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Numerical and experimental study of air arc splitting process considering splitter plate erosion

Yang Fei Rong Ming-Zhe Wu Yi Shi Qiang Liu Zeng-Chao Ma Rui-Guang Chen Sheng

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Numerical and experimental study of air arc splitting process considering splitter plate erosion

Yang Fei, Rong Ming-Zhe, Wu Yi, Shi Qiang, Liu Zeng-Chao, Ma Rui-Guang, Chen Sheng
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  • A three-dimensional magnetohydrodynamic model of an air arc plasma, considering the metal vapour from erosion of an iron splitter plate, is developed. An equation describing conservation of the iron vapour mass is added to the standard mass, momentum, and energy conservation equations. The influence of the iron vapour on the thermodynamic and transport properties of the gas mixture is considered in the calculation. The arc voltage, and distributions of temperature, gas flow, and mass fraction of iron vapour in the arc chamber are calculated and analyzed in detail. The experiment was carried out to support the simulation work. The images recorded by a high-speed camera and arc voltage measurement were compared with the predictions of the simulations, which proved the validity of the simulation model.
    [1]

    Chadebec O, Meunier G, Mazauric V G, Le Floch Y, Labie P 2004 IEEE Trans. Magn. 40 1358

    [2]

    Sun Z Q, Rong M R, Yang F, Wu Y, Ma Q, Wang X H 2008 IEEE Trans. Plasma Sci. 36 1072

    [3]

    Lindmayer M, Marzahn E, Mutzke, Ruther T, Springstubbe M 2006 IEEE Trans. Compon. Packag. Technol. 29 310

    [4]

    Gonzalez J J, Gleizes A, Proulx P, Boulos M 1993 J. Appl. Phys. 74 3065

    [5]

    Murphy A B, Tanaka M, Yamamoto K, Tashiro S, Sato T, Lowke J J 2009 J. Phys. D: Appl. Phys. 42 194006

    [6]

    Zhang J L, Yan J D, Fang M T C 2004 IEEE Trans. Plasma Sci. 32 1352

    [7]

    Rong M Z, Ma Q, Wu Y, Xu T J, Murphy A B 2009 J. Appl. Phys. 106 023308

    [8]

    Rüther T, Mutzke A, Lindmayer M, Kurrat M 2006 Proc. 23rd Int. Conf. on Electrical Contacts (Sendai, Japan)

    [9]

    Wu Y, Rong M Z, Sun Z Q, Wang X H, Yang F, Li X W 2007 J. Phys. D: Appl. Phys. 40 795

    [10]

    Zou X, Gong Y, Liu J Y, Gong J Q 2004 Acta Phys.Sin. 53 824 (in Chinese) [邹 秀、 宫 野、 刘金远、 宫继全 2004 53 824]

    [11]

    Gong J Q, Gong Y, Liu J Y, Zhang P Y 2002 Acta Phys. Sin. 51 291 (in Chinese) [宫继全、 宫 野、 刘金远、 张鹏云 2002 51 291]

    [12]

    Lu S P, Dong W C, Li D Z, Li Y Y 2009 Acta Phys. Sin. 58 S94 (in Chinese) [陆善平、 董文超、 李殿中、 李依依 2009 58 S94]

    [13]

    Wu Y, Rong M Z, Yang F, Wang X H, Ma Q, Wang W Z 2008 Acta Phys. Sin. 57 5761 (in Chinese) [吴 翊、 荣命哲、 杨 飞、 王小华、 马 强、 王伟宗 2008 57 5761]

    [14]

    Li L C, Xia W D 2008 Chin. Phys. B 17 649

    [15]

    Swierczynski B, Gonzalez J J, Teulet P, Freton P, Gleizes A 2004 J. Phys. D: Appl. Phys. 37 595

    [16]

    Gleizes A, Gonzalez J J, Freton P 2005 J. Phys. D: Appl. Phys. 38 R153

    [17]

    Hsu K C, Etemadi K, Pfender E 1983 J. Appl. Phys. 54 1293

    [18]

    Gleizes A, Rahmani B, Gonzalez J J, Liani B 1991 J. Phys. D: Appl. Phys. 24 1300

    [19]

    Murphy A B 1995 Plasma Chem. Plasma Process. 15 279

    [20]

    Lowke J J, Morrow R, Haidar J 1997 J. Phys. D: Appl. Phys. 30 2033

    [21]

    Xu G, Hu J, Tsai H L 2008 J. Appl. Phys. 104 103301

    [22]

    Coulombe S and Meunier J L 1997 J. Phys. D: Appl. Phys. 30 2905

    [23]

    Yokomizu Y, Matsumura T, Henmi R and Kito Y 1996 J. Phys. D: Appl. Phys. 29 1260

    [24]

    Schmitz H, Riemann K U 2002 J. Phys. D: Appl. Phys. 35 1727

    [25]

    Lowke J J, Tanaka M 2006 J. Phys. D: Appl. Phys.39 3634

    [26]

    Slade P G 1999 Electrical Contacts: Principles and Applications (New York: Marcel Dekker)

    [27]

    Andrew J G, Attley D R 1975 Moving Boundary Problems in Heat Flow and Diffusion ed JR Ockendon and W R Hodgkins (New York: Clarendon) pp. 38

    [28]

    Morrow R, Lowke J J 1993 J. Phys. D: Appl. Phys. 26 634

  • [1]

    Chadebec O, Meunier G, Mazauric V G, Le Floch Y, Labie P 2004 IEEE Trans. Magn. 40 1358

    [2]

    Sun Z Q, Rong M R, Yang F, Wu Y, Ma Q, Wang X H 2008 IEEE Trans. Plasma Sci. 36 1072

    [3]

    Lindmayer M, Marzahn E, Mutzke, Ruther T, Springstubbe M 2006 IEEE Trans. Compon. Packag. Technol. 29 310

    [4]

    Gonzalez J J, Gleizes A, Proulx P, Boulos M 1993 J. Appl. Phys. 74 3065

    [5]

    Murphy A B, Tanaka M, Yamamoto K, Tashiro S, Sato T, Lowke J J 2009 J. Phys. D: Appl. Phys. 42 194006

    [6]

    Zhang J L, Yan J D, Fang M T C 2004 IEEE Trans. Plasma Sci. 32 1352

    [7]

    Rong M Z, Ma Q, Wu Y, Xu T J, Murphy A B 2009 J. Appl. Phys. 106 023308

    [8]

    Rüther T, Mutzke A, Lindmayer M, Kurrat M 2006 Proc. 23rd Int. Conf. on Electrical Contacts (Sendai, Japan)

    [9]

    Wu Y, Rong M Z, Sun Z Q, Wang X H, Yang F, Li X W 2007 J. Phys. D: Appl. Phys. 40 795

    [10]

    Zou X, Gong Y, Liu J Y, Gong J Q 2004 Acta Phys.Sin. 53 824 (in Chinese) [邹 秀、 宫 野、 刘金远、 宫继全 2004 53 824]

    [11]

    Gong J Q, Gong Y, Liu J Y, Zhang P Y 2002 Acta Phys. Sin. 51 291 (in Chinese) [宫继全、 宫 野、 刘金远、 张鹏云 2002 51 291]

    [12]

    Lu S P, Dong W C, Li D Z, Li Y Y 2009 Acta Phys. Sin. 58 S94 (in Chinese) [陆善平、 董文超、 李殿中、 李依依 2009 58 S94]

    [13]

    Wu Y, Rong M Z, Yang F, Wang X H, Ma Q, Wang W Z 2008 Acta Phys. Sin. 57 5761 (in Chinese) [吴 翊、 荣命哲、 杨 飞、 王小华、 马 强、 王伟宗 2008 57 5761]

    [14]

    Li L C, Xia W D 2008 Chin. Phys. B 17 649

    [15]

    Swierczynski B, Gonzalez J J, Teulet P, Freton P, Gleizes A 2004 J. Phys. D: Appl. Phys. 37 595

    [16]

    Gleizes A, Gonzalez J J, Freton P 2005 J. Phys. D: Appl. Phys. 38 R153

    [17]

    Hsu K C, Etemadi K, Pfender E 1983 J. Appl. Phys. 54 1293

    [18]

    Gleizes A, Rahmani B, Gonzalez J J, Liani B 1991 J. Phys. D: Appl. Phys. 24 1300

    [19]

    Murphy A B 1995 Plasma Chem. Plasma Process. 15 279

    [20]

    Lowke J J, Morrow R, Haidar J 1997 J. Phys. D: Appl. Phys. 30 2033

    [21]

    Xu G, Hu J, Tsai H L 2008 J. Appl. Phys. 104 103301

    [22]

    Coulombe S and Meunier J L 1997 J. Phys. D: Appl. Phys. 30 2905

    [23]

    Yokomizu Y, Matsumura T, Henmi R and Kito Y 1996 J. Phys. D: Appl. Phys. 29 1260

    [24]

    Schmitz H, Riemann K U 2002 J. Phys. D: Appl. Phys. 35 1727

    [25]

    Lowke J J, Tanaka M 2006 J. Phys. D: Appl. Phys.39 3634

    [26]

    Slade P G 1999 Electrical Contacts: Principles and Applications (New York: Marcel Dekker)

    [27]

    Andrew J G, Attley D R 1975 Moving Boundary Problems in Heat Flow and Diffusion ed JR Ockendon and W R Hodgkins (New York: Clarendon) pp. 38

    [28]

    Morrow R, Lowke J J 1993 J. Phys. D: Appl. Phys. 26 634

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  • Abstract views:  7915
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Publishing process
  • Received Date:  07 May 2010
  • Accepted Date:  05 July 2010
  • Published Online:  15 May 2011

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