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The effects of the pulse voltage amplitude （U） and duty cycle （d） on the growth characteristics, microstructure, phase component and corrosion resistance of the coating formed by microarc oxidation （MAO） on commercially pure titanium substrates in colloid have been systematically studied. The results show that, with the increase of U or d, the coating thickness increases almost linearly, the pore size and the roughness of the surface increases gradually, while the pore density decreases. The coatings almost entirely consist of dense layer, and they are completely composed of rutile TiO2 except the one formed at the duty cycle of 10% （U=450 V）, which contains a small amount of anatase TiO2 The corrosion resistance test in sulfuric acid solution （30%） shows that the corrosion resistance of the samples is closely related to U and d, with the increase of U or d, the corrosion resistance of the samples increases gradually.
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Keywords:
- microarc oxidation /
- colloid /
- commercially pure titanium
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[3] ［3］Wei D Q, Zhou Y, Wang Y M, Jia D C 2007 Appl. Surf. Sci. 253 5045
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[6] ［6］Wang Y M, Jia D C, Guo L X, Lei T Q, Jiang B L 2005 Mater. Chem. Phys. 90 128
[7] ［7］Jin F Y, Chua P K, Wang K, Zhao J, Huang A P, Tong H H 2008 Mat. Sci.Eng. A 476 78
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[9] ［9］Liu J, Xiong D S, Shen C J 2006 Electroplating&Finishing 12 0041 （in Chinese）［刘君、熊党生、沈承金 2006 电镀与涂饰 12 0041］
[10] ］Zhang R H, Shan D Y, Chen R S, Han E H 2007 T. Nonferr. Metal. Soc. 10 1577 （in Chinese）［张荣发、单大勇、陈荣石、韩恩厚 2007 中国有色金属学报 10 1577］
[11] ］Wang Y M, Jiang B L, Lei T Q, Guo L X, Cao Y P 2003 J. Inorg. Mater. 6 1325 （in Chinese）［王亚明、蒋百灵、雷廷权、郭立新、曹跃平 2003 无机材料学报 6 1325］
[12] ］Wu H H, Long B H, Lu X Y, Wang J B, Jin Z S 2005 Acta Phys. Sin. 54 1697 （in Chinese）［吴汉华、龙北红、吕宪义、汪剑波、金曾孙 2005 54 1697］
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[1] ［1］Yerokhin A L, Nie X, Leyland A, Matthews A, Dowey S J 1999 Surf. Coat. Tech. 122 73
[2] ［2］Wu H H, Wang J B, Long B Y, Lü X Y, Long B H, Jin Z S, Bai Y Z, Bi D M 2005 Acta Phys. Sin. 54 5743（in Chinese）［吴汉华、汪剑波、龙北玉、吕宪义、龙北红、金曾孙、白亦真、毕冬梅 2005 54 5743］
[3] ［3］Wei D Q, Zhou Y, Wang Y M, Jia D C 2007 Appl. Surf. Sci. 253 5045
[4] ［4］Wang J B, Wu H H, Li Q J, Li Z K, Gu G R, Lü X Y, Zheng W T, Jin Z S 2005 Chin.Phys. 14 2598
[5] ［5］Wu H H, Long B H, Long B Y, Tang Y G, Chang H, Bai Y Z 2007 Acta Phys. Sin. 56 6537 （in Chinese）［吴汉华、龙北红、龙北玉、唐元广、常鸿、白亦真 2007 56 6537］
[6] ［6］Wang Y M, Jia D C, Guo L X, Lei T Q, Jiang B L 2005 Mater. Chem. Phys. 90 128
[7] ［7］Jin F Y, Chua P K, Wang K, Zhao J, Huang A P, Tong H H 2008 Mat. Sci.Eng. A 476 78
[8] ［8］Wei D Q, Zhou Y, Jia D C, Wang Y M 2007 Mater.Chem.Phys. 104 177
[9] ［9］Liu J, Xiong D S, Shen C J 2006 Electroplating&Finishing 12 0041 （in Chinese）［刘君、熊党生、沈承金 2006 电镀与涂饰 12 0041］
[10] ］Zhang R H, Shan D Y, Chen R S, Han E H 2007 T. Nonferr. Metal. Soc. 10 1577 （in Chinese）［张荣发、单大勇、陈荣石、韩恩厚 2007 中国有色金属学报 10 1577］
[11] ］Wang Y M, Jiang B L, Lei T Q, Guo L X, Cao Y P 2003 J. Inorg. Mater. 6 1325 （in Chinese）［王亚明、蒋百灵、雷廷权、郭立新、曹跃平 2003 无机材料学报 6 1325］
[12] ］Wu H H, Long B H, Lu X Y, Wang J B, Jin Z S 2005 Acta Phys. Sin. 54 1697 （in Chinese）［吴汉华、龙北红、吕宪义、汪剑波、金曾孙 2005 54 1697］
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