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中国物理学会期刊

90 nm CMOS工艺下p+深阱掺杂浓度对电荷共享的影响

CSTR: 32037.14.aps.60.046106

Effect of doping concentration in p+ deep well on charge sharing in 90nm CMOS technology

CSTR: 32037.14.aps.60.046106
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  • 基于3维TCAD器件模拟,研究了90 nm CMOS双阱工艺下p+深阱掺杂对电荷共享的影响. 研究结果表明:改变p+深阱的掺杂浓度对PMOS管之间的电荷共享的影响要远大于NMOS管;通过增加p+深阱的掺杂浓度可以有效抑制PMOS管之间的电荷共享. 这一结论可用于指导电荷共享的加固.

     

    This paper deals with the effect of doping concentration in p+ deep well on charge sharing in 90nm dual well CMOS technology. TCAD simulation results show doping concentration in p+ deep well has a more significant effect on charge sharing in PMOS tube than in NMOS tube. By increasing doping concentration of p+ deep well appropriately, the charge sharing in PMOS can be restrained effectively, which is useful for reinforcing the charge sharing.

     

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