高导热聚酰亚胺电介质薄膜研究进展

查俊伟; 王帆

doi:10.7498/aps.71.20221398

摘要

电子器件高度薄型化、多功能化和集成化的时代, 不可避免地会导致复合材料内部的热量积累, 严重影响设备的稳定运行和使用寿命, 如何实现电介质材料快速且高效的导热散热已成为影响电子设备发展的关键问题. 传统聚酰亚胺本征导热系数较低, 限制了在电气设备与智能电网等领域中的应用, 发展新型高导热聚酰亚胺电介质薄膜材料成为国内外研究重点. 本文介绍了复合材料的热传导机制, 概述了近年来导热聚酰亚胺薄膜的研究进展与发展现状, 重点讨论了导热填料、界面相容、成型工艺对材料导热系数的影响, 最后结合导热聚酰亚胺复合电介质材料未来发展的需要, 对研究中存在的一些关键科学技术问题进行了总结与展望.

关键词:

Abstract

In the era of highly thin, multi-functional and integrated electronic devices, it will inevitably lead to the heat accumulation inside the composite material, thereby seriously affecting the operation stability and service life of the equipment. How to realize the rapid and efficient heat conduction and heat dissipation of dielectric materials has become a bottleneck problem restricting the further development of electronic devices. The intrinsic thermal conductivity of traditional polyimide is low, which limits its application in electrical equipment, smart grid and other fields. The development of new high thermal conductivity polyimide dielectric film materials has become the focus of research. This paper introduces the thermal conduction mechanism of composite materials, summarizes the research progress and development status of thermally conductive polyimide films in recent years, and focuses on the effects of thermally conductive fillers, interface compatibility, and molding process of the thermal conductivity of materials. Finally, some key scientific and technical issues in the research are summarized and prospected in combination with the future development needs of thermally conductive polyimide composite dielectric materials.

Keywords:

作者及机构信息

查俊伟^1,2,
王帆¹

1.
北京科技大学化学与生物工程学院, 北京　100083

2.
北京科技大学, 北京材料基因工程高精尖创新中心, 北京　100083

通信作者: 查俊伟, zhajw@ustb.edu.cn

基金项目: 国家自然科学基金(批准号: 51977114)资助的课题.

Authors and contacts

Zha Jun-Wei^1,2,
Wang Fan¹

1.
School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China

2.
Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing 100083, China

Corresponding author: Zha Jun-Wei, zhajw@ustb.edu.cn

Funds: Project supported by the National Natural Science Foundation of China (Grant No. 51977114).

文章全文 : translate this paragraph

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施引文献

图 1 PI薄膜材料的应用^[3-7]

Fig. 1. Application of PI film materials^[3-7].

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图 2 粒子碰撞在材料中的热传导^[12]

Fig. 2. Thermal conduction in material by collision of particles^[12].

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图 3 聚合物的导热机理^[14]

Fig. 3. Thermal conductivity mechanism of polymers^[14].

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图 4 两步法合成PI的路线

Fig. 4. PI two-step synthesis route.

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图 5 导热网络形成示意图^[19]

Fig. 5. Schematic diagram of the formation of thermal conduction network^[19].

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图 6 导热系数的计算模型^[24]

Fig. 6. Calculation model of thermal conductivity^[24].

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图 7 PI基复合材料内部的传热模拟^[27]

Fig. 7. Heat transfer simulation inside the PI-based composites^[27].

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图 8 PI-1, PI-2, PI-3, PI-4的化学结构^[59]

Fig. 8. Chemical structures of PI-1, PI-2, PI-3 and PI-4^[59].

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图 9 PI纤维的分子堆积模型^[60]

Fig. 9. The molecular packing model of the PI fibers^[60].

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图 10 具有三明治结构的G-FPC^[77]

Fig. 10. Schematic of G-FPC with sandwich structure^[77].

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图 11 不同质量含量BN的PI复合薄膜的导热系数(a)和导热系数的增强(b)^[85]

Fig. 11. Thermal conductivity (a) and thermal conductivity enhancement (b) of PI composite films with different weight contents of BN^[85].

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图 12 不同混合填料形成的单网络示意图^[84]　(a) 0D+1D填料; (b) 0D+2D填料; (c) 1D+2D填料

Fig. 12. Schematic diagrams of single network formed with different hybrid fillers^[84]: (a) 0D+1D fillers; (b) 0D+2D fillers; (c) 1D +2D fillers.

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图 13 Al₂O₃@BN和Al₂O₃@BN&BN/PI复合薄膜的制备工艺示意图^[89]

Fig. 13. Schematic illustration of Al₂O₃@BN preparation and fabrication process of the Al₂O₃@BN&BN/PI composite film^[89].

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图 14 PI复合膜的导热网络示意图^[54]　(a) PI/BNNS单导热网络; (b) PI/BNNS/CNT@αPVA双导热网络

Fig. 14. Schematic diagram of the thermal conductivitynetwork of PI composite films^[54]: (a) PI/BNNS single thermally conductive network; (b) PI/BNNS/CNT@αPVA double thermally conductive networks.

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图 15 降低界面热阻的有效策略^[96]

Fig. 15. Effective strategies for reducing interfacial thermal resistance^[96].

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图 16 PI复合材料的平面热导率(a)和跨平面热导率(b)^[105]

Fig. 16. Thermal conductivity in-plane (a) and through- plane (b) of PI composites^[105].

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图 17 复合膜的运动磁场感应和热传导机理图^[113]

Fig. 17. Schematic diagram of the moving magnetic field induction and heat conduction mechanism^[113].

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表 1 常见聚合物的热导率

Table 1. Thermal conductivity of the common polymers.

材料名称	热导率/(W·m^–1·K^–1)
环氧树脂 (EP)	0.20—0.88
聚氨酯 (PU)	0.25
聚偏氯乙烯 (PVDF)	0.19
聚二甲基硅氧烷 (PDMS)	0.19
聚苯乙烯 (PS)	0.18
低密度聚乙烯 (LDPE)	0.32—0.40
高密度聚乙烯 (HDPE)	0.38—0.51
聚丙烯 (PP)	0.17—0.22
聚醚醚酮 (PEEK)	0.25
聚氯乙烯 (PVC)	0.14—0.17
聚酰亚胺 (PI)	0.10—0.35
聚乙烯醇 (PVA)	0.20
聚四氟乙烯(PTFE)	0.25
聚甲醛 (POM)	0.40

下载: 导出CSV

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