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中国物理学会期刊
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Wu Zhen-Yu, Chai Chang-Chun, Li Yue-Jin, Liu Jing, Wang Jia-You, Yang Yin-Tang. The temperature characteristics of stress-induced voiding in Cu interconnectsJ. Acta Physica Sinica, 2009, 58(4): 2625-2630. DOI: 10.7498/aps.58.2625
Citation: Wu Zhen-Yu, Chai Chang-Chun, Li Yue-Jin, Liu Jing, Wang Jia-You, Yang Yin-Tang. The temperature characteristics of stress-induced voiding in Cu interconnectsJ. Acta Physica Sinica, 2009, 58(4): 2625-2630. DOI: 10.7498/aps.58.2625
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The temperature characteristics of stress-induced voiding in Cu interconnects

Acta Phys. Sin., 2009, 58(4): 2625-2630.
DOI: 10.7498/aps.58.2625
CSTR: 32037.14.aps.58.2625
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