Interface-state suppression of AlGaN/GaN Schottky barrier diodes with post-anode-annealing treatment

Wu Peng; Li Ruo-Han; Zhang Tao; Zhang Jin-Cheng; Hao Yue

doi:10.7498/aps.72.20230553

Abstract

Owing to the high density and high mobility of two-dimensional electron gas (2DEG) induced by strong spontaneous polarization and piezoelectric polarization effect, AlGaN/GaN Schottky barrier diodes (SBDs) with high output current density and low on-resistance have proved to be a promising candidate. Anode of GaN SBD is the core structure, which affects the device performance such as turn-on voltage, reverse current, on-resistance, and breakdown voltage. Therefore, idealized Schottky junction with low interface state density is very important in achieving high-performance GaN SBD. In this work, AlGaN/GaN SBD with low work-function metal W as anode is fabricated, and the post-anode-annealing (PAA) treatment is found to be effective in promoting the bonding reaction between anode metal and GaN in the anode region. Comparing with GaN SBDs without PAA treatment, the interface state density decreases from 9.48×10¹⁵ eV^–1·cm^–2 to 1.77×10¹³ eV^–1·cm^–2 after PAA treatment. The reverse leakage current is reduced by two orders, which ascribes to the idealized anode interface with low interface state density. Meanwhile, the influence of interface state on carriers in the forward conduction process is also suppressed, and the differential on-resistance of the fabricated GaN SBDs decreases from 17.05 Ω·mm to 12.57 Ω·mm. It is obvious that the PAA process proves to be an effective method to suppress the interface states density at M/S interface, thus significantly improving the performance of GaN SBD, which is the key technology in fabricating the high-performance GaN device.

Keywords:

Authors and contacts

1.
State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, Xidian University, Xi’an 710071, China
2.
Xi’an Microelectrics Technology Institute, Xi’an 710054, China

Corresponding author: Zhang Tao, zhangtao@xidian.edu.cn ; Zhang Jin-Cheng, jchzhang@xidian.edu.cn ;

Funds: Project supported by the National Natural Science Foundation of China (Grant No. 62104185), the National Science Fund for Distinguished Young Scholars of China (Grant No. 61925404), the Fundamental Research Funds for the Central Universities, China (Grant No. QTZX23076), and the Young Elite Scientists Sponsorship Program by CAST, China (Grant No. 2022QNRC001).

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References

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Cited By

图 1 平面阳极结构AlGaN/GaN SBD器件截面图

Figure 1. Schematic cross-sectional of AlGaN/GaN SBD with planar anode.

DownLoad: Full-Size Img PowerPoint

图 2 PAA SBD与Ref SBD器件的正向导通特性(a)和反向漏电特性(b)

Figure 2. Forward I-V characteristics (a) and reverse I-V characteristics (b) of the fabricated PAA SBD and Ref SBD.

DownLoad: Full-Size Img PowerPoint

图 3 对数坐标下, 器件正向特性随温度的变化　(a) PAA SBD; (b) Ref SBD

Figure 3. Temperature-dependent forward I-V characteristics of devices in semi-log scale: (a) PAA SBD; (b) Ref SBD.

DownLoad: Full-Size Img PowerPoint

图 4 PAA SBD和Ref SBD器件势垒高度随温度的变化

Figure 4. Extracted Schottky barrier height of the fabricated PAA SBD and Ref SBD as a function of the measured temperature.

DownLoad: Full-Size Img PowerPoint

图 5 不同频率下器件的电容随阳极偏压的变化　 (a) PAA SBD; (b) Ref SBD

Figure 5. Frequency-dependent C-V curves of device: (a) PAA SBD; (b) Ref SBD.

DownLoad: Full-Size Img PowerPoint

图 6 (a)陷阱态评估等效电路图; (b) PAA SBD和Ref SBD电导随角频率的变化

Figure 6. (a) Equivalent circuit for the trap state evaluation; (b) frequency-dependent G/ω-ω curves of the fabricated PAA SBD and Ref SBD.

DownLoad: Full-Size Img PowerPoint

图 7 不同频率下器件的电导随阳极偏压的变化　(a) PAA SBD; (b) Ref SBD

Figure 7. Frequency-dependent G/ω-V curves of device: (a) PAA SBD; (b) Ref SBD.

DownLoad: Full-Size Img PowerPoint

图 8 PAA SBD (a)和Ref SBD (b)的界面态密度随测试频率的变化

Figure 8. Variation of N_SS as a function of the measured frequency of (a) PAA SBD and (b) Ref SBD.

DownLoad: Full-Size Img PowerPoint

图 9 (a) PAA SBD与Ref SBD器件击穿特性; (b)器件阳极界面陷阱漏电的能带结构示意图

Figure 9. (a) Reverse breakdown characteristics of the fabricated PAA SBD and Ref SBD; (b) energy band diagram of trap induced leakage current in anode contact.

DownLoad: Full-Size Img PowerPoint

map

[1]	Liu X K, Liu Q, Li C, Wang J F, Yu W J, Xu K, Ao J P 2017 Jpn. J. Appl. Phys. 56 026501 Google Scholar
[2]	Bajaj S, Akyol F, Krishnamoorthy S, Zhang Y W, Rajan S 2016 Appl. Phys. Lett. 109 133508 Google Scholar
[3]	武鹏, 张涛, 张进成, 郝跃 2022 71 158503 Google Scholar Wu P, Zhang T, Zhang J C, Hao Y 2022 Acta Phys. Sin. 71 158503 Google Scholar
[4]	崔艺馨, 马英起, 上官士鹏, 康玄武, 刘鹏程, 韩建伟 2022 71 136102 Google Scholar Cui Y X, Ma Y Q, Shangguan S P, Kang X W, Liu P C, Han J W 2022 Acta Phys. Sin. 71 136102 Google Scholar
[5]	陈睿, 梁亚楠, 韩建伟, 王璇, 杨涵, 陈钱, 袁润杰, 马英起, 上官士鹏 2021 70 116102 Google Scholar Chen R, Liang Y N, Han J W, Wang X, Yang H, Chen Q, Yuan R J, Ma Y Q, Shangguan S P 2021 Acta Phys. Sin. 70 116102 Google Scholar
[6]	Nela L, Erp R V, Kampitsis G, Yildirim H K, Ma J, Matioli E 2021 IEEE T. Power Electr. 36 1269 Google Scholar
[7]	Nela L, Kampitsis G, Ma J, Matioli E 2020 IEEE Electron Dev. Lett. 41 99 Google Scholar
[8]	Li X D, Geens K, Guo W M, You S Z, Zhao M, Fahle D, Odnoblyudov V, Groeseneken G, Decoutere S 2019 IEEE Electron Dev. Lett. 40 1499 Google Scholar
[9]	Bahat-Treidel E, Hilt O, Zhytnytska R, Wentzel A, Meliani C, Wurfl J, Trankle G 2012 IEEE Electron Dev. Lett. 33 357 Google Scholar
[10]	Hsin Y M, Ke T Y, Lee G Y, Chyi J I, Chiu H C 2012 Phys. Status Solidi C 9 949 Google Scholar
[11]	Han S W, Yang S, Li R, Wu X K, Sheng K 2019 IEEE T. Power Electr. 34 5012 Google Scholar
[12]	Xu R, Chen P, Liu M H, Zhou J, Li Y M, Cheng K, Liu B, Chen D J, Xie Z L, Zhang R, Zheng Y D 2021 IEEE Electron Dev. Lett. 42 208 Google Scholar
[13]	Zhang T, Zhang J C, Zhou H, Wang Y, Chen T S, Zhang K, Zhang Y C, Dang K, Bian Z K, Zhang J F, Xu S R, Duan X L, Ning J, Hao Y 2019 IEEE Electron Dev. Lett. 40 1583 Google Scholar
[14]	Zhu M D, Song B, Qi M, Hu Z Y, Nomoto K, Yan X D, Cao Y, Johnson W, Kohn E, Jena D, Xing H L G 2015 IEEE Electron Dev. Lett. 36 375 Google Scholar
[15]	Tsou C W, Wei K P, Lian Y W, Hsu S S H 2016 IEEE Electron Dev. Lett. 37 70 Google Scholar
[16]	Gao J N, Jin Y F, Xie B, Wen C P, Hao Y L, Shen B, Wang M J 2018 IEEE Electron Dev. Lett. 39 859 Google Scholar
[17]	Zhang T, Zhang J C, Zhou H, Chen T S, Zhang K, Hu Z Z, Bian Z K, Dang K, Wang Y, Zhang L, Ning J, Ma P J, Hao Y 2018 IEEE Electron Dev. Lett. 39 1548 Google Scholar
[18]	Zhang T, Wang Y, Zhang Y N, Lü Y G, Ning J, Zhang Y C, Zhou H, Duan X L, Zhang J C, Hao Y 2021 IEEE Trans. Electron Dev. 68 2661 Google Scholar
[19]	Chen J B, Bian Z K, Liu Z H, Zhu D, Duan X L, Wu Y H, Jia Y Q, Ning J, Zhang J C, Hao Y 2021 J. Alloy Compd. 853 156978 Google Scholar
[20]	Du L L, Xin Q, Xu M S, Liu Y X, Mu W X, Yan S Q, Wang X Y, Xin G M, Jia Z T, Tao X T, Song A M 2019 IEEE Electron Dev. Lett. 40 451 Google Scholar
[21]	Bilkan Ç, Gümüş A, Altındal Ş 2015 Mater. Sci. Semicond. Process 39 484 Google Scholar

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Vol. 72, Issue 19 - 2023-10-05

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