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本文利用化学浸蚀方法,在400—900℃的温度范围内,在0.35—13kg·mm-2的应力条件下,测量了硅晶体中单个位错的运动速度。实验结果表明,位错运动速度V(τ,T)作为温度(T)和分解切应力(τ)的函数,满足如下方程:V(τ,T)=Aτme-Q/(KT)。式中m=1.02—1.49,Q=1.96—2.07eV。最后,把实验结果与扩展位错的弯结模型作了比较。Chemical etching method was used to measure the velocity of isolated dislocations in silican crystals for temperatures in the range of 400-900℃ and under stresses in the range of 0.35-13kg·mm-2. Dislocation Velocity v(τ, T) as a function of temperature (T) and stress (τ) satisfies the following equation v(τ,T)=Aτme-Q/(KT) where m = 1.02-1.49, Q = 1.96-2.07eV. Finally, the experimental results obtained on the motion of dislocations in silican single crystals were compared with those derived from the kink model of extended dislocation.
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