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In order to reduce the number of numerical meshes and simplify aperture array modeling, an equivalent method of modeling aperture array in which the size effect of apertures is taken into account, is presented in the paper. In this method, the aperture array is replaced by a single aperture which has the same area as the original aperture array, then the scaling factor of the aperture is obtained according to the number of apertures. The empirical relations between the number of apertures and scaling factor are proposed based on theoretical derivation and curve fitting method respectively. The comparison with the commercial software HFSS indicates that the formula based on curve fitting method has a higher accuracy. The applicability of the method is verified by varying the interference source, monitoring point, total area and position of aperture array, shape of aperture and cavity size. As shown by the numerical results, the equivalent modeling approach can significantly reduce the number of meshes, which can serve as a simplified approach to numerical simulation of shielding characteristics of complex cavity.
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Keywords:
- electromagnetic shielding /
- aperture array /
- size effect /
- equivalent modeling
[1] Araneo R, Lovat G 2009 IEEE Trans. Electromagn. Compat. 51 274
[2] Fan J Q, Hao J H, Qi P H 2014 Acta Phys. Sin. 63 014104 (in Chinese) [范杰清, 郝建红, 柒培华 2014 63 014104]
[3] Jiao C Q, Zhu H Z 2013 Chin. Phys. B 22 084101
[4] Jiao C Q, Niu S 2013 Acta Phys. Sin. 62 114102 (in Chinese) [焦重庆, 牛帅 2013 62 114102]
[5] Dehkhoda P, Tavakoli A, Azadifar M 2012 IEEE Trans. Electromagn. Compat. 54 792
[6] Jiao C Q, Qi L 2012 Acta Phys. Sin. 61 134104 (in Chinese) [焦重庆, 齐磊 2012 61 134104]
[7] Zhou G Q 2011 Chin. Phys. B 20 074203
[8] Ali K M, Dehkhoda P, Mazandaran R M, Hesamedin S H 2010 IEEE Trans. Electromagn. Compat. 52 230
[9] Liao X, Ren X Z, Zhou Z G 2008 Acta Phys. Sin. 57 3949 (in Chinese) [廖旭, 任学藻, 周自刚 2008 57 3949]
[10] Bethe H A 1944 Phys. Rev. 66 163
[11] Mendez H A 1978 IEEE Trans. Electromagn. Compat. 20 296
[12] Robinson M P, Benson T M, Christopoulos C, Dawson J F, Ganley M D, Marvin A C, Porter S J, Thomas D W 1998 IEEE Trans. Electromagn. Compat. 40 240
[13] Li M, Nuebel J, Drewniak J L, Hubing T H, DuBroff R E, Doren T P 2000 IEEE Trans. Electromagn. Compat. 42 29
[14] Shi Z, Du P A 2009 Acta Elec. Sin. 37 634 (in Chinese) [石峥, 杜平安 2009 电子学报 37 634]
[15] Nie B L, Du P A, Yu Y T, Shi Z 2011 IEEE Trans. Electromagn. Compat. 53 73
[16] Khan Z A, Bunting C F, Manohar D 2005 IEEE Trans. Electromagn. Compat. 47 112
[17] Dehkhoda P, Tavakoli A, Moini R 2008 IEEE Trans. Electromagn. Compat. 50 208
[18] Ren D, Du P A 2012 IEEE Int. Conf. on Mechatronics and Automation Chengdu, August 6-8, 2012 p843
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[1] Araneo R, Lovat G 2009 IEEE Trans. Electromagn. Compat. 51 274
[2] Fan J Q, Hao J H, Qi P H 2014 Acta Phys. Sin. 63 014104 (in Chinese) [范杰清, 郝建红, 柒培华 2014 63 014104]
[3] Jiao C Q, Zhu H Z 2013 Chin. Phys. B 22 084101
[4] Jiao C Q, Niu S 2013 Acta Phys. Sin. 62 114102 (in Chinese) [焦重庆, 牛帅 2013 62 114102]
[5] Dehkhoda P, Tavakoli A, Azadifar M 2012 IEEE Trans. Electromagn. Compat. 54 792
[6] Jiao C Q, Qi L 2012 Acta Phys. Sin. 61 134104 (in Chinese) [焦重庆, 齐磊 2012 61 134104]
[7] Zhou G Q 2011 Chin. Phys. B 20 074203
[8] Ali K M, Dehkhoda P, Mazandaran R M, Hesamedin S H 2010 IEEE Trans. Electromagn. Compat. 52 230
[9] Liao X, Ren X Z, Zhou Z G 2008 Acta Phys. Sin. 57 3949 (in Chinese) [廖旭, 任学藻, 周自刚 2008 57 3949]
[10] Bethe H A 1944 Phys. Rev. 66 163
[11] Mendez H A 1978 IEEE Trans. Electromagn. Compat. 20 296
[12] Robinson M P, Benson T M, Christopoulos C, Dawson J F, Ganley M D, Marvin A C, Porter S J, Thomas D W 1998 IEEE Trans. Electromagn. Compat. 40 240
[13] Li M, Nuebel J, Drewniak J L, Hubing T H, DuBroff R E, Doren T P 2000 IEEE Trans. Electromagn. Compat. 42 29
[14] Shi Z, Du P A 2009 Acta Elec. Sin. 37 634 (in Chinese) [石峥, 杜平安 2009 电子学报 37 634]
[15] Nie B L, Du P A, Yu Y T, Shi Z 2011 IEEE Trans. Electromagn. Compat. 53 73
[16] Khan Z A, Bunting C F, Manohar D 2005 IEEE Trans. Electromagn. Compat. 47 112
[17] Dehkhoda P, Tavakoli A, Moini R 2008 IEEE Trans. Electromagn. Compat. 50 208
[18] Ren D, Du P A 2012 IEEE Int. Conf. on Mechatronics and Automation Chengdu, August 6-8, 2012 p843
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