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By using molecular dynamics with EAM potential, yield strength of copper column with (100) twist grain boundary and twist grain boundary effect are investigated under shear load. The results reveal that dislocations nucleate at the misfit dislocation network of low-angle twist grain boundary and dislocations stacking influence the yield strength of copper column. For high-angle twist grain boundary, twist grain boundary sliding decreases the yield stress of copper column. Meanwhile it is found that, with increasing twist angle, copper column yielding strength increases firstly. When twist angle reaches the critical value, the yielding strength decreases with increasing twist angle. It is concluded that different mechanisms mediate the yielding of copper column. Dislocation nucleation controls the yield stress of copper column for low-angle twist grain boundary and yielding of copper column is dominated by grain boundary sliding for high-angle twist grain boundary.
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Keywords:
- twist grain boundary /
- molecular dynamics /
- dislocation nucleation /
- grain boundary sliding
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[18] Liu X M, Liu Z L, You X, Nie J F, Zhuang Z 2009 Chin. Phys. Lett. 26 026103
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[20] Li J, Van Vliet K, Zhu T, Yip S, Suresh S 2002 Nature 418 307
[21] Liu X M 2008 Ph. D. Dissertation (Beijing: Tsinghua University) (in Chinese) [刘小明 2008 博士学位论文(北京:清华大学)]
[22] Schonfelder B, Gottstein G, Shvindlerman L S 2005 Acta Mater. 53 1597
[23] Zhang J M, Xu K W, Zhang M R 2003 Acta Phys. Sin. 52 1207(in Chinese)[张建民、 徐可为、 张美荣 2003 52 1207]
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[1] Wan L, Wang S 2009 Modelling Simul. Mater. Sci. Eng. 17 045008
[2] Shan Z, Stach E A, Wiezorek J M K, Knapp J A, Follstaedt D M, Mao S X 2004 Science 305 654
[3] Wang R S, Hou H Y, Chen G L 2009 Acta Metall. Sin. 45 692 (in Chinese)[王荣山、侯怀宇、陈国良 2009 金属学报 45 692]
[4] Qi Y, Krajewski P E 2007 Acta Mater. 55 1555
[5] Zhao J Z, Liu J, Zhao Y, Hu Z Q 2007 Acta Phys. Sin. 56 443(in Chinese)[赵九洲、刘 俊、赵 毅、胡壮麒 2007 56 443]
[6] Liu Z L, You X C, Zhuang Z 2008 Int. J. Solids Struct. 45 3674
[7] Liu Z L, Liu X M, Zhuang Z, You X C 2009 Scripta Mater. 60 594
[8] Liu Z L, Liu X M, Zhuang Z, Gao Y, You X C 2009 Int. J. Multiscale Comput. Eng. 7 217
[9] Liu Z L, Liu X M, Zhuang Z, You X C 2009 Int. J. Plast. 25 1436
[10] Koning M D, Miller R, Bulatov V V, Abraham F F 2002 Philos. Mag. A 82 2511
[11] Zhou N G, Zhou L 2005 Acta Phys. Sin. 54 3278 (in Chinese)[周耐根、 周 浪 2005 54 3278]
[12] Cao A J, Wei Y G 2007 J. Appl. Phys. 102 083511
[13] Cao A J, Wei Y, Ma E 2008 Phys. Rev. B 77 195429
[14] Tschopp M A, Mcdowell D L 2008 J. Mech. Phys. Solids 56 1806
[15] Liu X M, You X C, Liu Z L, Nie J F, Zhuang Z 2009 Acta Phys. Sin. 58 1849(in Chinese)[刘小明、 由小川、 柳占立、 聂君峰、 庄 茁 2009 58 1849]
[16] Liu X M, You X, Liu Z L, Nie J F, Zhuang Z 2009 J. Phys. D 42 035404
[17] Liu X M, Liu Z L, You X, Nie J F, Zhuang Z 2009 Mord. Phys. Lett. B 23 1871
[18] Liu X M, Liu Z L, You X, Nie J F, Zhuang Z 2009 Chin. Phys. Lett. 26 026103
[19] Ma X L, Yang W 2003 Nanotech. 14 1208
[20] Li J, Van Vliet K, Zhu T, Yip S, Suresh S 2002 Nature 418 307
[21] Liu X M 2008 Ph. D. Dissertation (Beijing: Tsinghua University) (in Chinese) [刘小明 2008 博士学位论文(北京:清华大学)]
[22] Schonfelder B, Gottstein G, Shvindlerman L S 2005 Acta Mater. 53 1597
[23] Zhang J M, Xu K W, Zhang M R 2003 Acta Phys. Sin. 52 1207(in Chinese)[张建民、 徐可为、 张美荣 2003 52 1207]
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