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为了抑制埋层注氮导致的埋层内正电荷密度的上升, 本文采用氮氟复合注入方式, 向先行注氮的埋层进行了注氮之后的氟离子注入, 并经适当的退火, 对埋层进行改性. 利用高频电容-电压 (C-V) 表征技术, 对复合注入后的埋层进行了正电荷密度的表征. 结果表明, 在大多数情况下, 氮氟复合注入能够有效地降低注氮埋层内的正电荷密度, 且其降低的程度与注氮后的退火时间密切相关. 分析认为, 注氟导致注氮埋层内的正电荷密度降低的原因是在埋层中引入了与氟相关的电子陷阱. 另外, 实验还观察到, 在个别情况下, 氮氟复合注入引起了埋层内正电荷密度的进一步上升. 结合测量结果, 讨论分析了该现象产生的原因.
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关键词:
- 绝缘体上硅(SOI) 材料 /
- 注氮 /
- 注氟 /
- 埋氧层正电荷密度
Nitrogen ions implanted into the buried oxide layer can increase the total dose radiation hardness of silicon on insulator (SOI) materials. However, the obvious increase in positive charge density in the buried layer with high dose of nitrogen implantation leads to a negative effect on the technology of nitrogen implantation into buried oxide. In order to suppress the increase in positive charge density in the nitrogen-implanted buried layer, co-implantation of nitrogen and fluorine is used to implant fluorine into the nitrogen-implanted buried layer. High-frequency voltage-capacitance (C-V) technique is used to characterize the positive charge density in the buried layer. Results show that, in most cases, using the co-implantation of nitrogen and fluorine can significantly reduce the positive charge density in the nitrogen-implanted buried layer. At the same time, it is also found that further increase of the positive charge density induced by fluorine implantation in the nitrogen-implanted buried layer can occur in particular cases. It is proposed that the decrease in the positive charge density in the fluorine and nitrogen-implanted buried layer is due to the introduction of electron traps into the buried layer through fluorine implantation.-
Keywords:
- silicon on insulator (SOI) /
- nitrogen implantation /
- fluorine implantation /
- positive charge density in buried oxide layer
[1] Mikawa R E, Ackerman M R 1987 IEEE Trans. Nucl. Sci. 34 1698
[2] Musseau O, Leray J L, Ferlet-Cavrois V 1994 IEEE Trans. Nucl. Sci. 41 607
[3] Schwank J R, Shaneyfelt M R, Dodd P E, Ferlet-Cavrois V, Loemker R A, Winokur P S, Fleetwood D M, Paillet P, Leray J L, Draper B L, Witczak S C, Riewe L C 2000 IEEE Trans. Nucl. Sci. 47 2175
[4] Mayer D C 1990 IEEE Trans. Electron. Dev. 37 1280
[5] Yang H, Zhang E X, Zhang Z X 2007 Chin. J. Semi 28 323
[6] Wu A M, Chen J, Zhang E X, Wang X, Zhang Z X 2008 Semicond. Sci. Technol. 23 015015
[7] Zhang S, Zhang Z X, Bi D W, Chen M, Tian H, Yu W J, Wang R, Liu Z L 2009 J. Semicond. 30 093002
[8] Bi D W, Zhang Z X, Zhang S, Chen M, Yu W J, Wang R, Tian H, Liu Z L 2009 Chin. Phys. C 33 866
[9] Zhang E X, Sun J Y, Chen J, Zhang Z X, Wang X 2005 J. Elec. Mat. 34 L53
[10] Zheng Z S, Liu Z L, Yu F, Li N 2012 Chin. Phys. B 21 106106
[11] Tang H M, Zheng Z S, Zhang E X, Yu F 2011 Acta Phys. Sin. 60 056104 (in Chinese) [唐海马, 郑中山, 张恩霞, 于芳 2011 60 056104]
[12] Satinder K S, Prasad B, Kumar D, Kumar R 2009 Vacuum 83 1359
[13] Lelis A J, Oldham T R, Boesch H E, Jr McLean F B 1989 IEEE Trans. Nucl. Sci. 36 1808
[14] Pantelides S T, Lu Z Y, Nicklaw C, Bakos T, Rashkeev S N, Fleetwood D M, Schrimpf R D 2008 Journal of Non-Crystalline Solids 354 217
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[1] Mikawa R E, Ackerman M R 1987 IEEE Trans. Nucl. Sci. 34 1698
[2] Musseau O, Leray J L, Ferlet-Cavrois V 1994 IEEE Trans. Nucl. Sci. 41 607
[3] Schwank J R, Shaneyfelt M R, Dodd P E, Ferlet-Cavrois V, Loemker R A, Winokur P S, Fleetwood D M, Paillet P, Leray J L, Draper B L, Witczak S C, Riewe L C 2000 IEEE Trans. Nucl. Sci. 47 2175
[4] Mayer D C 1990 IEEE Trans. Electron. Dev. 37 1280
[5] Yang H, Zhang E X, Zhang Z X 2007 Chin. J. Semi 28 323
[6] Wu A M, Chen J, Zhang E X, Wang X, Zhang Z X 2008 Semicond. Sci. Technol. 23 015015
[7] Zhang S, Zhang Z X, Bi D W, Chen M, Tian H, Yu W J, Wang R, Liu Z L 2009 J. Semicond. 30 093002
[8] Bi D W, Zhang Z X, Zhang S, Chen M, Yu W J, Wang R, Tian H, Liu Z L 2009 Chin. Phys. C 33 866
[9] Zhang E X, Sun J Y, Chen J, Zhang Z X, Wang X 2005 J. Elec. Mat. 34 L53
[10] Zheng Z S, Liu Z L, Yu F, Li N 2012 Chin. Phys. B 21 106106
[11] Tang H M, Zheng Z S, Zhang E X, Yu F 2011 Acta Phys. Sin. 60 056104 (in Chinese) [唐海马, 郑中山, 张恩霞, 于芳 2011 60 056104]
[12] Satinder K S, Prasad B, Kumar D, Kumar R 2009 Vacuum 83 1359
[13] Lelis A J, Oldham T R, Boesch H E, Jr McLean F B 1989 IEEE Trans. Nucl. Sci. 36 1808
[14] Pantelides S T, Lu Z Y, Nicklaw C, Bakos T, Rashkeev S N, Fleetwood D M, Schrimpf R D 2008 Journal of Non-Crystalline Solids 354 217
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