Polycomponent doping improved thermoelectric performance of Cu<sub>3</sub>SbSe<sub>4</sub>-based solid solutions

Wang Mo-Fan; Ying Peng-Zhan; Li Xie; Cui Jiao-Lin

doi:10.7498/aps.70.20202094

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Wang Mo-Fan, Ying Peng-Zhan, Li Xie, Cui Jiao-Lin. Polycomponent doping improved thermoelectric performance of Cu3SbSe4-based solid solutionsJ. Acta Physica Sinica, 2021, 70(10): 107303. DOI: 10.7498/aps.70.20202094

Citation:

Wang Mo-Fan, Ying Peng-Zhan, Li Xie, Cui Jiao-Lin. Polycomponent doping improved thermoelectric performance of Cu3SbSe4-based solid solutionsJ. Acta Physica Sinica, 2021, 70(10): 107303. DOI: 10.7498/aps.70.20202094

Citation:

Wang Mo-Fan, Ying Peng-Zhan, Li Xie, Cui Jiao-Lin. Polycomponent doping improved thermoelectric performance of Cu3SbSe4-based solid solutionsJ. Acta Physica Sinica, 2021, 70(10): 107303. DOI: 10.7498/aps.70.20202094