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中国物理学会期刊
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Electromigration in Sn3.0Ag0.5Cu flip chip solder jointJ. Acta Physica Sinica, 2009, 58(3): 1942-1947. DOI: 10.7498/aps.58.1942
Citation: Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Electromigration in Sn3.0Ag0.5Cu flip chip solder jointJ. Acta Physica Sinica, 2009, 58(3): 1942-1947. DOI: 10.7498/aps.58.1942
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Electromigration in Sn3.0Ag0.5Cu flip chip solder joint

Acta Phys. Sin., 2009, 58(3): 1942-1947.
DOI: 10.7498/aps.58.1942
CSTR: 32037.14.aps.58.1942
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