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Zhao Da-Shuai, Sun Zhi, Sun Xing, Sun Huai-De, Han Bai. Micro gap air discharge based on fractal theory. Acta Physica Sinica,
2021, 70(20): 205207.
doi: 10.7498/aps.70.20210362
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Xing Hong-Yan, Gong Ping, Xu Wei. Small target detection in the background of sea clutter using fractal method. Acta Physica Sinica,
2012, 61(16): 160504.
doi: 10.7498/aps.61.160504
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Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning. Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints. Acta Physica Sinica,
2012, 61(19): 198104.
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian. A microstructure-based study on electromigration in Cu interconnects. Acta Physica Sinica,
2012, 61(1): 018501.
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Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang. Resistometric study on electromigration failure in copper interconnects. Acta Physica Sinica,
2012, 61(24): 248501.
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He Liang, Du Lei, Huang Xiao-Jun, Chen Hua, Chen Wen-Hao, Sun Peng, Han Liang. Non-Gaussian analysis of noise for metal interconnection electromigration. Acta Physica Sinica,
2012, 61(20): 206601.
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Yang Juan, Bian Bao-Min, Peng Gang, Li Zhen-Hua. The fractal character of two-parameter pulse model for random signal. Acta Physica Sinica,
2011, 60(1): 010508.
doi: 10.7498/aps.60.010508
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Zhang Li, Liu Shu-Tang. Control of thermal diffusion fractal growth of thin plate under environmental disturbance. Acta Physica Sinica,
2010, 59(11): 7708-7712.
doi: 10.7498/aps.59.7708
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Directional diffusion of atoms in metal strips/bump interconnects of flip chip. Acta Physica Sinica,
2010, 59(5): 3438-3444.
doi: 10.7498/aps.59.3438
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Zhang Cheng-Bin, Chen Yong-Ping, Shi Ming-Heng, Fu Pan-Pan, Wu Jia-Feng. Fractal characteristics of surface roughness and its effect on laminar flow in microchannels. Acta Physica Sinica,
2009, 58(10): 7050-7056.
doi: 10.7498/aps.58.7050
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Electromigration in Sn3.0Ag0.5Cu flip chip solder joint. Acta Physica Sinica,
2009, 58(3): 1942-1947.
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Meng Tian-Hua, Zhao Guo-Zhong, Zhang Cun-Lin. Study of enhanced transmission of terahertz radiation through subwavelength fractals structures. Acta Physica Sinica,
2008, 57(6): 3846-3852.
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He Liang, Du Lei, Zhuang Yi-Qi, Li Wei-Hua, Chen Jian-Ping. Multiscale entropy complexity analysis of metallic interconnection electromigration noise. Acta Physica Sinica,
2008, 57(10): 6545-6550.
doi: 10.7498/aps.57.6545
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Li Tong, Shang Peng-Jian. A multifractal approach to palmprint recognition. Acta Physica Sinica,
2007, 56(8): 4393-4400.
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2007, 56(12): 7176-7182.
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Shu Xue-Ming, Fang Jun, Shen Shi-Fei, Liu Yong-Jin, Yuan Hong-Yong, Fan Wei-Cheng. Study on fractal coagulation characteristics of fire smoke particles. Acta Physica Sinica,
2006, 55(9): 4466-4471.
doi: 10.7498/aps.55.4466
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Zhang Wen-Jie, Yi Wan-Bing, Wu Jin. Electromigration in Al interconnects and the challenges in ultra-deep submicron technology. Acta Physica Sinica,
2006, 55(10): 5424-5434.
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Zong Zhao-Xiang, Du Lei, Zhuang Yi-Qi, He Liang, Wu Yong. Modeling of resistance changes based on the free volume in VLSI interconnection electromigration. Acta Physica Sinica,
2005, 54(12): 5872-5878.
doi: 10.7498/aps.54.5872
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Qi Hong- Ji, Yi Kui, He Hong- Bo, Shao Jian- Da. The effect of sputtering particle energy on surface characteristics of Mo thin films. Acta Physica Sinica,
2004, 53(12): 4398-4404.
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Du Lei, Zhuang Yi-Qi, Xue Li-Jun. Ａｕｎｉｆｉｅｄｍｏｄｅｌｆｏｒ 1 ｆｎｏｉｓｅａｎｄ 1 ｆ2 ｎｏｉｓｅｄｕｅｔｏｅｌｅｃｔｒｏｍｉｇｒａｔｉｏｎｉｎｍｅｔａｌｆｉｌｍ. Acta Physica Sinica,
2002, 51(12): 2836-2841.
doi: 10.7498/aps.51.2836
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