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中国物理学会期刊
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Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning. Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder jointsJ. Acta Physica Sinica, 2012, 61(19): 198104. DOI: 10.7498/aps.61.198104
Citation: Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning. Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder jointsJ. Acta Physica Sinica, 2012, 61(19): 198104. DOI: 10.7498/aps.61.198104
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Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints

Acta Phys. Sin., 2012, 61(19): 198104.
DOI: 10.7498/aps.61.198104
CSTR: 32037.14.aps.61.198104
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