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Jin Jian-Guo, Di Zhi-Gang, Wei Ming-Jun. Potential risk of variable parameter cascade chaos system. Acta Physica Sinica,
2014, 63(12): 120509.
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Wang Xin-Ying, Han Min, Wang Ya-Nan. Analysis of noisy chaotic time series prediction error. Acta Physica Sinica,
2013, 62(5): 050504.
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian. A microstructure-based study on electromigration in Cu interconnects. Acta Physica Sinica,
2012, 61(1): 018501.
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Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang. Resistometric study on electromigration failure in copper interconnects. Acta Physica Sinica,
2012, 61(24): 248501.
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Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning. Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints. Acta Physica Sinica,
2012, 61(19): 198104.
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Yao Tian-Liang, Liu Hai-Feng, Xu Jian-Liang, Li Wei-Feng. Noise-level estimation of noisy chaotic time series based on the invariant of the largest Lyapunov exponent. Acta Physica Sinica,
2012, 61(6): 060503.
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He Liang, Du Lei, Huang Xiao-Jun, Chen Hua, Chen Wen-Hao, Sun Peng, Han Liang. Non-Gaussian analysis of noise for metal interconnection electromigration. Acta Physica Sinica,
2012, 61(20): 206601.
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Li He, Yang Zhou, Zhang Yi-Min, Wen Bang-Chun. Methodology of estimating the embedding dimension in chaos time series based on the prediction performance of radial basis function neural networks. Acta Physica Sinica,
2011, 60(7): 070512.
doi: 10.7498/aps.60.070512
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Yu Si-Yao, Guo Shu-Xu, Gao Feng-Li. Calculation of the Lyapunov exponent for low frequency noise in semiconductor laser and chaos indentification. Acta Physica Sinica,
2009, 58(8): 5214-5217.
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Electromigration in Sn3.0Ag0.5Cu flip chip solder joint. Acta Physica Sinica,
2009, 58(3): 1942-1947.
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Rong Hai_Wu, Wang Xiang-Dong, Xu Wei, Fang Tong. Bifurcations of safe basins and chaos in Flickering oscillator under multi-frequency harmonic and bounded noise excitation. Acta Physica Sinica,
2008, 57(3): 1506-1513.
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He Liang, Du Lei, Zhuang Yi-Qi, Li Wei-Hua, Chen Jian-Ping. Multiscale entropy complexity analysis of metallic interconnection electromigration noise. Acta Physica Sinica,
2008, 57(10): 6545-6550.
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Lei You-Ming, Xu Wei. Homoclinic chaos in averaged oscillator subjected to combined deterministic and narrow-band random excitations. Acta Physica Sinica,
2007, 56(9): 5103-5110.
doi: 10.7498/aps.56.5103
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Rong Hai-Wu, Wang Xiang-Dong, Xu Wei, Fang Tong. Bifurcations of safe basins and chaos in softening Duffing oscillator under harmonic and bounded noise excitation. Acta Physica Sinica,
2007, 56(4): 2005-2011.
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Chen Chun-Xia, Du Lei, He Liang, Hu Jin, Huang Xiao-Jun, Wei Tao. Fractal character of noise in electromigration in metel interconnection. Acta Physica Sinica,
2007, 56(11): 6674-6679.
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Li Rui-Hong, Xu Wei, Li Shuang. Linear state feedback control for a new chaotic system. Acta Physica Sinica,
2006, 55(2): 598-604.
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Zhang Wen-Jie, Yi Wan-Bing, Wu Jin. Electromigration in Al interconnects and the challenges in ultra-deep submicron technology. Acta Physica Sinica,
2006, 55(10): 5424-5434.
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Zong Zhao-Xiang, Du Lei, Zhuang Yi-Qi, He Liang, Wu Yong. Modeling of resistance changes based on the free volume in VLSI interconnection electromigration. Acta Physica Sinica,
2005, 54(12): 5872-5878.
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Liu Hai-Feng, Dai Zheng-Hua, Chen Feng, Gong Xin, Yu Zun-Hong. . Acta Physica Sinica,
2002, 51(6): 1186-1192.
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Du Lei, Zhuang Yi-Qi, Xue Li-Jun. Aunifiedmodelfor 1 fnoiseand 1 f2 noiseduetoelectromigrationinmetalfilm. Acta Physica Sinica,
2002, 51(12): 2836-2841.
doi: 10.7498/aps.51.2836
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