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中国物理学会期刊

基于Al2O3/Pt纳米晶/HfO2叠层的MOS电容存储效应研究

CSTR: 32037.14.aps.59.2057

Investigation on memory effect of MOS capacitors with Al2O3/Pt-nanocrystals/HfO2

CSTR: 32037.14.aps.59.2057
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  • 采用电子束蒸发Pt和后快速热退火的方法,研究了退火条件对Pt纳米晶的生长特性的影响,结果显示Pt纳米晶的密度随退火温度的升高和退火时间的延长均表现出先增大后减小的趋势.在800℃下退火20 s能得到分布均匀的、密度为30×1011 cm-2的Pt纳米晶.进一步研究了基于Al2O3/Pt纳米晶/HfO2叠层的MOS电容结构的存储效应,表明其在-3—+8 V扫描电压范围下C-V<

     

    Growth of Pt nanocrystals has been investigated by means of electron beam evaporation of Pt layer and post rapid thermal annealing. The results indicate that the density of nanocrystals increases first with the annealing temperature and the annealing time,followed by a slight decrease. Uniformly distributed nanocystals with a density of 30×1011 cm-2 can be obtained in the case of the annealing at 800℃ for 20 s. Further,memory effect of Al2O3/Pt nanocrystals/HfO2-based MOS capacitors has been characterized,indicating a capacitance-voltage (C-V) hysteresis window as large as 201 V in the sweep voltage range of -3—+8 V. In terms of the same programming time,the flat band voltage shift of the memory capacitor starts to increase remarkably when the programming voltage is increased to 9 V. This is related to a decrease in the energy barrier across the tunneling layer for electrons,i.e.,the tunnel mechanism of electrons is changed from direct tunneling to Fowler-Nordheim tunneling. Moreover,the memory capacitor also exhibits a capability of continuous electron trapping with prolonging of the programming duration.

     

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