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The preparation technology of powder metallurgy is an important way to prepare Bi2Te3-based bulk materials with excellent mechanical properties and thermoelectric properties. However, the loss of sample orientation during the preparation of powder metallurgy results in low thermoelectric properties of the materials. The development of high-performance Bi2Te3-based thermoelectric materials with strong plate texture and fine grains is the focus of research on high-performance Bi2Te3-based thermoelectric materials. In this paper, a series of p-type Bi2Te3-based materials were prepared by vertical corner extrusion preparation technology. The influence of extrusion temperature on the microstructure and texture characteristics of the material and its influence on the thermoelectric properties of the material were systematically studied. During the vertical corner extrusion process, the grain preferentially grows along the minimum resistance direction in the direction perpendicular to the pressure, that is, along the extrusion direction, so that the (00l) texture of the original hot-pressed sample is further enhanced; while in the direction parallel to the pressure, due to the existence of friction with the inner wall of the die during the extrusion process, this frictional resistance will promote the inversion of the grain, so that the grain is arranged in a directional manner to achieve the effect of reducing the frictional resistance, thus forming the (110) texture that is not in the original hot-pressed sample in the extruded sample, and finally completing the surface weaving from the hot-pressed sample The transition of the structure to the plate texture of the extruded sample. When the extrusion temperature is low, the atomic diffusion rate is low, which limits the dynamic recrystallization of the grain, the grain growth process and the grain deflection speed. With the increase of the extrusion temperature, these processes can be carried out rapidly, so a more obvious plate texture characteristic is formed.The 773 K extruded sample achieved high orientation factors of F(00l) = 0.51 and F(110) = 0.30 in the direction perpendicular to the pressure and parallel to the pressure, respectively, and the carrier mobility was as high as 345.4 cm2·V-1·s-1 at room temperature, which was comparable to the zone melt sample and showed excellent electrical transport performance. The power factor reached 4.43 mW·m-1·K-2 at room temperature. At the same time, the sum of lattice thermal conductivity and bipolar thermal conductivity of the 773 K extruded sample decreased to a minimum value of 0.78 W·m-1·K-1 at 323 K. Finally, the 773 K extruded sample obtained a maximum ZT value of 1.13 at 323 K, which was nearly 70 % higher than that of the hot-pressed sample. This research provides a new way for the preparation of high-performance strong plate textures and fine-grained Bi2Te3-based thermoelectric materials, and lays an important foundation for the fabrication of micro thermoelectric devices.
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Keywords:
- vertical angular extrusion preparation technology /
- extrusion temperature /
- microstructure /
- thermoelectric properties
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