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中国物理学会期刊
REN Yunkun, CHEN Si, QIN Fei. Effects of temperature cycling on leakage mechanism of through-silicon via insulation layerJ. Acta Physica Sinica, 2025, 74(5): 057301. DOI: 10.7498/aps.74.20241381
Citation: REN Yunkun, CHEN Si, QIN Fei. Effects of temperature cycling on leakage mechanism of through-silicon via insulation layerJ. Acta Physica Sinica, 2025, 74(5): 057301. DOI: 10.7498/aps.74.20241381

Effects of temperature cycling on leakage mechanism of through-silicon via insulation layer

CSTR: 32037.14.aps.74.20241381
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