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The heat dissipation capability of the slow-wave structure (SWS) of the traveling-wave tube (TWT) is an important influencing factor that restricts the increase of the output power, the stability, and the reliability. Due to several unique and fascinating characteristics, the diamond material has been employed in the SWS manufacture to enhance the thermal conduction to a certain extent. The influences of the supporting rods deposited with diamond film, the helix deposited with diamond film, and the diamond supporting rods on the heat dissipation capability have been studied using theoretical, simulation, and experimental methods. This method is closely associated with the computer simulation in experimental test and increases the simulation accuracy. Valuable conclusions have been obtained.
[1] Gerum W, Bruck M, Fischer G, Henry D, Rothacker H P 2005 IEEETrans. on ED 52 669
[2] Liao F J 1999 Vacuum Electronics (Beijing: Electronics Industry Press) (in Chinese) [廖复疆 1999 (北京: 电子工业出版社)]
[3] Theiss A J, Meadows C J, True P B 2007 IEEE Trans. on ED 54 1054
[4] Ghosh T K, Challis A J, Jacob A, Bowler D, Carter R G 2008 IEEETrans. on ED 55 668
[5] Han Y, Liu Y W, Ding Y G, Liu P K 2009 Acta Phys. Sin. 58 1806 (in Chinese) [韩勇, 刘燕文, 丁耀根, 刘濮鲲 2009 58 1806]
[6] Crivello R, Richard W, Grow R 1988 IEEE Trans. on ED 35 1701
[7] Wei P,Zhou M G,Zhu L,Zhang J 2013 Acta Phys. Sin. 62 317 (in Chinese) [韦朴, 周明干, 朱露, 张劲 2013 62 317]
[8] Liu Y W, HanY 2011 J. Vac. Sci. Technol. 31 424 (in Chinese) [刘燕文,韩勇 2011 真空科学与技术学报 31 424]
[9] Xu X, Wei Y Y, Shen Fi, Huang M Z, Tang T, Duan Z Y, Gong Y B 2012 Chin. Phys. B 21 068402
[10] Gu S S, Hu X J, Huang K 2013 Acta Phys. Sin. 62 512 (in Chinese) [顾珊珊, 胡晓君, 黄凯 2013 62 512]
[11] Gotis Y G, Welz S, Ersoy D 2001 Nature 411 283
[12] Graebner J E, Hartnett T M, Miller R P 1994 Appl. Phys. Lett. 64 2549
[13] Zhang P Z, Li R S, Pan X J, Xie E Q 2013 Chin. Phys. B 22 058106
[14] Galdetskiy A V 2004 International Vacuum Electronics Conference 51
[15] Chang X, Wu Q, Ben-Zvi L, Burrill A 2010 Phys. Rev. Lett. 105 164801
[16] Dayton J A, Mearini G T, Chen H 2005 IEEE Trans. on ED 52 695
[17] Liu Y W, Han Y 2010 Chin. Patent 200710064600.4 (in Chinese) [刘燕文, 韩勇 2010 中国发明专利200710064600.4]
[18] Liu Y W, HanY, Zhao L 2009 Acta Electr. Sin. 316 1757 (in Chinese) [刘燕文, 韩勇, 赵丽 2009 电子学报 316 1757]
[19] Dai G S 2001 Heat Transfer (Beijing: Higher Education Press) (in Chinese) [戴锅生 2001 传热学 (北京: 高等教育出版社)]
[20] Gu C Z, Wang C L, Jin Z S 1994 Chin. Sci. Bulletion 39 93 (in Chinese) [顾长志, 王春蕾, 金曾孙 1994 科学通报 39 93]
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[1] Gerum W, Bruck M, Fischer G, Henry D, Rothacker H P 2005 IEEETrans. on ED 52 669
[2] Liao F J 1999 Vacuum Electronics (Beijing: Electronics Industry Press) (in Chinese) [廖复疆 1999 (北京: 电子工业出版社)]
[3] Theiss A J, Meadows C J, True P B 2007 IEEE Trans. on ED 54 1054
[4] Ghosh T K, Challis A J, Jacob A, Bowler D, Carter R G 2008 IEEETrans. on ED 55 668
[5] Han Y, Liu Y W, Ding Y G, Liu P K 2009 Acta Phys. Sin. 58 1806 (in Chinese) [韩勇, 刘燕文, 丁耀根, 刘濮鲲 2009 58 1806]
[6] Crivello R, Richard W, Grow R 1988 IEEE Trans. on ED 35 1701
[7] Wei P,Zhou M G,Zhu L,Zhang J 2013 Acta Phys. Sin. 62 317 (in Chinese) [韦朴, 周明干, 朱露, 张劲 2013 62 317]
[8] Liu Y W, HanY 2011 J. Vac. Sci. Technol. 31 424 (in Chinese) [刘燕文,韩勇 2011 真空科学与技术学报 31 424]
[9] Xu X, Wei Y Y, Shen Fi, Huang M Z, Tang T, Duan Z Y, Gong Y B 2012 Chin. Phys. B 21 068402
[10] Gu S S, Hu X J, Huang K 2013 Acta Phys. Sin. 62 512 (in Chinese) [顾珊珊, 胡晓君, 黄凯 2013 62 512]
[11] Gotis Y G, Welz S, Ersoy D 2001 Nature 411 283
[12] Graebner J E, Hartnett T M, Miller R P 1994 Appl. Phys. Lett. 64 2549
[13] Zhang P Z, Li R S, Pan X J, Xie E Q 2013 Chin. Phys. B 22 058106
[14] Galdetskiy A V 2004 International Vacuum Electronics Conference 51
[15] Chang X, Wu Q, Ben-Zvi L, Burrill A 2010 Phys. Rev. Lett. 105 164801
[16] Dayton J A, Mearini G T, Chen H 2005 IEEE Trans. on ED 52 695
[17] Liu Y W, Han Y 2010 Chin. Patent 200710064600.4 (in Chinese) [刘燕文, 韩勇 2010 中国发明专利200710064600.4]
[18] Liu Y W, HanY, Zhao L 2009 Acta Electr. Sin. 316 1757 (in Chinese) [刘燕文, 韩勇, 赵丽 2009 电子学报 316 1757]
[19] Dai G S 2001 Heat Transfer (Beijing: Higher Education Press) (in Chinese) [戴锅生 2001 传热学 (北京: 高等教育出版社)]
[20] Gu C Z, Wang C L, Jin Z S 1994 Chin. Sci. Bulletion 39 93 (in Chinese) [顾长志, 王春蕾, 金曾孙 1994 科学通报 39 93]
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