An accurate Joule heat model of RLC interconnect based on π equivalent circuit

Zhu Zhang-Ming; Zhong Bo; Yang Yin-Tang

doi:10.7498/aps.59.4895

Abstract

With the integrated circuits processing stepping into nanometer scale, the interconnect Joule heat becomes significantly large. Based on the RLC π equivalent circuit, this paper proposes a novel accurate model to evaluate Joule heat power of interconnected line in VLSI. The shielding effect of the inductor and the non-ideal step stimulation are considered in the proposed model. The power consumption of a typical interconnected topology in 90 nm complementary metal-oxide semiconductor process is computed. The error between results of this proposed method and Hspice simulation is within 3% when the input signal’s delay time is within 1 ns. The proposed model can be used to estimate Joule heat consumption where rough heat control is needed, such as route structure in the network on chip.

Keywords:

Authors and contacts

1.
Microelectronics Institute, Xidian University, Xi'an 710071, China

References

[1]	Zhu Z M, Qian L B 2009 Chin. Phys. B 18 1188
[2]	International Technology Roadmap for Semiconductors 2006 Edition http:/public.itrs.net
[3]	Zhu Z M, Zhong B, Hao B T, Yang Y T 2009 Acta Phys. Sin. 58 7124 (in Chinese) [朱樟明、钟波、郝报田、杨银堂 2009 58 7124]
[4]	El-Moursy M A, Friedman E G 2005 IEEE Trans. VLSI Syst. 13 396
[5]	Chen G Q, Friedman E G 2008 IEEE Circuits-Ⅱ 55 26
[6]	Zhou Q M, Mohanram K 2006 ACM IEEE Design Automation Conference Proceedings of the 43rd Conference on Design automation San Diego, California, June 4—8, 2006 p965
[7]	Yang X, Cheng C K, Ku W H 2000 IEEE/ACM International Conference Computer-Aided Design Austin, Texas, September 17—20, 2000 222
[8]	Ren Y L, Mao J F, Li X C 2005 Microelectron. 35 290 ( in Chinese) [任英磊、毛军发、李晓春 2005 微电子学 35 290 ]

Cited By

[1]	Zhu Z M, Qian L B 2009 Chin. Phys. B 18 1188
[2]	International Technology Roadmap for Semiconductors 2006 Edition http:/public.itrs.net
[3]	Zhu Z M, Zhong B, Hao B T, Yang Y T 2009 Acta Phys. Sin. 58 7124 (in Chinese) [朱樟明、钟波、郝报田、杨银堂 2009 58 7124]
[4]	El-Moursy M A, Friedman E G 2005 IEEE Trans. VLSI Syst. 13 396
[5]	Chen G Q, Friedman E G 2008 IEEE Circuits-Ⅱ 55 26
[6]	Zhou Q M, Mohanram K 2006 ACM IEEE Design Automation Conference Proceedings of the 43rd Conference on Design automation San Diego, California, June 4—8, 2006 p965
[7]	Yang X, Cheng C K, Ku W H 2000 IEEE/ACM International Conference Computer-Aided Design Austin, Texas, September 17—20, 2000 222
[8]	Ren Y L, Mao J F, Li X C 2005 Microelectron. 35 290 ( in Chinese) [任英磊、毛军发、李晓春 2005 微电子学 35 290 ]

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Catalog

Vol. 59, Issue 7 - 2010-04-05

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