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中国物理学会期刊
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Liu Hao, Ke Fu-Jiu, Pan Hui, Zhou Min. Molecular dynamics simulation of the diffusion bonding and tensile behavior of a Cu-Al interfaceJ. Acta Physica Sinica, 2007, 56(1): 407-412. DOI: 10.7498/aps.56.407
Citation: Liu Hao, Ke Fu-Jiu, Pan Hui, Zhou Min. Molecular dynamics simulation of the diffusion bonding and tensile behavior of a Cu-Al interfaceJ. Acta Physica Sinica, 2007, 56(1): 407-412. DOI: 10.7498/aps.56.407
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Molecular dynamics simulation of the diffusion bonding and tensile behavior of a Cu-Al interface

Acta Phys. Sin., 2007, 56(1): 407-412.
DOI: 10.7498/aps.56.407
CSTR: 32037.14.aps.56.407
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