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中国物理学会期刊

掺硅类金刚石膜的制备与力学性能研究

CSTR: 32037.14.aps.57.1935

Study on the mechanical properties of diamond like carbon films with Si doping

CSTR: 32037.14.aps.57.1935
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  • 用脉冲电弧离子镀技术,通过调整掺硅石墨靶和纯石墨靶的数量,制备了一系列不同硅含量的类金刚石薄膜样品.研究发现:当硅含量达6.7at.%时,类金刚石薄膜的应力从4.5GPa降低到3.1GPa,薄膜的硬度还保持在3600Hv,和没有掺杂的类金刚石薄膜的硬度相比,基本保持不变;当硅含量小于6.7at.%时薄膜的摩擦系数相对于未掺杂的类金刚石薄膜也保持不变,为0.15.当薄膜中硅含量继续增加时,薄膜中C—Si键的含量增多,导致薄膜硬度和应力都有较大幅度地减小、摩擦系数增大、磨损性能也变差了.

     

    A series of samples with different Si concentration were prepared by adjusting the numbers of Si-doped graphite targets and pure graphite targets. It was found that the stress in the thin films decreased from 4.5GPa to 3.1GPa when the Si concentration reached 6.7at.%,but the hardness kept constant at about 3600Hv,almost the same as of un-doped thin films,and the friction coefficient of thin films kept constant at about 0.15. As the Si concentration in the thin film kept on increasing,the concentration of C-Si bond will increase,leading to the decrease of hardness and stress and the increase of friction coefficient.

     

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