Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints

Zhao Ning; Zhong Yi; Huang Ming-Liang; Ma Hai-Tao; Liu Xiao-Ping

doi:10.7498/aps.64.166601

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Zhao Ning, Zhong Yi, Huang Ming-Liang, Ma Hai-Tao, Liu Xiao-Ping. Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder jointsJ. Acta Physica Sinica, 2015, 64(16): 166601. DOI: 10.7498/aps.64.166601

Citation:

Zhao Ning, Zhong Yi, Huang Ming-Liang, Ma Hai-Tao, Liu Xiao-Ping. Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder jointsJ. Acta Physica Sinica, 2015, 64(16): 166601. DOI: 10.7498/aps.64.166601

Citation:

Zhao Ning, Zhong Yi, Huang Ming-Liang, Ma Hai-Tao, Liu Xiao-Ping. Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder jointsJ. Acta Physica Sinica, 2015, 64(16): 166601. DOI: 10.7498/aps.64.166601