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Fabrication and application of ordered Si nanopore array induced by Au

Wang Hai-Peng Ke Shao-Ying Yang Jie Wang Chong Yang Yu

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Fabrication and application of ordered Si nanopore array induced by Au

Wang Hai-Peng, Ke Shao-Ying, Yang Jie, Wang Chong, Yang Yu
cstr: 32037.14.aps.63.098104
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  • Size-controlled Si nanopore array with a pore size less than 100 nm is fabricated on Si (100) substrates by using monolayer self-assembled and KOH anisotropic wet etching technique. Morphology and structure of the pores are characterized by SEM and AFM. Results show that a large area of defect-free polystyrene (PS) monolayer film can be obtained when the volume ratio of PS solution to methanol solution is 9:11. A larger volume ratio or a smaller volume ratio will induce similar bilayer structure and defects (point and line) in the PS film, respectively. The lateral size and depth of the nanopore will increase with the etching time, and its morphology will change from circular to inverted pyramid type gradually. But the orderly arranged structure will be destroyed as the etching time is over 10 min. On the other hand, ordered Ge/Si nanoislands and nanorings will be grown on nanopore-patterned Si (100) substrates (inverted pyramid and circular nanopores, respectively) by ion beam sputtering. In addition, reasonable interpretations have been proposed for the formation mechanism of the ordered Ge/Si nanostructure.
    • Funds: Project supported by the National Natural Science Foundation of China (Grant No. 11274266), the State Key Development Program for Basic Research of China (Grant No. 2012CB326401), the Key Project of Applied Basic Research Program of Yunnan Province, China (Grant No. 2013FA029), and the Science and Technology Project of Yunnan University, China (Grant No. 2013CG024).
    [1]

    Chou S Y, Wei M S, Krauss P R, Fischer P B 1994 J. Appl. Phys. 76 6673

    [2]

    Shwn Y Z, Christopher S F, Jiang Y, Jakubczyk D, Swiatkiewicz J, Prasad P N 2000 J. Phys. Chem. B 104 7577

    [3]

    Wang H Y, Xu X S 2013 Chin. Phys. B 22 054205

    [4]

    Yang S k, Xu F, Ostendorp S, Wilde G, Zhao H P, Lei Y 2011 Adv. Funct. Mater. 21 2446

    [5]

    Chen Z X, Ren Y, Xiao G H, Li J T, Chen X, Wang X H, Jin C J, Zhang B J 2014 Chin. Phys. B 23 018502

    [6]

    Sun P, Xu L, Zhao W M, Li W, Xu J, Ma Z Y, Wu L C, Huang X F, Chen K J 2008 Acta Phys. Sin. 57 1951 (in Chinese)[孙萍, 徐岭, 赵伟明, 李卫, 徐骏, 马忠元, 吴良才, 黄信凡, 陈坤基 2008 57 1951]

    [7]

    Chen L M, Li P G, Fu X L, Zhang H Y, Li H L, Tang W H 2005 Acta Phys. Sin. 54 0582 (in Chinese) [陈雷明, 李培刚, 符秀丽, 张海英, L. H. Li, 唐为华 2005 54 0582]

    [8]

    Awad Y, Lavallee E, Lau K M, Beauvais J, Drouin D, Cloutier M, Turcotte D, Yang P, Kelkar P 2004 J. Vac. Sci. Technol. A 22 1040

    [9]

    Hamouda F, Barbillon G, Held S, Agnus G, Gogol P, Maroutian T, Scheuring S, Bartenlian B 2009 Microelectron. Eng. 86 583

    [10]

    Brambley D, Martin B,, Prewett P D 1994 Adv. Mater. Opt. Elec-tron. 4 55

    [11]

    Lan H B, Ding Y C 2012 Nano Today. 7 94

    [12]

    Martin O J F 2003 Microelectron. Eng. 24 67

    [13]

    Yang M F, Yu H Y, Sun X W, Li J S, Li X C, Ke L, Hu J H, Wang F, Jiao Z H 2011 Solid State Communications 151 127

    [14]

    Xiang Y J, Liu D F, Zhang Z X, Song L, Zhao X W, Liu L F, Luo S D, Ma W J Shen J, Zhou W Y, Zhou J J, Wang C Y, Wang G, Wu X C 2006 Chin. Phys. B 15 2080

    [15]

    Cheng S L, Lin Y H, Lee S W, Lee T, Chen H, Hu J C, Chen L T 2012 Appl. Surf. Sci. 263 430

    [16]

    Chen X, Liang Z H, Chen Z X, Yang W M, Chen T F, Jin C J, Zhang B J 2013 Chin. Phys. B 22 048101

    [17]

    Park K H, Lee S, Koh H K, Lacerda R, Teo K B K, Milne W I 2005 J. Appl. Phys. 97 024311

    [18]

    Sakamoto S, Philippe L, Bechelany M, Michler J, Asoh H, Ono S 2008 Nanotechnology 19 405304

    [19]

    Cheung C L, Nikolic R J, Reinhardt C E, Wang T F 2006 Nanotechnology 17 1339

    [20]

    Ma Y J, Cui J, Fan Y L, Zhong Z Y, Jiang Z M 2011 Nanoscale Research Letters 6 205

    [21]

    Fuhrmann B, Leipner H S, Hoche H R, Schubert L, Werner P, Gosele U 2005 Nano Letters 5 2524

    [22]

    Ma Y J, Zhong Z Y, Yang X J, Fan Y L, Jiang Z M 2013 Nanotechnology 24 015304

    [23]

    Weekes S M, Ogrin F Y, Murray W A, Keatley P S 2007 Langmuir. 23 1057

    [24]

    Eidelloth W, Sandstorm R L 1991 Appl. Phys. Lett. 59 1632

    [25]

    Lu Z C, Zhou M 2011 Journal of Colloid and Interface Science 361 429

    [26]

    Stavroulakis P I, Christou N, Bagnall D 2009 Mater. Sci. Eng. B 165 186

    [27]

    Lindroos V, Tilli M, Lehto A, Motooka T 2010 Handbook of silicon based MEMS materials and technologies (Burlington: William Andrew) pp375-407

    [28]

    Yun M 2000 Journal-Korean Physical Society. 37 605

    [29]

    Shikida M, Sato K, Tokoro K, Uchikawa D 2000 Sens. Actuator A 80 179

    [30]

    Seidel H, Csepregi L, Heuberger A, Baumgartel H 1990 J. Electrochem. Soc. 137 3612

    [31]

    Hollinger G, Himpsel F J 1984 Appl. Phys. Lett. 44 93

    [32]

    Sundaravel B, Sekar K, Kuri G, Satyam P V, Dev B N, Bera Santanu, Narasimhan S V, Chakraborty P, Caccavale F 1999 Appl. Surf. Sci. 137 103

    [33]

    Lu Z H, Sham T K, Norton P R 1993 Solid State Commun. 85 957

    [34]

    Hiraki A, Nicolet M A, Mayer J W 1971 Appl. Phys. Lett. 18 178

    [35]

    Cros A, Derrien J, Salvan F 1981 Surf. Sci. 110 471

    [36]

    Robinson J T, Ratto F, Moutanabbir O, Heun S, Locatelli A, Mentes T O, Aballe L, Dubon O D 2007 Nano Lett. 7 2655

    [37]

    Tu K N, Mayer J W, Feldman L C(translated by Huang X F, Du J F, Chen K J)1997 Electronic Thin Film Sciences (Beijing: Science Press) pp113–114 (in Chinese) [杜经宁, 迈耶J W, 费尔德曼L C著 (黄信凡, 杜家方, 陈坤基译) 1997 电子薄膜科学 (北京: 科学出版社) 第113第–114页]

    [38]

    Zhang Y J, Wang X H, Wang Y X, Liu H L, Yang J H 2008 Journal of Alloys and Compounds 452 473

    [39]

    Schulli T U, Vastola G, Richard M I, Malachias A, Renaud G, Uhlık F, Montalenti F, Chen G, Miglio L, Schaffler F, Bauer G 2009 Phys. Rev. Lett. 102 025502

    [40]

    Katsaros G, Tersoff J, Stoffel M, Rastelli A, Acosta-Diaz P, Kar G S, Costantini G, Schmidt O G, Kern K 2008 Phys. Rev. Lett. 101 096103

    [41]

    Gruetzmacher D, Fromherz T, Dais C, Stangl J, Mueller E, Ekinci Y, Solak H H, Sigg H, Lechner T R, Wintersberger E, Bimer S, Holy V, Bauer G 2007 Nano Lett. 7 3150

    [42]

    Zhong Z Y, Chen P X, Jiang Z M, Bauer G 2008 Appl. Phys. Lett. 93 043106

  • [1]

    Chou S Y, Wei M S, Krauss P R, Fischer P B 1994 J. Appl. Phys. 76 6673

    [2]

    Shwn Y Z, Christopher S F, Jiang Y, Jakubczyk D, Swiatkiewicz J, Prasad P N 2000 J. Phys. Chem. B 104 7577

    [3]

    Wang H Y, Xu X S 2013 Chin. Phys. B 22 054205

    [4]

    Yang S k, Xu F, Ostendorp S, Wilde G, Zhao H P, Lei Y 2011 Adv. Funct. Mater. 21 2446

    [5]

    Chen Z X, Ren Y, Xiao G H, Li J T, Chen X, Wang X H, Jin C J, Zhang B J 2014 Chin. Phys. B 23 018502

    [6]

    Sun P, Xu L, Zhao W M, Li W, Xu J, Ma Z Y, Wu L C, Huang X F, Chen K J 2008 Acta Phys. Sin. 57 1951 (in Chinese)[孙萍, 徐岭, 赵伟明, 李卫, 徐骏, 马忠元, 吴良才, 黄信凡, 陈坤基 2008 57 1951]

    [7]

    Chen L M, Li P G, Fu X L, Zhang H Y, Li H L, Tang W H 2005 Acta Phys. Sin. 54 0582 (in Chinese) [陈雷明, 李培刚, 符秀丽, 张海英, L. H. Li, 唐为华 2005 54 0582]

    [8]

    Awad Y, Lavallee E, Lau K M, Beauvais J, Drouin D, Cloutier M, Turcotte D, Yang P, Kelkar P 2004 J. Vac. Sci. Technol. A 22 1040

    [9]

    Hamouda F, Barbillon G, Held S, Agnus G, Gogol P, Maroutian T, Scheuring S, Bartenlian B 2009 Microelectron. Eng. 86 583

    [10]

    Brambley D, Martin B,, Prewett P D 1994 Adv. Mater. Opt. Elec-tron. 4 55

    [11]

    Lan H B, Ding Y C 2012 Nano Today. 7 94

    [12]

    Martin O J F 2003 Microelectron. Eng. 24 67

    [13]

    Yang M F, Yu H Y, Sun X W, Li J S, Li X C, Ke L, Hu J H, Wang F, Jiao Z H 2011 Solid State Communications 151 127

    [14]

    Xiang Y J, Liu D F, Zhang Z X, Song L, Zhao X W, Liu L F, Luo S D, Ma W J Shen J, Zhou W Y, Zhou J J, Wang C Y, Wang G, Wu X C 2006 Chin. Phys. B 15 2080

    [15]

    Cheng S L, Lin Y H, Lee S W, Lee T, Chen H, Hu J C, Chen L T 2012 Appl. Surf. Sci. 263 430

    [16]

    Chen X, Liang Z H, Chen Z X, Yang W M, Chen T F, Jin C J, Zhang B J 2013 Chin. Phys. B 22 048101

    [17]

    Park K H, Lee S, Koh H K, Lacerda R, Teo K B K, Milne W I 2005 J. Appl. Phys. 97 024311

    [18]

    Sakamoto S, Philippe L, Bechelany M, Michler J, Asoh H, Ono S 2008 Nanotechnology 19 405304

    [19]

    Cheung C L, Nikolic R J, Reinhardt C E, Wang T F 2006 Nanotechnology 17 1339

    [20]

    Ma Y J, Cui J, Fan Y L, Zhong Z Y, Jiang Z M 2011 Nanoscale Research Letters 6 205

    [21]

    Fuhrmann B, Leipner H S, Hoche H R, Schubert L, Werner P, Gosele U 2005 Nano Letters 5 2524

    [22]

    Ma Y J, Zhong Z Y, Yang X J, Fan Y L, Jiang Z M 2013 Nanotechnology 24 015304

    [23]

    Weekes S M, Ogrin F Y, Murray W A, Keatley P S 2007 Langmuir. 23 1057

    [24]

    Eidelloth W, Sandstorm R L 1991 Appl. Phys. Lett. 59 1632

    [25]

    Lu Z C, Zhou M 2011 Journal of Colloid and Interface Science 361 429

    [26]

    Stavroulakis P I, Christou N, Bagnall D 2009 Mater. Sci. Eng. B 165 186

    [27]

    Lindroos V, Tilli M, Lehto A, Motooka T 2010 Handbook of silicon based MEMS materials and technologies (Burlington: William Andrew) pp375-407

    [28]

    Yun M 2000 Journal-Korean Physical Society. 37 605

    [29]

    Shikida M, Sato K, Tokoro K, Uchikawa D 2000 Sens. Actuator A 80 179

    [30]

    Seidel H, Csepregi L, Heuberger A, Baumgartel H 1990 J. Electrochem. Soc. 137 3612

    [31]

    Hollinger G, Himpsel F J 1984 Appl. Phys. Lett. 44 93

    [32]

    Sundaravel B, Sekar K, Kuri G, Satyam P V, Dev B N, Bera Santanu, Narasimhan S V, Chakraborty P, Caccavale F 1999 Appl. Surf. Sci. 137 103

    [33]

    Lu Z H, Sham T K, Norton P R 1993 Solid State Commun. 85 957

    [34]

    Hiraki A, Nicolet M A, Mayer J W 1971 Appl. Phys. Lett. 18 178

    [35]

    Cros A, Derrien J, Salvan F 1981 Surf. Sci. 110 471

    [36]

    Robinson J T, Ratto F, Moutanabbir O, Heun S, Locatelli A, Mentes T O, Aballe L, Dubon O D 2007 Nano Lett. 7 2655

    [37]

    Tu K N, Mayer J W, Feldman L C(translated by Huang X F, Du J F, Chen K J)1997 Electronic Thin Film Sciences (Beijing: Science Press) pp113–114 (in Chinese) [杜经宁, 迈耶J W, 费尔德曼L C著 (黄信凡, 杜家方, 陈坤基译) 1997 电子薄膜科学 (北京: 科学出版社) 第113第–114页]

    [38]

    Zhang Y J, Wang X H, Wang Y X, Liu H L, Yang J H 2008 Journal of Alloys and Compounds 452 473

    [39]

    Schulli T U, Vastola G, Richard M I, Malachias A, Renaud G, Uhlık F, Montalenti F, Chen G, Miglio L, Schaffler F, Bauer G 2009 Phys. Rev. Lett. 102 025502

    [40]

    Katsaros G, Tersoff J, Stoffel M, Rastelli A, Acosta-Diaz P, Kar G S, Costantini G, Schmidt O G, Kern K 2008 Phys. Rev. Lett. 101 096103

    [41]

    Gruetzmacher D, Fromherz T, Dais C, Stangl J, Mueller E, Ekinci Y, Solak H H, Sigg H, Lechner T R, Wintersberger E, Bimer S, Holy V, Bauer G 2007 Nano Lett. 7 3150

    [42]

    Zhong Z Y, Chen P X, Jiang Z M, Bauer G 2008 Appl. Phys. Lett. 93 043106

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Publishing process
  • Received Date:  21 November 2013
  • Accepted Date:  20 January 2014
  • Published Online:  05 May 2014
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