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Y2O3-TiO2 composite film were deposited on Si substrate at room temperature by means of radio frequency magnetron sputtering. The crystalline state and topography of the film before and after annealing were measured by XRD and AFM, and the mechanism of the film being more compact was discussed. The result revealed that the evenness and compactness of the film can be improved with increasing the sputtering power, which is due to the fact of more Y2O3 filling the pores around TiO2with raising sputtering power, which inhibited the growth of big TiO\-2 grains and improved the evenness and compactness of film. After annealing, XRD pattern indicated that the addition of Y2O3 favors the formation of rutile TiO2 film which has high-dielectric constant.
[1] Mikhelashvili V, Eisenstein G 2001 Microelectronics Reliability 41 1057
[2] Suhail M H, Mohan Rao G, Mohan 1992 J. Appl. Phys. 71 1421
[3] Hu Z G, Li W W, Wu J D, Sun J, Shu Q W, Zhong X X, Zhu Z Q, Chu J H 2008 Appl. Phys. Lett. 93 181910-1
[4] Zhang M, Lin G Q, Dong C, Wen L S 2007 Acta Phys. Sin. 56 7300 (in Chinese)[张敏、林国强、董 闯、闻立时 2007 56 7300]
[5] Gassim G, Alkhateeb N, Hussein H 2007 Desalination 209 342
[6] Meulen T, Mattson A, Osterlund L 2007 Journal of Catalysis 251 131
[7] Wang H, Wu Y, Xu B Q 2005 Applied Catalysis B: Environmental 59 139
[8] Weinberger B R, Garber R B 1994 Appl. Phys. Lett. 66 2409
[9] Wang S F, Hsu Y F, Lee Y S 2006 Ceramics International 32 121
[10] Okimura K, Maeda N, Shibata A 1996 Thin Solid Films 281 427
[11] Tang H, Parasad K, Sanjines R, Schmid P E, Levy F 1994 J. Appl. Phys. 75 2042
[12] Albertin K F, Pereyra I 2009 Thin Solid Films 517 4548
[13] Kadoshima M, Hiratani M, Shimamoto Y, Torii K, Miki H, Kimura S, Nabatame T 2003 Thin Solid Films 424 224
[14] Song G B, Liu F S, Peng T J, Liang J K, Rao G H 2002 Acta Phys. Sin. 51 2793 (in Chinese)[宋功保、刘福生、彭同江、梁敬魁、饶光辉 2002 51 2793]
[15] Tang J Y 2001 Acta Phys. Sin. 50 2198 (in Chinese) [唐俊勇 2001 50 2198]
[16] Cui Y F, Yuan Z H 2005 Acta Phys. Sin. 55 5172 (in Chinese) [崔永峰、袁志好 2005 55 5172]
[17] Wang S F, Hsu Y F, Lee R L, Lee Y S 2004 Applied Surface Science 229 140
[18] Granta C D, Schwartzberga A M, Smestadb G P, Kowalik J, Tolbert L M, Zhang J Z 2003 Synthetic Metals 132 197
[19] Smestada G P, Spiekermannb S, Kowalik J, Granta C D, Schwartzberga A M, Zhang J, Tolbert L M, Moons E 2003 Solar Energy Materials & Solar Cells 76 85
[20] Saito Y, Kitamura T, Wada Y J, Yanagida S 2002 Synthetic Metals 131 185
[21] Li B, Wang L D, Zhang D Q, Qiu Y 2003 Chinese Science Bulletin 48 22 (in Chinese) [李 斌、王立铎、张德强、邱 勇 2003 科学通报 48 22]
[22] Zhang W J, Zhu S L, Li Y, Wang F H, He H B 2009 Plating & Finishing 31 3 (in Chinese)[张文杰、朱圣龙、李 瑛、王福会、何红波 2009 电镀与精饰 31 3]
[23] Raghavan D, Gu X, Nguyen T, VanLandingham M, Karim A 2000 Macromelecules 33 2573
[24] Zhu C F, Wang C 2007 Scanning probe microscopy application progress(Binjing: chemical industry press)p5 (in Chinese) [朱传风、王琛著 2007扫描探针显微术应用进展(北京:化学工业出版社)第5页]
[25] Zhang W J, Wang K L, Zhu S L, Li Y, Wang F H, He H B 2009 Chemicsl Engineering Journal 155 83
[26] Huo H B, Liu Z T, Yan F, 2008 Materials Review 22 123 (in Chinese) [霍会宾、刘正堂、阎 锋2008材料导报22 123]
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[1] Mikhelashvili V, Eisenstein G 2001 Microelectronics Reliability 41 1057
[2] Suhail M H, Mohan Rao G, Mohan 1992 J. Appl. Phys. 71 1421
[3] Hu Z G, Li W W, Wu J D, Sun J, Shu Q W, Zhong X X, Zhu Z Q, Chu J H 2008 Appl. Phys. Lett. 93 181910-1
[4] Zhang M, Lin G Q, Dong C, Wen L S 2007 Acta Phys. Sin. 56 7300 (in Chinese)[张敏、林国强、董 闯、闻立时 2007 56 7300]
[5] Gassim G, Alkhateeb N, Hussein H 2007 Desalination 209 342
[6] Meulen T, Mattson A, Osterlund L 2007 Journal of Catalysis 251 131
[7] Wang H, Wu Y, Xu B Q 2005 Applied Catalysis B: Environmental 59 139
[8] Weinberger B R, Garber R B 1994 Appl. Phys. Lett. 66 2409
[9] Wang S F, Hsu Y F, Lee Y S 2006 Ceramics International 32 121
[10] Okimura K, Maeda N, Shibata A 1996 Thin Solid Films 281 427
[11] Tang H, Parasad K, Sanjines R, Schmid P E, Levy F 1994 J. Appl. Phys. 75 2042
[12] Albertin K F, Pereyra I 2009 Thin Solid Films 517 4548
[13] Kadoshima M, Hiratani M, Shimamoto Y, Torii K, Miki H, Kimura S, Nabatame T 2003 Thin Solid Films 424 224
[14] Song G B, Liu F S, Peng T J, Liang J K, Rao G H 2002 Acta Phys. Sin. 51 2793 (in Chinese)[宋功保、刘福生、彭同江、梁敬魁、饶光辉 2002 51 2793]
[15] Tang J Y 2001 Acta Phys. Sin. 50 2198 (in Chinese) [唐俊勇 2001 50 2198]
[16] Cui Y F, Yuan Z H 2005 Acta Phys. Sin. 55 5172 (in Chinese) [崔永峰、袁志好 2005 55 5172]
[17] Wang S F, Hsu Y F, Lee R L, Lee Y S 2004 Applied Surface Science 229 140
[18] Granta C D, Schwartzberga A M, Smestadb G P, Kowalik J, Tolbert L M, Zhang J Z 2003 Synthetic Metals 132 197
[19] Smestada G P, Spiekermannb S, Kowalik J, Granta C D, Schwartzberga A M, Zhang J, Tolbert L M, Moons E 2003 Solar Energy Materials & Solar Cells 76 85
[20] Saito Y, Kitamura T, Wada Y J, Yanagida S 2002 Synthetic Metals 131 185
[21] Li B, Wang L D, Zhang D Q, Qiu Y 2003 Chinese Science Bulletin 48 22 (in Chinese) [李 斌、王立铎、张德强、邱 勇 2003 科学通报 48 22]
[22] Zhang W J, Zhu S L, Li Y, Wang F H, He H B 2009 Plating & Finishing 31 3 (in Chinese)[张文杰、朱圣龙、李 瑛、王福会、何红波 2009 电镀与精饰 31 3]
[23] Raghavan D, Gu X, Nguyen T, VanLandingham M, Karim A 2000 Macromelecules 33 2573
[24] Zhu C F, Wang C 2007 Scanning probe microscopy application progress(Binjing: chemical industry press)p5 (in Chinese) [朱传风、王琛著 2007扫描探针显微术应用进展(北京:化学工业出版社)第5页]
[25] Zhang W J, Wang K L, Zhu S L, Li Y, Wang F H, He H B 2009 Chemicsl Engineering Journal 155 83
[26] Huo H B, Liu Z T, Yan F, 2008 Materials Review 22 123 (in Chinese) [霍会宾、刘正堂、阎 锋2008材料导报22 123]
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