考虑栅片烧蚀金属蒸气的栅片切割空气电弧仿真与实验研究

杨飞; 荣命哲; 吴翊; 史强; 刘增超; 马瑞光; 陈胜

doi:10.7498/aps.60.055208

摘要

基于磁流体动力学理论(MHD)建立了考虑栅片烧蚀金属蒸气的三维空气电弧模型,对模型灭弧室内的的电弧跑动及切割过程进行了数值仿真与实验研究.在传统的质量,动量,能量守恒方程中引入了金属蒸气浓度方程耦合求解用于描述灭弧室内金属蒸气的对流与扩散.在计算中考虑了金属蒸气对于电弧等离子体热力学参数和输运参数的影响.通过计算获得了电弧运动及切割过程的电弧电压,温度分布,金属蒸气浓度分布,灭弧室内流场变化等,分析了由于金属蒸气存在引起的电弧等离子体电导率的变化在切割过程中对于电弧行为的影响.为了验证仿真模型的有效性,进

关键词:

Abstract

A three-dimensional magnetohydrodynamic model of an air arc plasma, considering the metal vapour from erosion of an iron splitter plate, is developed. An equation describing conservation of the iron vapour mass is added to the standard mass, momentum, and energy conservation equations. The influence of the iron vapour on the thermodynamic and transport properties of the gas mixture is considered in the calculation. The arc voltage, and distributions of temperature, gas flow, and mass fraction of iron vapour in the arc chamber are calculated and analyzed in detail. The experiment was carried out to support the simulation work. The images recorded by a high-speed camera and arc voltage measurement were compared with the predictions of the simulations, which proved the validity of the simulation model.

Keywords:

作者及机构信息

1.
西安交通大学电力设备电气绝缘国家重点实验室,电气工程学院,西安 710049

基金项目: 国家自然科学基金(批准号:50907047)和国家高技术研究发展计划"863项目"(批准号:2009AA04Z105)资助的课题.

Authors and contacts

1.
State Key Lab of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an 710049,China

参考文献

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[16]	Gleizes A, Gonzalez J J, Freton P 2005 J. Phys. D: Appl. Phys. 38 R153
[17]	Hsu K C, Etemadi K, Pfender E 1983 J. Appl. Phys. 54 1293
[18]	Gleizes A, Rahmani B, Gonzalez J J, Liani B 1991 J. Phys. D: Appl. Phys. 24 1300
[19]	Murphy A B 1995 Plasma Chem. Plasma Process. 15 279
[20]	Lowke J J, Morrow R, Haidar J 1997 J. Phys. D: Appl. Phys. 30 2033
[21]	Xu G, Hu J, Tsai H L 2008 J. Appl. Phys. 104 103301
[22]	Coulombe S and Meunier J L 1997 J. Phys. D: Appl. Phys. 30 2905
[23]	Yokomizu Y, Matsumura T, Henmi R and Kito Y 1996 J. Phys. D: Appl. Phys. 29 1260
[24]	Schmitz H, Riemann K U 2002 J. Phys. D: Appl. Phys. 35 1727
[25]	Lowke J J, Tanaka M 2006 J. Phys. D: Appl. Phys.39 3634
[26]	Slade P G 1999 Electrical Contacts: Principles and Applications (New York: Marcel Dekker)
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施引文献

[1]	Chadebec O, Meunier G, Mazauric V G, Le Floch Y, Labie P 2004 IEEE Trans. Magn. 40 1358
[2]	Sun Z Q, Rong M R, Yang F, Wu Y, Ma Q, Wang X H 2008 IEEE Trans. Plasma Sci. 36 1072
[3]	Lindmayer M, Marzahn E, Mutzke, Ruther T, Springstubbe M 2006 IEEE Trans. Compon. Packag. Technol. 29 310
[4]	Gonzalez J J, Gleizes A, Proulx P, Boulos M 1993 J. Appl. Phys. 74 3065
[5]	Murphy A B, Tanaka M, Yamamoto K, Tashiro S, Sato T, Lowke J J 2009 J. Phys. D: Appl. Phys. 42 194006
[6]	Zhang J L, Yan J D, Fang M T C 2004 IEEE Trans. Plasma Sci. 32 1352
[7]	Rong M Z, Ma Q, Wu Y, Xu T J, Murphy A B 2009 J. Appl. Phys. 106 023308
[8]	Rüther T, Mutzke A, Lindmayer M, Kurrat M 2006 Proc. 23rd Int. Conf. on Electrical Contacts (Sendai, Japan)
[9]	Wu Y, Rong M Z, Sun Z Q, Wang X H, Yang F, Li X W 2007 J. Phys. D: Appl. Phys. 40 795
[10]	Zou X, Gong Y, Liu J Y, Gong J Q 2004 Acta Phys.Sin. 53 824 (in Chinese) [邹秀、宫野、刘金远、宫继全 2004 53 824]
[11]	Gong J Q, Gong Y, Liu J Y, Zhang P Y 2002 Acta Phys. Sin. 51 291 (in Chinese) [宫继全、宫野、刘金远、张鹏云 2002 51 291]
[12]	Lu S P, Dong W C, Li D Z, Li Y Y 2009 Acta Phys. Sin. 58 S94 (in Chinese) [陆善平、董文超、李殿中、李依依 2009 58 S94]
[13]	Wu Y, Rong M Z, Yang F, Wang X H, Ma Q, Wang W Z 2008 Acta Phys. Sin. 57 5761 (in Chinese) [吴翊、荣命哲、杨飞、王小华、马强、王伟宗 2008 57 5761]
[14]	Li L C, Xia W D 2008 Chin. Phys. B 17 649
[15]	Swierczynski B, Gonzalez J J, Teulet P, Freton P, Gleizes A 2004 J. Phys. D: Appl. Phys. 37 595
[16]	Gleizes A, Gonzalez J J, Freton P 2005 J. Phys. D: Appl. Phys. 38 R153
[17]	Hsu K C, Etemadi K, Pfender E 1983 J. Appl. Phys. 54 1293
[18]	Gleizes A, Rahmani B, Gonzalez J J, Liani B 1991 J. Phys. D: Appl. Phys. 24 1300
[19]	Murphy A B 1995 Plasma Chem. Plasma Process. 15 279
[20]	Lowke J J, Morrow R, Haidar J 1997 J. Phys. D: Appl. Phys. 30 2033
[21]	Xu G, Hu J, Tsai H L 2008 J. Appl. Phys. 104 103301
[22]	Coulombe S and Meunier J L 1997 J. Phys. D: Appl. Phys. 30 2905
[23]	Yokomizu Y, Matsumura T, Henmi R and Kito Y 1996 J. Phys. D: Appl. Phys. 29 1260
[24]	Schmitz H, Riemann K U 2002 J. Phys. D: Appl. Phys. 35 1727
[25]	Lowke J J, Tanaka M 2006 J. Phys. D: Appl. Phys.39 3634
[26]	Slade P G 1999 Electrical Contacts: Principles and Applications (New York: Marcel Dekker)
[27]	Andrew J G, Attley D R 1975 Moving Boundary Problems in Heat Flow and Diffusion ed JR Ockendon and W R Hodgkins (New York: Clarendon) pp. 38
[28]	Morrow R, Lowke J J 1993 J. Phys. D: Appl. Phys. 26 634

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