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中国物理学会期刊

金刚石/铝复合材料界面性质第一性原理计算及界面反应

First-principles calculation of diamond/Al interface properties and study of interface reaction

CSTR: 32037.14.aps.70.20210341
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  • 采用第一性原理计算和实验相结合的方法, 研究了金刚石/铝复合材料的界面性质及界面反应. 计算结果表明: 金刚石(100)/铝(111)界面粘附功更大, 相比金刚石(111)/铝(111)的界面粘附功4.14 J/m2提高了41%. 同时, 金刚石(100)/铝(111)界面处形成Al—C键合的趋势更强. Al—C键的引入能够促进金刚石(100)/铝(111)界面处C—C键的形成, 提高界面粘附功. 利用真空气压浸渗法制备金刚石/铝复合材料, 并对金刚石/铝复合材料的界面结构进行多尺度表征. 在金刚石100面观察到界面产物Al4C3, 且界面脱粘多发生在金刚石111面,实验现象与计算结果相一致. 湿热实验研究了界面反应对金刚石/铝复合材料的影响, 进一步表明抑制Al4C3生成、改善界面选择性结合对于提高金刚石/铝复合材料性能及稳定性具有重要意义. 本文的研究为第一性原理计算金刚石/金属的界面性质提供了新的思路, 也对金刚石/金属复合材料的设计具有重要的指导意义.

     

    First-principles calculation and experimental methods are used to study the interfacial properties and reaction of diamond/Al composites. Based on the first-principles method, the interfacial adhesion work (Wad), electronic structure and charge transfer of diamond/Al models are calculated systematically. The results show that the adhesion work of diamond(100)/Al(111) is 41% higher than that of diamond(111)/Al(111), therefore, the interface bonding of diamond(100)/Al(111) interface is stronger. According to the analysis of the electronic structure, there are more charges transferring at the diamond(100)/Al(111) interface, and the high charge density is distributed on the side of C atoms. The redistribution of charges at the interface is conducive to the formation of Al—C bond, so that the tendency of forming Al—C bonds is greater. The introduction of Al—C bond can promote the formation of C—C bond at the diamond(100)/Al(111) interface and improve the interfacial adhesion work. In addition, the diamond/Al composites are fabricated by vacuum gas pressure infiltration, and multi-scale characterization of the interface structure of diamond/Al composites is carried out. The interfacial debonding occurs mainly on the diamond 111. Meanwhile, the interface product Al4C3 is easier to form on the diamond 100. The experimental phenomenon is consistent with the calculated results. Moreover, the influence of the interfacial reaction on the properties and stability of diamond/Al composites are further discussed through heat-moisture treatment. The study finds that the performance degradation in heat-moisture environment is related mainly to the hydrolysis of the interface product Al4C3. After 60 days’ heat-moisture, the thermal conductivity of the diamond/Al composites decreases by 29.9%, and the bending strength is reduced by 40.1%. The large attenuation of performance is not conducive to the stability of composites in complex environments. Therefore, inhibiting the formation of Al4C3 and improving interfacial selectivity are of great importance in developing the performance and stability of diamond/Al composites. The research in this paper not only lays a theoretical foundation for the first-principles calculation of the interface properties of diamond/metal, but also possesses important guidance significance in designing the diamond/metal composites.

     

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