Effects of thermal stress induced by mulitiple through silicon vias on mobility and keep out zone

Dong Gang; Liu Dang; Shi Tao; Yang Yin-Tang

doi:10.7498/aps.64.176601

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Dong Gang, Liu Dang, Shi Tao, Yang Yin-Tang. Effects of thermal stress induced by mulitiple through silicon vias on mobility and keep out zoneJ. Acta Physica Sinica, 2015, 64(17): 176601. DOI: 10.7498/aps.64.176601

Citation:

Dong Gang, Liu Dang, Shi Tao, Yang Yin-Tang. Effects of thermal stress induced by mulitiple through silicon vias on mobility and keep out zoneJ. Acta Physica Sinica, 2015, 64(17): 176601. DOI: 10.7498/aps.64.176601

Citation:

Dong Gang, Liu Dang, Shi Tao, Yang Yin-Tang. Effects of thermal stress induced by mulitiple through silicon vias on mobility and keep out zoneJ. Acta Physica Sinica, 2015, 64(17): 176601. DOI: 10.7498/aps.64.176601