Numerical simulation on the effect of shielding gas on the plasma cutting arc

Li Hui; Zhou Qian-Hong; Guo Wen-Kang

doi:10.7498/aps.60.025214

Abstract

By comparing two diffierent torch geometries, it was found that the shielding flow has no significant effect on plasma velocity and temperature,except in the shock wave region. The shielding flow decreases the shock wave, and increases the arc voltage due to cooling. In the impinging geometry, shielding flow will crash the plasma jet after the nozzle exit and slightly increase the pressure in the torch. It was also shown that the component of shielding gas has no significant effect on plasma cuttingarc. The mole fraction of oxygen decreases very slowly along the axis and is still more than 90% at 10 mm downstream the nozzle exit.

Keywords:

Authors and contacts

(1)Department of Thermal Science and Energy Engineering, University of Science and Technology of China, Hefei 230027, China; (2)Institute of Applied Physics and Computational Mathematics, Beijing 100088, China;Institute of Modern Physics, Fudan University, Shanghai 200433, China; (3)Institute of Modern Physics, Fudan University, Shanghai 200433, China

References

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[18]	Zhou Q H, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2009 J. Phys. D: Appl. Phys. 42 015210
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[20]	Zhou Q H, Yin H T, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2009 J. Phys. D: Appl. Phys. 42 095208
[21]	Guo S F, Zhou Q H, Guo W K, Xu P 2010 Plasma Chem. Plasma Process 30 121
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[25]	Fluent Inc. 2001 FLUENT Users Guide
[26]	Yakhot V, Orszag S A 1986 Journal of Scientic Computing 1 1
[27]	Jayatilleke C 1969 Prog. Heat Mass Transfer 1 193
[28]	Shih T H, Liou W W, Shabbir A, Yang Z, Zhu J 1995 Computers Fluids 24 227
[29]	Reynolds W C 1987 Lecture Notes for von Karman Institute Agard Report No. 755
[30]	Launder B E 1989 Inter. J. Heat Fluid Flow 10 282
[31]	Launder B E, Reece G J, Rodi W 1975 J. Fluid Mech. 68 537
[32]	Lien F S, Leschziner M A 1994 Computers and Fluids 23 983
[33]	Yuan X Q, Li H, Zhao T Z, Wang F, Guo W K, Xu P 2004 Acta Phys. Sin. 53 788 (in Chinese) [袁行球、李辉、赵太泽、王飞、郭文康、须平2004 53 788]
[34]	Yuan X Q, Li H, Zhao T Z, Wang F, Yu G Y, Guo W K, Xu P 2004 Acta Phys. Sin. 53 3806(in Chinese) 〖袁行球、李辉、赵太泽、王飞、俞国扬、郭文康、须平2004 53 3806]

Cited By

[1]	Gage R M 1957 U. S. Patent 2806124
[2]	Nemchinsky V A, Severance W S 2006 J. Phys. D: Appl. Phys. 39 423
[3]	Ramakrishnan S, Rogozinski M W 1997 J. Phys. D: Appl. Phys. 30 636
[4]	Ramakrishnan S, Gershenzon M, Polivka F, Kearny T N, Rogozinsky M W 1997 IEEE Trans. Plasma Sci. 25 937
[5]	Pardo C, Gonzalez-Aguilar J, Rodriguez-Yunta A, Calderon M A G 1999 J. Phys. D: Appl. Phys. 32 2181
[6]	Freton P, Gonzalez J J, Gleizes A, Peyret F C, Caillibotte G, Delzenne M 2002 J. Phys. D: Appl. Phys. 35 115
[7]	Freton P, Gonzalez J J, Peyret F C, Glezes A 2003 J. Phys. D: Appl. Phys. 36 1269
[8]	Girard L, Teulet Ph, Raza-nimanana M, Gleizes A, Camy-Peyret F, Ballot E, Richard F 2006 J. Phys. D: Appl. Phys. 39 1543
[9]	Peters J, Yin F, Borges C F M, Heberlein J, Hackett C 2005 J. Phys. D: Appl. Phys. 38 1781
[10]	Peters J, Heberlein J, Lindsay J 2007 J. Phys. D: Appl. Phys. 40 3960
[11]	Nemchinsky V A, Showalter M S 2003 J. Phys. D: Appl. Phys. 36 704
[12]	Peters J, Bartlett B, Lindsay J, Heberlein J 2008 Plasma Chem. Plasma Process 28 331
[13]	Bini R, Colosimo B M, Kutlu A E, Monno M 2008 J. Mater. Process Tech. 196 345
[14]	Gonzalez-Aguilar J, Pardo C, Rodriguez-Yunita A, Calderon M A G 1999 IEEE Trans. Plasma Sci. 27 264
[15]	Patankar S V 1980 Numerical Heat Transfer and Fluid Flow. (New York: McGraw-Hill)
[16]	Ghorui S, Heberlein J V R, Pfender E 2007 J. Phys. D: Appl. Phys. 40 1966
[17]	Colombo V, Concetti A, Ghedini E, Dallavalle S, Vancini M 2008 IEEE Trans. Plasma Sci. 36 389
[18]	Zhou Q H, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2009 J. Phys. D: Appl. Phys. 42 015210
[19]	Zhou Q H, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2008 Plasma Chem. Plasma Process 6 729
[20]	Zhou Q H, Yin H T, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2009 J. Phys. D: Appl. Phys. 42 095208
[21]	Guo S F, Zhou Q H, Guo W K, Xu P 2010 Plasma Chem. Plasma Process 30 121
[22]	Naghizadeh-Kashani Y, Cressault Y, Gleizes A 2002 J. Phys. D: Appl. Phys. 35 2925
[23]	Murphy A B 1995 Plasma Chem. Plasma Process 15 279
[24]	Murphy A B 1994 Plasma Chem. Plasma Process 14 451
[25]	Fluent Inc. 2001 FLUENT Users Guide
[26]	Yakhot V, Orszag S A 1986 Journal of Scientic Computing 1 1
[27]	Jayatilleke C 1969 Prog. Heat Mass Transfer 1 193
[28]	Shih T H, Liou W W, Shabbir A, Yang Z, Zhu J 1995 Computers Fluids 24 227
[29]	Reynolds W C 1987 Lecture Notes for von Karman Institute Agard Report No. 755
[30]	Launder B E 1989 Inter. J. Heat Fluid Flow 10 282
[31]	Launder B E, Reece G J, Rodi W 1975 J. Fluid Mech. 68 537
[32]	Lien F S, Leschziner M A 1994 Computers and Fluids 23 983
[33]	Yuan X Q, Li H, Zhao T Z, Wang F, Guo W K, Xu P 2004 Acta Phys. Sin. 53 788 (in Chinese) [袁行球、李辉、赵太泽、王飞、郭文康、须平2004 53 788]
[34]	Yuan X Q, Li H, Zhao T Z, Wang F, Yu G Y, Guo W K, Xu P 2004 Acta Phys. Sin. 53 3806(in Chinese) 〖袁行球、李辉、赵太泽、王飞、俞国扬、郭文康、须平2004 53 3806]

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Vol. 60, Issue 2 - 2011-01-20

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