Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning. Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder jointsJ. Acta Physica Sinica, 2012, 61(19): 198104. DOI: 10.7498/aps.61.198104