保护气对切割弧特性影响的模拟研究

周前红; 郭文康; 李辉

doi:10.7498/aps.60.025214

摘要

通过比较两种不同结构切割炬所产生的等离子体流场,发现保护气对等离子体的温度和速度分布影响很小.垂直保护气在切割炬喷口形成阻碍作用,造成切割炬内的压强有所升高,但是增加不大.两种结构保护气对切割弧的影响只是在炬喷口外的激波附近.加入保护气后激波的强度会减弱.相对于没有保护气的情况,保护气增加冷却作用,弧电压会略有升高.当改变保护气的成分时,发现弧柱区的氧气含量不受影响,所以保护气成分的改变不会影响到弧电压.计算发现轴线处氧气和周围气体的混合很少,在喷口下游10mm处,氧气的摩尔分数仍在90%以上.

关键词:

Abstract

By comparing two diffierent torch geometries, it was found that the shielding flow has no significant effect on plasma velocity and temperature,except in the shock wave region. The shielding flow decreases the shock wave, and increases the arc voltage due to cooling. In the impinging geometry, shielding flow will crash the plasma jet after the nozzle exit and slightly increase the pressure in the torch. It was also shown that the component of shielding gas has no significant effect on plasma cuttingarc. The mole fraction of oxygen decreases very slowly along the axis and is still more than 90% at 10 mm downstream the nozzle exit.

Keywords:

作者及机构信息

(1)北京应用物理与计算数学研究所,北京 100088;复旦大学现代物理研究所,上海 200433; (2)复旦大学现代物理研究所,上海 200433; (3)中国科学技术大学热科学和能源工程系,合肥 230027

Authors and contacts

(1)Department of Thermal Science and Energy Engineering, University of Science and Technology of China, Hefei 230027, China; (2)Institute of Applied Physics and Computational Mathematics, Beijing 100088, China;Institute of Modern Physics, Fudan University, Shanghai 200433, China; (3)Institute of Modern Physics, Fudan University, Shanghai 200433, China

参考文献

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[18]	Zhou Q H, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2009 J. Phys. D: Appl. Phys. 42 015210
[19]	Zhou Q H, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2008 Plasma Chem. Plasma Process 6 729
[20]	Zhou Q H, Yin H T, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2009 J. Phys. D: Appl. Phys. 42 095208
[21]	Guo S F, Zhou Q H, Guo W K, Xu P 2010 Plasma Chem. Plasma Process 30 121
[22]	Naghizadeh-Kashani Y, Cressault Y, Gleizes A 2002 J. Phys. D: Appl. Phys. 35 2925
[23]	Murphy A B 1995 Plasma Chem. Plasma Process 15 279
[24]	Murphy A B 1994 Plasma Chem. Plasma Process 14 451
[25]	Fluent Inc. 2001 FLUENT Users Guide
[26]	Yakhot V, Orszag S A 1986 Journal of Scientic Computing 1 1
[27]	Jayatilleke C 1969 Prog. Heat Mass Transfer 1 193
[28]	Shih T H, Liou W W, Shabbir A, Yang Z, Zhu J 1995 Computers Fluids 24 227
[29]	Reynolds W C 1987 Lecture Notes for von Karman Institute Agard Report No. 755
[30]	Launder B E 1989 Inter. J. Heat Fluid Flow 10 282
[31]	Launder B E, Reece G J, Rodi W 1975 J. Fluid Mech. 68 537
[32]	Lien F S, Leschziner M A 1994 Computers and Fluids 23 983
[33]	Yuan X Q, Li H, Zhao T Z, Wang F, Guo W K, Xu P 2004 Acta Phys. Sin. 53 788 (in Chinese) [袁行球、李辉、赵太泽、王飞、郭文康、须平2004 53 788]
[34]	Yuan X Q, Li H, Zhao T Z, Wang F, Yu G Y, Guo W K, Xu P 2004 Acta Phys. Sin. 53 3806(in Chinese) 〖袁行球、李辉、赵太泽、王飞、俞国扬、郭文康、须平2004 53 3806]

施引文献

[1]	Gage R M 1957 U. S. Patent 2806124
[2]	Nemchinsky V A, Severance W S 2006 J. Phys. D: Appl. Phys. 39 423
[3]	Ramakrishnan S, Rogozinski M W 1997 J. Phys. D: Appl. Phys. 30 636
[4]	Ramakrishnan S, Gershenzon M, Polivka F, Kearny T N, Rogozinsky M W 1997 IEEE Trans. Plasma Sci. 25 937
[5]	Pardo C, Gonzalez-Aguilar J, Rodriguez-Yunta A, Calderon M A G 1999 J. Phys. D: Appl. Phys. 32 2181
[6]	Freton P, Gonzalez J J, Gleizes A, Peyret F C, Caillibotte G, Delzenne M 2002 J. Phys. D: Appl. Phys. 35 115
[7]	Freton P, Gonzalez J J, Peyret F C, Glezes A 2003 J. Phys. D: Appl. Phys. 36 1269
[8]	Girard L, Teulet Ph, Raza-nimanana M, Gleizes A, Camy-Peyret F, Ballot E, Richard F 2006 J. Phys. D: Appl. Phys. 39 1543
[9]	Peters J, Yin F, Borges C F M, Heberlein J, Hackett C 2005 J. Phys. D: Appl. Phys. 38 1781
[10]	Peters J, Heberlein J, Lindsay J 2007 J. Phys. D: Appl. Phys. 40 3960
[11]	Nemchinsky V A, Showalter M S 2003 J. Phys. D: Appl. Phys. 36 704
[12]	Peters J, Bartlett B, Lindsay J, Heberlein J 2008 Plasma Chem. Plasma Process 28 331
[13]	Bini R, Colosimo B M, Kutlu A E, Monno M 2008 J. Mater. Process Tech. 196 345
[14]	Gonzalez-Aguilar J, Pardo C, Rodriguez-Yunita A, Calderon M A G 1999 IEEE Trans. Plasma Sci. 27 264
[15]	Patankar S V 1980 Numerical Heat Transfer and Fluid Flow. (New York: McGraw-Hill)
[16]	Ghorui S, Heberlein J V R, Pfender E 2007 J. Phys. D: Appl. Phys. 40 1966
[17]	Colombo V, Concetti A, Ghedini E, Dallavalle S, Vancini M 2008 IEEE Trans. Plasma Sci. 36 389
[18]	Zhou Q H, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2009 J. Phys. D: Appl. Phys. 42 015210
[19]	Zhou Q H, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2008 Plasma Chem. Plasma Process 6 729
[20]	Zhou Q H, Yin H T, Li H, Xu X, Liu F, Guo S F, Chang X J, Guo W K, Xu P 2009 J. Phys. D: Appl. Phys. 42 095208
[21]	Guo S F, Zhou Q H, Guo W K, Xu P 2010 Plasma Chem. Plasma Process 30 121
[22]	Naghizadeh-Kashani Y, Cressault Y, Gleizes A 2002 J. Phys. D: Appl. Phys. 35 2925
[23]	Murphy A B 1995 Plasma Chem. Plasma Process 15 279
[24]	Murphy A B 1994 Plasma Chem. Plasma Process 14 451
[25]	Fluent Inc. 2001 FLUENT Users Guide
[26]	Yakhot V, Orszag S A 1986 Journal of Scientic Computing 1 1
[27]	Jayatilleke C 1969 Prog. Heat Mass Transfer 1 193
[28]	Shih T H, Liou W W, Shabbir A, Yang Z, Zhu J 1995 Computers Fluids 24 227
[29]	Reynolds W C 1987 Lecture Notes for von Karman Institute Agard Report No. 755
[30]	Launder B E 1989 Inter. J. Heat Fluid Flow 10 282
[31]	Launder B E, Reece G J, Rodi W 1975 J. Fluid Mech. 68 537
[32]	Lien F S, Leschziner M A 1994 Computers and Fluids 23 983
[33]	Yuan X Q, Li H, Zhao T Z, Wang F, Guo W K, Xu P 2004 Acta Phys. Sin. 53 788 (in Chinese) [袁行球、李辉、赵太泽、王飞、郭文康、须平2004 53 788]
[34]	Yuan X Q, Li H, Zhao T Z, Wang F, Yu G Y, Guo W K, Xu P 2004 Acta Phys. Sin. 53 3806(in Chinese) 〖袁行球、李辉、赵太泽、王飞、俞国扬、郭文康、须平2004 53 3806]

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