gao G H 2005 Phys. Chem. Chem. Phys. 7 2423
[17] Deegan R D, Bakajin O, Dupont T F, Huber G, Nagel S R, Witten T A 1997 Nature 389 827
[18] Deegan R D 2000 Phys. Rev. E 61 475
[19] Deegan R D, Bakajin O, Dupont T F, Huber G, Nagel S R, Witten T A 2000 Phys. Rev. E 62 756
[20] Zhang W B, Liao L G, Yu T X, Ji A L 2013 Acta Phys. Sin. 62 196102 (in Chinese) [张文彬, 廖龙光, 于同旭, 纪爱玲 2013 62 196102]
[21] Weon B M, Je J H 2013 Phys. Rev. Lett. 110 028303
[22] Xia Y N, Yin Y D, Lu Y, McLellan J 2003 Adv. Funct. Mater. 13 907
[23] Yin Y D, Lu Y, Gates B, Xia Y N 2001 J. Am. Chem. Soc. 123 8718
[24] Hu H, Larson R G 2005 Langmuir 21 3963
[25] Hu H, Larson R G 2005 Langmuir 21 3972
[26] Hu H, Larson R G 2006 J. Phys. Chem. B 110 7090
[27] Xu X, Luo J 2007 Appl. Phys. Lett. 91 124102
[28] Uno K, Hayashi K, Hayashi T, Ito K, Kitano H 1998 Colloid. Polym. Sci. 276 810
[29] Hu H, Larson R G 2002 J. Phys. Chem. B 106 1334
[30] Guena G, Poulard C, Cazabat A M 2007 Colloid J. 69 1
[31] Nguyen T A H, Hampton M A, Nguyen A V 2013 J. Phys. Chem. C 117 4707
[32] Adachi E, Dimitro A S, Nagayama K 1995 Langmuir 11 1057
[33] Bhardwaj R, Fang X, Attinger D 2009 New J. Chem. 11 075020
[34] Lu K Q, Liu J X 2006 Soft Material Physics Introduction (Beijing: Peking University Press) p250 (in Chinese) [陆坤权, 刘寄星 2006 软物质物理学导论(北京: 北京大学出版社)第250页]
[35] Langmuir I 1912 Phys. Rev. 12 368
[36] Cai Y, Zhang Newby B 2008 J. Am. Chem. Soc. 130 6076
[37] Nikolov A D, Wasan D T 2009 Ind. Eng. Chem. Res. 48 2320
[38] Marín á G, Gelderblom H, Lohse D, Snoeijer J H 2011 Phys. Rev. Lett. 107 085502
[39] Denkov N, Velev O, Kralchevski P, Ivanov I, Yoshimura H, Nagayama K 1992 Langmuir 8 3183
[40] Kralchevsky P A, Denkov N D, Paunov V N, Velev O D, Ivanov I B, Yoshimura H, Nagayama K 1994 J. Phys-condens. Mat. 6 395
Catalog
Metrics
- Abstract views: 7396
- PDF Downloads: 703
- Cited By: 0
下载:
