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中国物理学会期刊

Si基Bi4Ti3O12铁电薄膜的制备与特性研究

CSTR: 32037.14.aps.53.1265

Studies on the preparation and characterization of Bi4Ti3O12 thin films on p-Si substrates

CSTR: 32037.14.aps.53.1265
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  • 采用sol-gel工艺, 在分层快速退火的工艺条件下成功地制备了高质量Si基Bi4Ti3O12铁电薄膜. 研究了Si基Bi4Ti3O12薄膜的生长行为、铁电性能、C-V特性和疲劳特性. 研究表明: Si基Bi4Ti3O12薄膜具有随退火温度升高沿c轴择优生长的趋势; 退火温度通过影响薄膜的晶粒尺寸、生长取向和薄膜中载流子的浓度来改变Si基Bi 

    High-quality Bi4Ti3O12 ferroelectric thin films on p-Si substrates were prepared by using the sol-gel technique. The growth behavior, ferroelectric properties, C-V characteristic and fatigue characteristic of Bi4Ti3O12 were investigated. The results show that the growth of Bi4Ti3O12 on bare p-Si substrates is c-axis-oriented with the increase of annealing temperature, and the apparent dependence of the ferroelectric properties of Bi4Ti3O12 films on the grain size, growth behavior and carrier concentration stems from the temperature effects. The C-V hysteresis curves with clockwise loops proved that the Ag/Bi4Ti3O12/p-Si heterostructure can realize a memory effect due to the ferroelectric polarization of Bi4Ti3O12 films and the remnant polarization of the Bi4Ti3O12 films reduced by 12% of the initial value after 109 bipolar switching cycles, which indicated that these Bi4Ti3O12 films deposited on p-Si substrates would be qualified for ferroelectric memories.

     

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