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Wang Sheng, Chen Jing-Jing, Weng Sheng-Bin. Investigation into movable dislocation evolution feature and strengthening effect for metal twin Al from atomic perspective. Acta Physica Sinica,
2022, 71(2): 029601.
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2020, 69(3): 036201.
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Zhou Liang-Fu, Zhang Jing, He Wen-Hao, Wang Dong, Su Xue, Yang Dong-Yang, Li Yu-Hong. The nucleation and growth of Helium hubbles at grain boundaries of bcc tungsten: a molecular dynamics simulation. Acta Physica Sinica,
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Wang Zhi-Gang, Huang Rao, Wen Yu-Hua. Melting behavior of Au-Pd eutectic nanoparticle: A molecular dynamics study. Acta Physica Sinica,
2012, 61(16): 166102.
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Ma Wen, Zhu Wen-Jun, Chen Kai-Guo, Jing Fu-Qian. Molecular dynamics investigation of shock front in nanocrystalline aluminum: grain boundary effects. Acta Physica Sinica,
2011, 60(1): 016107.
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Chen Gu-Ran, Song Chao, Xu Jun, Wang Dan-Qing, Xu Ling, Ma Zhong-Yuan, Li Wei, Huang Xin-Fan, Chen Kun-Ji. Molecular dynamics simulations of pulsed laser crystallization of amorphous silicon ultrathin films. Acta Physica Sinica,
2010, 59(8): 5681-5686.
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Zhao Xue-Chuan, Liu Xiao-Ming, Gao Yuan, Zhuang Zhuo. Molecular dynamical investigation on plastic behavior of Cu(100) twist-grain boundary under shear load. Acta Physica Sinica,
2010, 59(9): 6362-6368.
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Ma Ying, Chen Shang-Da, Xie Guo-Feng. Variable charge molecular dynamics simulations of the intergranular films in SiC. Acta Physica Sinica,
2009, 58(11): 7792-7796.
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Zhou Nai-Gen, Zhou Lang. Prevention of misfit dislocations by using nano pillar crystal array substrates. Acta Physica Sinica,
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2006, 55(9): 4767-4773.
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Zhang Chao, Wang Yong-Liang, Yan Chao, Zhang Qing-Yu. Numerical simulation of the influence of substitutional impurity on the interaction between low-energy Pt atoms and Pt(111) surface. Acta Physica Sinica,
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Zhou Nai-Gen, Zhou Lang. Conditions for formation of misfit dislocation in epitaxial films — a molecular dynamics study. Acta Physica Sinica,
2005, 54(7): 3278-3283.
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Zhang Lin, Wang Shao-Qing, Ye Heng-Qiang. Molecular dynamics study of the structure changes in a high-angle Cu grain boundary by heating and quenching. Acta Physica Sinica,
2004, 53(8): 2497-2502.
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