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Chen Jing-Jing, Qiu Xiao-Lin, Li Ke, Zhou Dan, Yuan Jun-Jun. Mechanical performance analysis of nanocrystalline CoNiCrFeMn high entropy alloy: atomic simulation method. Acta Physica Sinica,
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Xu Shan-Sen, Chang Jian, Wu Yu-Hao, Sha Sha, Wei Bing-Bo. Rapid solidification mechanism of liquid quinary Ni-Zr-Ti-Al-Cu alloy investigated by high-speed cinematography. Acta Physica Sinica,
2019, 68(19): 196401.
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2019, 68(1): 016101.
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Gu Qian-Qian, Ruan Ying, Dai Fu-Ping. Rapid solidification mechanism of Fe-Al-Nb alloy droplet and its influence on microhardness under microgravity condition. Acta Physica Sinica,
2017, 66(10): 106401.
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2017, 66(4): 047201.
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Li Rui, Zuo Xiao-Wei, Wang En-Gang. Microstructure, resistivity, and hardness of aged Ag-7wt.%Cu alloy. Acta Physica Sinica,
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2017, 66(13): 138101.
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Xia Zhen-Chao, Wang Wei-Li, Luo Sheng-Bao, Wei Bing-Bo. Rapid solidification mechanism and magnetic property of ternary equiatomic Fe33.3Cu33.3Sn33.3 alloy. Acta Physica Sinica,
2016, 65(15): 158101.
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2016, 65(7): 077101.
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2014, 63(13): 136801.
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Wang Xiao-Juan, Ruan Ying, Hong Zhen-Yu. Thermophysical properties and rapid solidification of Al-Cu-Ge alloys. Acta Physica Sinica,
2014, 63(9): 098101.
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Lu Xiao-Yu, Liao Shuang, Ruan Ying, Dai Fu-Ping. Phase constitution and microstructure evolution of rapidly solidified Ti-Cu-Fe alloy. Acta Physica Sinica,
2012, 61(21): 216102.
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Chen Yan, Liu Lin, Liu Jian-Hua, Zhang Rui-Jun. Effect of high pressure treatment on microstructure and resistivity of Cu75.15Al24.85 alloy. Acta Physica Sinica,
2012, 61(17): 176103.
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Li Zhi-Qiang, Wang Wei-Li, Zhai Wei, Wei Bing-Bo. Formation mechanism of layered microstructure and monotectic cell within rapidly solidified Fe62.1Sn27.9Si10 alloy. Acta Physica Sinica,
2011, 60(10): 108101.
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Yan Na, Wang Wei-Li, Dai Fu-Ping, Wei Bing-Bo. Microstructure formation mechanism of rapidly solidified ternary Co-Cu-Pb monotectic alloys. Acta Physica Sinica,
2011, 60(3): 036402.
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2009, 58(1): 638-643.
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Yin Han-Yu, Lu Xiao-Yu. Rapid solidification of undercooled Cu60Sn30Pb10 monotectic alloy. Acta Physica Sinica,
2008, 57(7): 4341-4346.
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2007, 56(10): 6118-6123.
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Xu Jin-Feng, Wei Bing-Bo. Electrical property of rapidly solidified Co-Cu peritectic alloys. Acta Physica Sinica,
2005, 54(7): 3444-3450.
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Wang Yuan, Xu Ke-Wei. Cu-W Thin film characterized by surface fractal and resistivity. Acta Physica Sinica,
2004, 53(3): 900-904.
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