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利用相场模型与溶质场、温度场进行耦合计算,以Ni-40.83%Cu合金为例模拟了二元合金枝晶生长过程.系统研究相场模型中相场和温度场耦合强度对枝晶形貌和浓度分布的影响.模拟结果表明:随着耦合强度的增加,相场受温度场的影响加大,界面前沿变得不稳,扰动被放大,主枝上出现了二次枝晶.同时,枝晶尖端的生长速率增大,而枝晶尖端的曲率半径减小,枝晶前沿的溶质富集现象也更严重;另外,计算结果与Ivantsov理论符合较好.
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关键词:
- 相场法 /
- NiCu合金 /
- 枝晶生长 /
- Ivantsov理论
Phase-field model is used and The dendrite growth of a Ni-40.83%Cu binaryalloy under were simulated by the model coupled with solute field and temperature field.The effects of solidification latent heat on the growth of equiaxed dendrite, distribution of solute field and temperature field in undercooled liquid alloy were analyzed.The results indicate that the dendritic has well-developed secondary arms as undercooling degree increases.Correspondently, the solute Peclet number and the tip speed increases, the tip radius decreases, and the solute segregation in solid-liquid interface increases. The results agree well with Ivantsov theory.-
Keywords:
- phase-field model /
- Ni-Cu dual single-phase alloy /
- dendrite growth /
- Ivantsov theory
[1] Kobayashi R 1993 Physica D 63 410
[2] Wheeler A A, Murrary B T, Schaefer R J 1993 Physica D 66 243
[3] Zhao D P, Jing T, Liu B C 2003 Acta Phys.Sin. 52 1737 (in Chinese) [赵代平、荆 涛、柳百成 2003 52 1737]
[4] Li M E, Yang G C, Zhou Y H 2005 Acta Phys.Sin.54 454 (inChinese) [李梅娥、杨根仓、周尧和 2005 54 454]
[5] Zhu C S, Feng L, Wang Z P, Xiao R Z 2008 Chinese Journal of Mechnical Engineering 45 30 (in Chinese)[朱昌盛、冯 力、王智平、肖荣振 2008 机械工程学报 45 30]
[6] Zhu C S,Wang Z P, Jing T, Xiao R Z 2006 Acta Phys.Sin. 55 1502 (in Chinese)[朱昌盛、王智平、荆 涛、肖荣振 2006 55 1502]
[7] Yu YM, Yang G C, Zhao D W, Karma A, Beckermann C 2001 Acta Phys.Sin. 50 2423 (in Chinese) [于艳梅、杨根仓、赵达文、Karma A, Beckermann C 2001 50 2423]
[8] Ode M, LEE J S, Kim S G, Kim W T, Suzuki T 2000 ISIJ International 40 870
[9] Suzuki T,Kim S G, Kin W T 2007 Maerials Science and Engineering A 499 99
[10] Karma A, Rappel W 1996 Phys. Rev. Lett. 53 3017
[11] Wang S, Sekerka R F 1996 Phys. Rev. E 53 3760
[12] Long WY, Cai QZ, ChenLL, Wei B K 2005 Acta Phys.Sin.54 0256 ( in Chinese) [龙文元、蔡启舟、陈立亮、魏伯康 2005 54 0256]
[13] Jeong, J H, GoldenfeldN, DantzigDantzig J A 2001 Phys.Rev. E 64 041602
[14] Tong X, Beckermann C 2000 Phys.Rev. E 61 R49
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[1] Kobayashi R 1993 Physica D 63 410
[2] Wheeler A A, Murrary B T, Schaefer R J 1993 Physica D 66 243
[3] Zhao D P, Jing T, Liu B C 2003 Acta Phys.Sin. 52 1737 (in Chinese) [赵代平、荆 涛、柳百成 2003 52 1737]
[4] Li M E, Yang G C, Zhou Y H 2005 Acta Phys.Sin.54 454 (inChinese) [李梅娥、杨根仓、周尧和 2005 54 454]
[5] Zhu C S, Feng L, Wang Z P, Xiao R Z 2008 Chinese Journal of Mechnical Engineering 45 30 (in Chinese)[朱昌盛、冯 力、王智平、肖荣振 2008 机械工程学报 45 30]
[6] Zhu C S,Wang Z P, Jing T, Xiao R Z 2006 Acta Phys.Sin. 55 1502 (in Chinese)[朱昌盛、王智平、荆 涛、肖荣振 2006 55 1502]
[7] Yu YM, Yang G C, Zhao D W, Karma A, Beckermann C 2001 Acta Phys.Sin. 50 2423 (in Chinese) [于艳梅、杨根仓、赵达文、Karma A, Beckermann C 2001 50 2423]
[8] Ode M, LEE J S, Kim S G, Kim W T, Suzuki T 2000 ISIJ International 40 870
[9] Suzuki T,Kim S G, Kin W T 2007 Maerials Science and Engineering A 499 99
[10] Karma A, Rappel W 1996 Phys. Rev. Lett. 53 3017
[11] Wang S, Sekerka R F 1996 Phys. Rev. E 53 3760
[12] Long WY, Cai QZ, ChenLL, Wei B K 2005 Acta Phys.Sin.54 0256 ( in Chinese) [龙文元、蔡启舟、陈立亮、魏伯康 2005 54 0256]
[13] Jeong, J H, GoldenfeldN, DantzigDantzig J A 2001 Phys.Rev. E 64 041602
[14] Tong X, Beckermann C 2000 Phys.Rev. E 61 R49
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