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In recent years, with the rapid development of electronic technology and digital network information, copper has increasing applications in micro-electronics, micro-electro-mechanical systems and Hi-tech materials. However copper has its material limitations. In particular, it has relatively low hardness, high oxidation and wear rate, which have severely restricted its widespread applications. In this paper, aiming at difficulties of copper applications, Ti/TiC/DLC has been proposed as functionally graded material to deposit on the copper substrate with plasma depositing method, which intensifies the adhesion between DLC film and copper substrate and improves the properties of copper. The maximal value of thermal conductivity of DLC film with optimized parameter of graded intermediate layer is 3.63 Wm-1.K-1, which enhances the heat transfer effect of copper substrate.
[1] Zhang J C, Zhou Z G, Yang W B 2006 Computer Eng. Appl. 3493 (in Chinese) [张建臣, 周智刚, 杨文彬 2006计算机工程与应用 34 93]
[2] Bejan A, Tsataronis G, Moran K 1996 Thermal Design and Optimization(New York: John Wiley & Sons Inc) p132
[3] Yu X L, Feng J M, Feng Q K, Wang Q W 2005 Appl. ThermalEng. 25 173
[4] Han N 2000 J. Xidian Univ. 29 24 (in Chinese) [韩宁 2000 西安电子科技大学学报 29 24]
[5] Kim K S, Won M H, Kim J W, Back B J 2003 Appl. Thermal Eng.23 1137
[6] Yu P 2003 J. Eng. Thermophys. 24 87 (in Chinese) [余鹏 2003 工程热 24 87]
[7] Zhang L, Qu X H, He X B, Duan B H, Ren S B, Qin M L 2008Mater. Sci. Eng. A 489A 285
[8] Oguri K, Arai T 1990 J. Mater. Res. 5 2567
[9] Kading O W, Skurk H, Goodson K E 1994 Appl. Phys. Lett. 651629
[10] Wang J, Liu G C, Wang L D, Deng X L, Xu J 2008 Chin. Phys. B17 3108
[11] Liu D P, Liu Y H, Chen B X 2006 Chin. Phys. 15 575
[12] Xiao J R, Xu H, Guo A M, Wang H Y 2007 Acta Phys. Sin. 561802 (in Chinese) [肖剑荣,徐慧, 郭爱敏, 王焕友 2007 56 1802]
[13] Ding X Z, Tay B K, Tan H S, Lau P S, Cheung W Y, Wong S P2001 Surf. Coat. Technol. 138 301
[14] Delplancke-Ogletree M P, Monteiro O R 1997 J. Vac. Sci. Technol.A 15 1943
[15] Li L H, Zhang H Q, Cui X M, Zhang Y H, Xia L F, Ma X X, SunY 2001 Acta Phys. Sin. 50 1549 (in Chinese) [李刘和,张海泉, 崔旭明, 张彦华, 夏立芳, 马欣新, 孙跃 2001 50 1549]
[16] Dillon R O, Woollam J, Katkanant V 1984 Phys. Rev. B 29 3482
[17] Das D, Chen K H, Chattopadhyay S, Chen L C 2002 J. Appl. Phys.91 4944
[18] Erdemir A, Bindal C, Fenske G R, Zuiker C, Wilbur P 1996 Surf.Coat. Technol. 86-87 692
[19] Zhang Z Y, Lu X C, Luo J B, Shao T M, Qing T, Zhang C H 2006Chin. Phys. 15 2697
[20] Wang L S 2003 Special Ceramics (Changsha: Central South Universityof Technology Press) 295 (in Chinese) [王零森2003 特种陶瓷 (长沙:中南工业大学出版社) 295]
[21] Shamsa M, Liu W L, Balandin A A 2006 Appl. Phys. Lett. 89161921
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[1] Zhang J C, Zhou Z G, Yang W B 2006 Computer Eng. Appl. 3493 (in Chinese) [张建臣, 周智刚, 杨文彬 2006计算机工程与应用 34 93]
[2] Bejan A, Tsataronis G, Moran K 1996 Thermal Design and Optimization(New York: John Wiley & Sons Inc) p132
[3] Yu X L, Feng J M, Feng Q K, Wang Q W 2005 Appl. ThermalEng. 25 173
[4] Han N 2000 J. Xidian Univ. 29 24 (in Chinese) [韩宁 2000 西安电子科技大学学报 29 24]
[5] Kim K S, Won M H, Kim J W, Back B J 2003 Appl. Thermal Eng.23 1137
[6] Yu P 2003 J. Eng. Thermophys. 24 87 (in Chinese) [余鹏 2003 工程热 24 87]
[7] Zhang L, Qu X H, He X B, Duan B H, Ren S B, Qin M L 2008Mater. Sci. Eng. A 489A 285
[8] Oguri K, Arai T 1990 J. Mater. Res. 5 2567
[9] Kading O W, Skurk H, Goodson K E 1994 Appl. Phys. Lett. 651629
[10] Wang J, Liu G C, Wang L D, Deng X L, Xu J 2008 Chin. Phys. B17 3108
[11] Liu D P, Liu Y H, Chen B X 2006 Chin. Phys. 15 575
[12] Xiao J R, Xu H, Guo A M, Wang H Y 2007 Acta Phys. Sin. 561802 (in Chinese) [肖剑荣,徐慧, 郭爱敏, 王焕友 2007 56 1802]
[13] Ding X Z, Tay B K, Tan H S, Lau P S, Cheung W Y, Wong S P2001 Surf. Coat. Technol. 138 301
[14] Delplancke-Ogletree M P, Monteiro O R 1997 J. Vac. Sci. Technol.A 15 1943
[15] Li L H, Zhang H Q, Cui X M, Zhang Y H, Xia L F, Ma X X, SunY 2001 Acta Phys. Sin. 50 1549 (in Chinese) [李刘和,张海泉, 崔旭明, 张彦华, 夏立芳, 马欣新, 孙跃 2001 50 1549]
[16] Dillon R O, Woollam J, Katkanant V 1984 Phys. Rev. B 29 3482
[17] Das D, Chen K H, Chattopadhyay S, Chen L C 2002 J. Appl. Phys.91 4944
[18] Erdemir A, Bindal C, Fenske G R, Zuiker C, Wilbur P 1996 Surf.Coat. Technol. 86-87 692
[19] Zhang Z Y, Lu X C, Luo J B, Shao T M, Qing T, Zhang C H 2006Chin. Phys. 15 2697
[20] Wang L S 2003 Special Ceramics (Changsha: Central South Universityof Technology Press) 295 (in Chinese) [王零森2003 特种陶瓷 (长沙:中南工业大学出版社) 295]
[21] Shamsa M, Liu W L, Balandin A A 2006 Appl. Phys. Lett. 89161921
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