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中国物理学会期刊

真空退火对Ni80Fe20/Cu多层膜微结构的影响

CSTR: 32037.14.aps.48.8

Effect of Annealing on Microstructure of Ni80Fe20/Cu Multilayers

CSTR: 32037.14.aps.48.8
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  • 用直流磁控溅射法在Si(001)衬底上制备了以Ta为缓冲层、含有15周期的Ni80Fe20(4nm)/Cu(6nm)多层膜.样品分别在150,250,350℃进行了真空退火处理.用低角和高角X射线衍射法研究了多层膜的微结构.结果表明,所有样品均有较好的111 取向,而且随退火温度或时间的增加,111取向程度变得更高.超晶格周期、平均面间距在退火后略有减小,表明多层膜结构在退火后变得更为致密.多层膜界面粗糙度随退火温度或时间的增加而增大,平均相关长度随退火温度或时间的增加而减小,分析认为这是由于Ni80Fe20/Cu界面存在严重的互扩散所导致的.模拟Ni80Fe20/Cu多层膜高角X射线衍射谱,发现在Ni80Fe20/Cu蜀面有非常厚的混合层存在,而且混合层厚度随退火温度或时间的增加而增大.模拟结果还表明,随退火温度或时间的增加,Ni80Fe20层面间距几乎保持不变,Cu层面间距则随退火温度的增加而略有减小.

     

    Ni80Fe20/Cu15 multilayers were fabricated by dc-magnetron sputtering and annealed at 150, 250 and 350℃, respectively. The structures were investigated by low-angle and high-angle X-ray diffraction. It was found that, as the annealing temperature increases, the 111 preferred orientation of superlattices is improved slightly, while the superlattice period, interplane distance, average multilayer coherence length decrease. The interfacial roughness increases with the increase of annealing temperature and/or annealing time, this can be attributed to the Ni80Fe20 and Cu sublayers has been revealed by simulation of high-angle X-ray diffraction, and its thickness increases as the annealing temperature of annealing time increases. The simulation results furthermore showed that the interplane distances of the Ni80Fe20 layer keeps constant, and that the Cu layer decreases slightly as the annealing temperature increases.

     

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