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中国物理学会期刊

大尺寸化学Ni源金属诱导晶化多晶硅的研究

CSTR: 32037.14.aps.55.6095

Study on the large grain size poly-Si prepared by metal induced crystallization using nickel chemical source

CSTR: 32037.14.aps.55.6095
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  • 用无电电镀的化学方法,在VHF-PECVD沉积获得的非晶硅薄膜表面形成镍诱导源,在550℃下退火若干小时,可以诱导产生微米量级的多晶硅晶粒.用此法形成的镍源可以均匀地分布在非晶硅薄膜的表面.非晶硅薄膜上形成晶核的数量取决于镍溶液的浓度、pH值和无电电镀的时间等参量.当成核密度比较低时可以观察到径向晶化现象.用VHF-PECVD非晶硅薄膜作为晶化前驱物,晶化后多晶硅的最大晶粒尺寸可达到90μm.用此多晶硅试制的TFT,获得了良好的器件特性.

     

    Nonv-electrical plating was employed to form nickel inducing source on the surface of α-Si thin film deposited by VHF-PECVD. It was observed that the nickel inducing source formed by this method appeared as “dots” uniformly distributed on the surface of a-Si thin film after annealed for several hours at 550℃. The quantity of “dot” on the a-Si was determined by Ni concentration in the solution, the PH value, and the plating times, etc. The lateral crystallization was observed if the density of “dots” is relatively low. Poly-Si with maximum grain size of 90μm was obtained from the original α-Si deposited by VHF-PECVD. High performance thin film transistor (TFT) monitors were fabricated using this poly-Si.

     

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