Process-induced mechanical stress effects on deep submicron CMOS device

Li Rui; Wang Qing-Dong

doi:10.7498/aps.57.4497

Li Rui, Wang Qing-Dong. Process-induced mechanical stress effects on deep submicron CMOS deviceJ. Acta Physica Sinica, 2008, 57(7): 4497-4507. DOI: 10.7498/aps.57.4497

Citation:

Li Rui, Wang Qing-Dong. Process-induced mechanical stress effects on deep submicron CMOS deviceJ. Acta Physica Sinica, 2008, 57(7): 4497-4507. DOI: 10.7498/aps.57.4497

Citation:

Li Rui, Wang Qing-Dong. Process-induced mechanical stress effects on deep submicron CMOS deviceJ. Acta Physica Sinica, 2008, 57(7): 4497-4507. DOI: 10.7498/aps.57.4497