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中国物理学会期刊
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian. A microstructure-based study on electromigration in Cu interconnectsJ. Acta Physica Sinica, 2012, 61(1): 018501. DOI: 10.7498/aps.61.018501
Citation: Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian. A microstructure-based study on electromigration in Cu interconnectsJ. Acta Physica Sinica, 2012, 61(1): 018501. DOI: 10.7498/aps.61.018501
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A microstructure-based study on electromigration in Cu interconnects

Acta Phys. Sin., 2012, 61(1): 018501.
DOI: 10.7498/aps.61.018501
CSTR: 32037.14.aps.61.018501
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