可延展柔性无机微纳电子器件原理与研究进展

冯雪; 陆炳卫; 吴坚; 林媛; 宋吉舟; 宋国锋; 黄永刚

doi:10.7498/aps.63.014201

摘要

为适应下一代电子产品便携性、形状可变性、人体适用性等方面的进一步需求，近年来基于无机电子材料的可延展柔性电子技术成为全球电子产业界与学术界关注的新焦点. 与有机柔性电子学器件不同，可延展柔性无机电子器件指的是建立在柔性基底上的无机电子组件. 这种具有柔性的集成电路利用力学设计提供大变形，在保持无机脆性电子器件高性能和高可靠性的同时，具备形状可弯曲、可伸缩等柔性性能. 本文综述了近年来无机柔性电子器件的进展，包括力学设计原理、基于界面黏附的转印集成方法以及柔性大变形下的失效机理等，并展望了未来的应用和发展.

关键词:

Abstract

In order to meet the further demand of the next-generation electronic devices in the transplantable, lightweight and portable performances, flexible and stretchable inorganic electronics attract much more attention in both industry and academia in recent years. Compared to organic electronics, stretchable and flexible inorganic electronics are fabricated with the integrated structures of inorganic components on complaint substrates, which own the stretchability and flexibility via mechanical design. Thus stretchable and flexible inorganic electronics have the high electron mobility and excellent conformability to non-planar environment subjected to large deformation. This paper reviews the recent progress on principle, design based on mechanics, integration based on transfer printing and the reliability analysis of stretchable and flexible inorganic electronics. Finally, the prospective is also described for future application in bioengineering and medicine.

Keywords:

作者及机构信息

1.
清华大学航天航空学院, 应用力学教育部重点实验室, 北京 100084;

2.
清华大学先进力学与材料中心, 北京 100084;

3.
电子科技大学, 电子薄膜与集成器件国家重点实验室, 成都 610054;

4.
美国迈阿密大学机械与航空工程系, 迈阿密, 佛罗里达 33146;

5.
中科院半导体研究所, 集成光电子学国家重点联合实验室, 北京 100083;

6.
美国西北大学机械工程系, 埃文斯顿, 伊利诺伊 60208

基金项目: 国家自然科学基金（批准号：11320101001，10820101048，11222220，10902059，11372272）和清华信息科学与技术国家实验室（筹）资助的课题.

Authors and contacts

1.
AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China;

2.
Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China;

3.
State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Sichuan 610054, China;

4.
Department of Mechanical and Aerospace Engineering, University of Miami, Miami, Florida 33146, USA;

5.
Institute of Semiconductor, Chineses Academy of Science, Beijing 100083, China;

6.
Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA

Funds: Project supported by the National Natural Science Foundation of China (Grant Nos. 11320101001, 10820101048, 11222220, 10902059, 11372272), and the National Laboratory of Information Science and Technology of Tsinghua University.

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施引文献

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[2]	Khang D Y, Jiang H Q, Huang Y, Rogers J A 2006 Science 311 208
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[11]	Nicholson P G, Castro F A 2010 Nanotechnology 21 492001
[12]	Park S, Xiong Y, Kim R H, Elvikis P, Meitl M, Kim D H, Wu J, Yoon J, Yu C J, Liu Z, Huang Y, Hwang K C, Ferreira P, Li X L, Choquette K, Rogers J A 2009 Science 325 977
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