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In this paper, a novel testing method for the assembled performances of the helix slow-wave structure (SWS) with a supported rod is proposed based on heat distribution of SWS. A distributed temperature testing platform using fiber Bragg grating (FBG) and thermocouple is designed, and the influence of thermal sensors on the heat dissipation capability of the SWS is analyzed means of ANSYS. The experimental system including a distributed micro FBG sensor array is set up to test the assembled performance of SWS of the X-band TWT. The results show that the assembled performances of the SWS can be effectively obtained by the tested curve of temperature difference.
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Keywords:
- slow-wave structure /
- assembled performance /
- heat dissipation capability /
- fiber Bragg grating sensor array
[1] Crivello R, Grow R W 1988 IEEE Trans. on ED 35 1701
[2] Gerum W, Bruck M, Fischer G, Henry D, Rothacker H P 2005 IEEE Trans. on ED 52 669
[3] Chong C K, Davis J A, Le Borgne R H, Ramay M L, Stolz R J, Tamashiro R N, Vaszari J P, Zhai Z L 2005 IEEE Trans. on ED 52 653
[4] Ghosh T K, Challis A J, Jacob A, Bowler D, Carter R G 2008 IEEE Trans. on ED 55 668
[5] Han Y, Liu Y W, Ding Y G, Liu P K 2009 Acta Phys. Sin. 58 1806 (in Chinese) [韩勇, 刘燕文, 丁耀根, 刘濮鲲 2009 58 1806]
[6] Zhao X Q, Zhang G X, Sun X H, Ding D, Xie K 2004 Acta Electronica Sinica 32 1029 (in Chinese) [赵新群, 张国兴, 孙小菡, 丁东, 谢锴 2004 电子学报 32 1029]
[7] Han Y, Liu Y W, Ding Y G, Liu P K 2007 IEEE Trans. on ED 54 1562
[8] Culshaw B, Kersey A 2008 IEEE J. Lightwave Technol. 26 1064
[9] Qiao X G, Jia Z A, Fu H W, Li M, Zhou H 2004 Acta Phys. Sin. 53 494 (in Chinese) [桥学光, 贾振安, 傅海威, 李明, 周红 2004 53 494]
[10] Kunkel S H, Peck M W 1994 InterSociety Conference on Thermal Phenomena Washington DC, USA, May 4-7, 1994, 91
[11] Felli F, Brotzu A, Caponero M A, Paolozzi A 2008 IEEE Sensors Journal 8 1299
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[1] Crivello R, Grow R W 1988 IEEE Trans. on ED 35 1701
[2] Gerum W, Bruck M, Fischer G, Henry D, Rothacker H P 2005 IEEE Trans. on ED 52 669
[3] Chong C K, Davis J A, Le Borgne R H, Ramay M L, Stolz R J, Tamashiro R N, Vaszari J P, Zhai Z L 2005 IEEE Trans. on ED 52 653
[4] Ghosh T K, Challis A J, Jacob A, Bowler D, Carter R G 2008 IEEE Trans. on ED 55 668
[5] Han Y, Liu Y W, Ding Y G, Liu P K 2009 Acta Phys. Sin. 58 1806 (in Chinese) [韩勇, 刘燕文, 丁耀根, 刘濮鲲 2009 58 1806]
[6] Zhao X Q, Zhang G X, Sun X H, Ding D, Xie K 2004 Acta Electronica Sinica 32 1029 (in Chinese) [赵新群, 张国兴, 孙小菡, 丁东, 谢锴 2004 电子学报 32 1029]
[7] Han Y, Liu Y W, Ding Y G, Liu P K 2007 IEEE Trans. on ED 54 1562
[8] Culshaw B, Kersey A 2008 IEEE J. Lightwave Technol. 26 1064
[9] Qiao X G, Jia Z A, Fu H W, Li M, Zhou H 2004 Acta Phys. Sin. 53 494 (in Chinese) [桥学光, 贾振安, 傅海威, 李明, 周红 2004 53 494]
[10] Kunkel S H, Peck M W 1994 InterSociety Conference on Thermal Phenomena Washington DC, USA, May 4-7, 1994, 91
[11] Felli F, Brotzu A, Caponero M A, Paolozzi A 2008 IEEE Sensors Journal 8 1299
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