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硬盘存储密度的增加促使磁头的飞行高度不断降低. 降低磁头飞行高度所导致的润滑剂在磁头与磁盘之间的转移已成为影响磁头飞行稳定性的一个重要因素. 本文采用改进后的粗粒珠簧模型，应用分子动力学模拟方法，对磁头/磁盘之间润滑剂转移的机理进行研究. 分析了磁盘表面润滑膜厚度、润滑剂种类以及磁头表面局部温度差对磁头/磁盘之间润滑剂转移量的影响. 研究结果表明：转移到磁头上的润滑剂的体积随磁盘表面润滑膜厚度的增加而急剧增加；增加单个分子中羟基的数量，可以显著减少转移到磁头上的润滑剂的体积；磁头表面的局部高温可增加转移到磁头上的润滑剂的体积，且增加单个分子中羟基的数量可显著改善局部温度差对磁头/磁盘之间润滑剂转移的影响.The increasing of areal density of hard disk drives promotes the decreasing of the slider flying height. Lubricant transfer between slider and disk, caused by reducing slider flying height, plays an important role in affecting slider flying stability. In this study, the improved coarse-grained, bead-spring model is used to investigate the mechanism of lubricant transfer between slider and disk by molecular dynamics simulation. The effects of lubricant thickness on disk surface, lubricant type, and local temperature difference on the slider surface on lubricant transfer are studied. We observe that the amount of lubricant transferred to the slider sharply increases with the increase of lubricant thickness value on the disk surface. Increasing the number of hydroxyl groups in an individual lubricant molecule can greatly reduce the volume of the lubricant transferred to the slider. In addition, the local temperature difference on the slider surface can increase the volume of lubricant transferred to slider. What is more, the increasing of the number of hydroxyl groups contained in an individual molecule can considerably improve the influence of the local temperature difference on the lubricant transfer between slider and disk.
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[2] Ambekar R P, Bogy D B, Bhatia C S 2009 J. Tribol. 131 031901
[3] Hua W, Liu B, Yu S, Zhou W 2009 IEEE Trans. Magn. 45 4998
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[6] Waltman R J, Deng H, Wang G J, Zhu H, Tyndall G W 2010 Tribol. Lett. 39 211
[7] Tani H, Iwasaki K, Maruyama Y, Ota I, Tagawa N 2011 IEEE Trans. Magn. 47 1837
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[10] Guo X Y, Li X, Hu Y Z, Wang H 2008 Chin. Phys. B 17 1094
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[12] Wang H, Yang F J, Xue S X, Cao X, Wang J A, Gu H S, Zhao Z Q 2005 Acta Phys. Sin. 54 1415 (in Chinese) [王浩, 杨辅军, 薛双喜, 曹歆, 王君安, 顾豪爽, 赵子强 2005 54 1415]
[13] Li H X, Xu T, Chen J M, Zhou H D, Liu H W 2005 Acta Phys. Sin. 54 1885 (in Chinese) [李红轩, 徐洮, 陈建敏, 周惠娣, 刘惠文 2005 54 1885]
[14] Zhang Z Y, Lu X C, Luo J B 2007 Chin. Phys. 16 3790
[15] Guo Q, Izumisawa S, Phillips D M, Jhon M S 2003 J. Appl. Phys. 93 8707
[16] Li X, Hu Y Z, Wang H, Chen H 2007 Acta Phys. Sin. 56 4094 (in Chinese) [李欣, 胡元中, 王慧, 陈辉 2007 56 4094]
[17] Li X, Hu Y Z, Wang H 2005 Acta Phys. Sin. 54 3787 (in Chinese) [李欣, 胡元中, 王慧 2005 54 3787]
[18] Li Y, Wong C H, Li B, Yu S, Hua W, Zhou W 2012 Soft Matter 8 5649
[19] Chen H, Guo Q, Jhon M S 2007 IEEE Trans. Magn. 43 2247
[20] Bechtel J E, Bogy D B 2011 IEEE Trans. Magn. 47 2379
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[1] Chen C Y, Bogy D B, Bhatia C S 2001 Tribol. Lett. 10 195
[2] Ambekar R P, Bogy D B, Bhatia C S 2009 J. Tribol. 131 031901
[3] Hua W, Liu B, Yu S, Zhou W 2009 IEEE Trans. Magn. 45 4998
[4] Marchon B, Dai Q, Knigge B, Pit R 2007 IEEE Trans. Magn. 43 3694
[5] Ma Y, Liu B 2007 Appl. Phys. Lett. 90 143516
[6] Waltman R J, Deng H, Wang G J, Zhu H, Tyndall G W 2010 Tribol. Lett. 39 211
[7] Tani H, Iwasaki K, Maruyama Y, Ota I, Tagawa N 2011 IEEE Trans. Magn. 47 1837
[8] Man Y, Liu B, Zhang M, Gonzaga L 2009 Microsyst. Technol. 15 1515
[9] Zhang X J, Huang Y, Guo Y B, Tian Y, Meng Y G 2013 Chin. Phys. B 22 016202
[10] Guo X Y, Li X, Hu Y Z, Wang H 2008 Chin. Phys. B 17 1094
[11] Zhang L, Zu X T 2006 Acta Phys. Sin. 55 4271 (in Chinese) [章黎, 祖小涛 2006 55 4271]
[12] Wang H, Yang F J, Xue S X, Cao X, Wang J A, Gu H S, Zhao Z Q 2005 Acta Phys. Sin. 54 1415 (in Chinese) [王浩, 杨辅军, 薛双喜, 曹歆, 王君安, 顾豪爽, 赵子强 2005 54 1415]
[13] Li H X, Xu T, Chen J M, Zhou H D, Liu H W 2005 Acta Phys. Sin. 54 1885 (in Chinese) [李红轩, 徐洮, 陈建敏, 周惠娣, 刘惠文 2005 54 1885]
[14] Zhang Z Y, Lu X C, Luo J B 2007 Chin. Phys. 16 3790
[15] Guo Q, Izumisawa S, Phillips D M, Jhon M S 2003 J. Appl. Phys. 93 8707
[16] Li X, Hu Y Z, Wang H, Chen H 2007 Acta Phys. Sin. 56 4094 (in Chinese) [李欣, 胡元中, 王慧, 陈辉 2007 56 4094]
[17] Li X, Hu Y Z, Wang H 2005 Acta Phys. Sin. 54 3787 (in Chinese) [李欣, 胡元中, 王慧 2005 54 3787]
[18] Li Y, Wong C H, Li B, Yu S, Hua W, Zhou W 2012 Soft Matter 8 5649
[19] Chen H, Guo Q, Jhon M S 2007 IEEE Trans. Magn. 43 2247
[20] Bechtel J E, Bogy D B 2011 IEEE Trans. Magn. 47 2379
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