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采用基于第一性原理的线性缀加平面波方法(FP-LAPW),研究Al掺杂SnO2材料Sn1-xAlxO2 (x= 0,0.0625,0.125,0.1875,0.25)的电子结 构和光学性质,包括能带结构、电子态密度、介电函数和其他一些光学性质.计算结果表明,掺杂Al之后价带上部分折叠态增加,价带宽度发生收缩,对导带底起作用的Sn 5s态减少,使得带隙增宽,且态密度整体向高能方向发生移动.随着Al掺杂量的增加带隙越来越宽,Al杂质能级在导带部分与Sn 5p态电子相互作用逐渐增强,虚部谱中的第一介电峰的强度随掺杂Al浓度增大而减弱.同时,吸收谱及其他光学谱线与介电函数虚部谱线相对应,各谱线均发生蓝移现象,对应带隙增宽,从理论上指出了光学性质与电子结构之间的内在关系.Based on the full-potential linearized augmented plane-wave method (FP-LAPW), we investigated the electronic structures and the optical properties, including dielectric function, absorption spectra, refraction and extinction of Sn1-xAlxO2 (x=0, 0.0625, 0.125, 0.1875, 0.25) via substituting for Sn with Al in SnO2 supercell. Calculated results show that the introduced Al could induce the band gap widening, and this can be attributed to the increased folded states, which lead to the contraction of the valence band and less Sn 5s states at the bottom of the conduction band. With the increasing of Al concentration, the band gap becomes wider, and the intensity of the first main peaks decreases. All of the optical spectra contain the imaginary part of dielectric function, the absorption spectrum, the refraction, and the extinction show blue shift corresponding to the increasing of the band gaps. Finally, it is expected that our results may inspire the future experimental research.
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Keywords:
- band structure /
- density of states /
- optical properties /
- dielectric function
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[25] Peng L P, Meng G J, Xu L 2007 Journal of Higher Correspondence Education (Natural Sciences) 21 39 (in Chinese) [彭丽萍、孟桂菊、徐 凌 2007 高等函授学报(自然科学版) 21 39]
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[27] Zhang X D, Guo M L, Liu C L, Zhang L A, Zhang W Y, Ding Y Q, Wu Q, Feng X 2008 Eur. Phys. J. B 62 417
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[1] Chopra K L, Major S, Pandya D K 1983 Thin Solid Films 102 1
[2] Dawar A L, Joshi J C 1984 J. Mater. Sci. 19 1
[3] 3815
[4] Kaplan L, Ben Shalom A, Boxman R L, Goldsmith S, Rosenberg U, Nathan M 1994 Thin Solid Films 253 1
[5] Wang H X, Yan Y, Mohammed Y S H, Du X B, Li K, Jin H M 2009 J. Magn. Magn. Mater. 321 337
[6] Du J, Ji Z G 2007 Acta Phys. Sin. 56 2388 (in Chinese) [杜 娟、季振国 2007 56 2388]
[7] Errico L A 2007 Physica B 389 140
[8] Xu J, Huang S P, Wang Z S 2009 Solid State Commun. 149 527
[9] Jin R C, Weng X J, Wang L D, Zhang W J 2008 Journal of Functional Materials and Devices 14 59 (in Chinese)[金仁成、翁雪军、王立鼎、张五金 2008 功能材料与器件学报 14 59]
[10] Xue Y B 2008 Journal of Dalian Jiaotong University 29 96 (in Chinese)[薛严冰 2008大连交通大学学报 29 96]
[11] Calderon-Munoz W R, Sen M, Jena D 2007 J. Appl. Phys. 102 23703
[12] Deng Z H, Yan J F, Zhang F C, Wang X W, Xu J P, Zhang Z Y 2007 Acta Photonica Sin. 36 110 (in Chinese) [邓周虎、闫军峰、张富春、王雪文、徐建平、张志勇2007 光子学报36 110]
[13] Xu J, Huang S P, Wang Z S, Lu D X, Yuan T S 2007 Acta Phys. Sin. 56 7195 (in Chinese) [徐 剑、黄水平、王占山、鲁大学、苑同锁 2007 56 7195]
[14] Zhang C W, Kao H, Dong J M 2009 Phys. Lett.A 373 2592
[15] Liu W, Cao L L 2001 Sci. Chin. Ser B 44 63
[16] Zuo C Y, Wen J, Bai Y L 2010 Chin. Phys. B 19 047101
[17] Zhang F Y, You J Q, Zeng Z, Zhong G H 2007 Chin. Phys. 16
[18] Zhang F C, Zhang Z Y, Zhang W H, Yan J F, Yong J N 2009 Chin. Phys. B 18 2508
[19] Shen J Q, Shi S Q, Ouyang C Y, Lei M S, Tang W H 2009 Chin. Phys. B 18 2551
[20] Yu F, Wang P J, Zhang C W 2009 Journal of University of Jinan(Sci. and Tech. ) 23 414 (in Chinese) [于 峰、王培吉、张昌文2009济南大学学报(自然科学版) 23 414]
[21] RomanL S, Valaski R, Canestraro C D, Magalhaes E C S, Persson C, Ahuja R, da Silva E F Jr., Pepe I, da Silva A F 2006 Appl. Surf. Sci. 252 5361
[22] Nabi Z, Kellou A, Mecabih S,Khalfi A, Benosman N 2003 Mater. Sci. Eng. B 98 104
[23] Qin G Q, Li D C, Feng Z J, Liu S M 2009 Thin Solid Films 517 3345
[24] Duan M Y, Xu M, Zhou H P, Chen Q Y, Hu Z G, Dong C J 2008 Acta Phys. Sin. 57 6520 (in Chinese) [段满益、徐 明、周海平、 陈青云、 胡志刚、 董成军 2008 57 6520]
[25] Peng L P, Meng G J, Xu L 2007 Journal of Higher Correspondence Education (Natural Sciences) 21 39 (in Chinese) [彭丽萍、孟桂菊、徐 凌 2007 高等函授学报(自然科学版) 21 39]
[26] Chen D G, Cheng W D, Wu D S, Zhang H, Gong Y J, Kan Z G 2005 Solid State Sci. 7 179
[27] Zhang X D, Guo M L, Liu C L, Zhang L A, Zhang W Y, Ding Y Q, Wu Q, Feng X 2008 Eur. Phys. J. B 62 417
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