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The relationship between the surface wettability and the interaction strength of liquid-wall particles is first investigated using a lattice Boltzmann method, and then the liquid flow over hydrophobic surfaces is simulated in a microchannel. Effect of surface wettability on the slip flow and drag reduction characteristics of hydrophobic surfaces is obtained. Existence of the apparent slip on hydrophobic surfaces is confirmed and its mechanism is revealed. Simulation results show that the hydrophobicity induces a low density layer near the wall of hydrophobic surfaces and the apparent slip is observed on the low density layer. It is shown that the apparent slip is a direct cause of hydrophobic surfaces' drag reduction effect. Thus the drag reduction effect increases with increasing slip length. For a specific fluid system, the slip length is an inherent property of the hydrophobic surfaces and is a single function of the surface wettability. The slip length does not change with the external flow property.
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Keywords:
- hydrophobic surface /
- slip flow /
- drag reduction mechanism /
- lattice Boltzmann method
[1] Xu C, He Y L, Wang Y 2005 Journal of Engineering Thermophysics 26 912 (in Chinese) [徐超, 何雅玲, 王勇 2005 工程热 26 912]
[2] Cao B Y, Chen M, Guo Z Y 2006 Acta Phys. Sin. 55 5305 (in Chinese) [曹炳阳, 陈民, 过增元 2006 55 5305]
[3] Chang-Hwan Choi, Westin K A, Breuer K S 2003 Physics of Fluids 15 2897
[4] Zhang J F, Daniel Y Kwok 2004 Phys. Rev. E 70 056701
[5] SalilGogte, PeterVorobieff, Richard Truesdell 2005 Physics of Fluids 17 051701
[6] David M Huang, Christian Sendner, Dominik Horinek 2008 Phys. Rev. Lett. 101 226101
[7] Cao B Y, Sun J, Chen M 2009 International Journal of Molecular Sciences 10 4638
[8] Cao B Y, Chen M, Guo Z Y 2006 Phys. Rev. E 74 066311
[9] NishanthDongari 2011 Chemical Engineering and Processing: Process Intensification 50 450
[10] Toru Yamada, Chungpyo Hong, Otto J Gregory 2011 MicrofluidNanofluid 11 45
[11] Huang H B, Lee T S, Shu C 2007 International Journal of NumericalMethods for Heat m& Fluid Flow 17 587
[12] Zeng J B, Li L J, Liao Q 2010 Acta Phys. Sin. 59 178 (in Chinese) [曾建邦, 李隆键, 廖全 2010 59 178]
[13] Shi Z Y, Hu G H, Zhou Z W 2010 Acta Phys. Sin. 59 2595 (in Chinese) [石自媛, 胡国辉, 周哲玮 2010 59 2595]
[14] J Harting, C Kunert, H J Herrmann 2006 Europhys. Lett. 75 328
[15] Chen Y Y, Yi H H, Li H B 2008 Chin. Phys. Lett. 25 184
[16] Zhang R L, Di Q F, Wang X L 2012 Journal of Hydrodunamics 24 535
[17] P L Bhatnagar, E P Gross, M Krook 1954 Phys. Rev. 94 511
[18] Shan X W, Chen H D 1993 Phys. Rev. E 47 1815
[19] Shan X W, Chen H D 1994 Phys. Rev. E 49 2941
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[1] Xu C, He Y L, Wang Y 2005 Journal of Engineering Thermophysics 26 912 (in Chinese) [徐超, 何雅玲, 王勇 2005 工程热 26 912]
[2] Cao B Y, Chen M, Guo Z Y 2006 Acta Phys. Sin. 55 5305 (in Chinese) [曹炳阳, 陈民, 过增元 2006 55 5305]
[3] Chang-Hwan Choi, Westin K A, Breuer K S 2003 Physics of Fluids 15 2897
[4] Zhang J F, Daniel Y Kwok 2004 Phys. Rev. E 70 056701
[5] SalilGogte, PeterVorobieff, Richard Truesdell 2005 Physics of Fluids 17 051701
[6] David M Huang, Christian Sendner, Dominik Horinek 2008 Phys. Rev. Lett. 101 226101
[7] Cao B Y, Sun J, Chen M 2009 International Journal of Molecular Sciences 10 4638
[8] Cao B Y, Chen M, Guo Z Y 2006 Phys. Rev. E 74 066311
[9] NishanthDongari 2011 Chemical Engineering and Processing: Process Intensification 50 450
[10] Toru Yamada, Chungpyo Hong, Otto J Gregory 2011 MicrofluidNanofluid 11 45
[11] Huang H B, Lee T S, Shu C 2007 International Journal of NumericalMethods for Heat m& Fluid Flow 17 587
[12] Zeng J B, Li L J, Liao Q 2010 Acta Phys. Sin. 59 178 (in Chinese) [曾建邦, 李隆键, 廖全 2010 59 178]
[13] Shi Z Y, Hu G H, Zhou Z W 2010 Acta Phys. Sin. 59 2595 (in Chinese) [石自媛, 胡国辉, 周哲玮 2010 59 2595]
[14] J Harting, C Kunert, H J Herrmann 2006 Europhys. Lett. 75 328
[15] Chen Y Y, Yi H H, Li H B 2008 Chin. Phys. Lett. 25 184
[16] Zhang R L, Di Q F, Wang X L 2012 Journal of Hydrodunamics 24 535
[17] P L Bhatnagar, E P Gross, M Krook 1954 Phys. Rev. 94 511
[18] Shan X W, Chen H D 1993 Phys. Rev. E 47 1815
[19] Shan X W, Chen H D 1994 Phys. Rev. E 49 2941
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