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Metal materials play an important role in many domains, which are significant to the national economy. However, different kinds of metal defects, such as cracks, contraction cavities, impurities, will be generated in the process of production and service. These defects will affect the metal service life and mechanical properties directly, and even cause serious economic loss. Therefore, it is vital to detect the metal defects. Numerous nondestructive testing (NDT) methods have been proposed for detecting metal defects, such as ultrasonic (US) testing, eddy current testing, photoacoustic (PA) testing, magnetic particle testing, etc. However, each of them uses a single modal signal, which leads to a limited detection range. A nondestructive detecting method for metal material defects based on multimodal signals is proposed to expand the scope of detection and obtain more complete information. Specifically, optical signal, PA signal and US signal are combined together in this method, with the consideration of their complementarities. Simulation and experiments are conducted to validate the effectiveness of the proposed method. Firstly, finite element simulation is employed to analyze the relationship between material parameters and the absorption of laser energy. Meanwhile, the influence of defect size on PA surface wave is simulated and analyzed. Then, a multimodal NDT platform is established to collect and process optical, PA and US signals of the metal defects. These three modal signals contain information about metal surface, shallow surface and internal defects respectively. Eventually, the information, including the location, appearance on the surface, depth, extension path in the material, is obtained. As demonstrated in the results, the nondestructive detecting method based on multimodal signals can detect the metal defects accurately and comprehensively. This method improves the existing methods in terms of detection range and quantitative detection. Additionally, it provides a new way for the quantitative detection and comprehensive diagnosis of metal defects.
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Keywords:
- photoacoustic /
- ultrasound /
- nondestructive detection /
- finite element
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[15] Cavuto A, Martarelli M, Pandarese G, Revel G M, Tomasini E P 2015 Ultrasonics 55 48
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[17] Pang F Q 2008 M. S. Thesis (Taiyuan: North University of China) (in Chinese) [庞付全 2008 硕士学位论文 (太原: 中北大学)]
[18] Sun M J, Cheng X Z, Wan G N, Liu T, Fu Y, Wang Y 2015 Proceedings of the International Symposium on Surface Topography & Optical Microscopy Harbin, China, July 23-25 2015 p13
[19] Cox B T, Laufer J G, Beard P C 2009 Photons Plus Ultrasound: Imaging and Sensing 2009 (USA: SPIE) p13
[20] Sun M J, Cheng X Z, Wang Y, Zhang X, Shen Y, Feng N Z 2016 Acta Phys. Sin. 65 038105 (in Chinese) [孙明健, 程星振, 王艳, 章欣, 沈毅, 冯乃章 2016 65 038105]
[21] Sun M J, Lin X W, Wu Z H, Liu Y, Shen Y, Feng N Z 2014 Proceedings of Instrumentation and Measurement Technology Conference, 2014 IEEE International Montevideo, Uruguay, May 12-15 2014 p896
[22] Ding Y S, Yang S X, Gan C B 2015 J. Vibra. Shock 34 33 (in Chinese) [丁一珊, 杨世锡, 甘春标 2015 振动与冲击 34 33]
[23] Wang L V 2008 IEEE J. Sel. Top. Quant. Electron. 14 171
[24] Lévesque D, Rousset G, Bertrand L 1986 Can. J. Phys. 64 1030
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[1] Dong L M, Li J, Ni C M, Shen Z H, Ni X W, Chen J P, Chigarev N, Tournat V, Gusev V 2011 Chin. J. Lasers 38 90 (in Chinese) [董利明, 李加, 倪辰荫, 沈中华, 倪晓武, 陈建平, N Chigarev, V Tournat, V Gusev 2011 中国激光 38 90]
[2] Han E H, Chen J M, Su Y J, Liu M 2014 Materials China 35 65 (in Chinese) [韩恩厚, 陈建敏, 宿彦京, 刘敏 2014 中国材料进展 35 65]
[3] Bian X Y, Fan J Z, Ma Z L, Zuo T, Wei S H 2010 Rare Metals 3 357 (in Chinese) [边心宇, 樊建中, 马自力, 左涛, 魏少华 2010 稀有金属 3 357]
[4] Huo Y, Zhang C L 2012 Acta Phys. Sin. 61 144204 (in Chinese) [霍雁, 张存林 2012 61 144204]
[5] Meng L Y, Zeng Z, Wang G, Tao N, Zhang C L 2015 Optoelectron. Technol. 35 174 (in Chinese) [孟梨雨, 曾智, 王冠, 陶宁, 张存林 2015 光电子技术 35 174]
[6] Chen J, Bai X L, Yang K J, Ju B F 2015 Ultrasonics 56 505
[7] Sun M J, Wang Y, Zhang X, Liu Y, Wei Q, Shen Y, Feng N Z 2014 Proceedings of Instrumentation and Measurement Technology Conference, 2014 IEEE International Montevideo Uruguay, May 12-15 2014 p819
[8] Petcher P A, Dixon S 2015 Angew. Chem. Int. Edit. 74 58
[9] Soumya D, Kapil G, Stanley R J Mohammad T, Ghasr A 2013 IEEE Trans. Instrum. Meas. 62 4
[10] Zeng W, Wang H T, Tian G Y, Hu G X, Yang X M, Wan M 2014 Nondestr. Test 36 38 (in Chinese) [曾伟, 王海涛, 田贵云, 胡国星, 杨先明, 万敏 2014 无损检测 36 38]
[11] Zeng W, Wang H T, Tian G Y, Hu G X, Wang W 2015 Acta Phys. Sin. 64 134302 (in Chinese) [曾伟, 王海涛, 田贵云, 胡国星, 汪文 2015 64 134302]
[12] Zeng W, Wang H T, Tian G Y, Fang L, Wang W, Wan M, Yang X M 2014 Chin. J. Sci. Instrum. 35 650 (in Chinese) [曾伟, 王海涛, 田贵云, 方凌, 汪文, 万敏, 杨先明 2014 仪器仪表学报 35 650]
[13] Guan J F, Shen Z H, Xu B Q, Ni X W, Lu J 2006 Appl. Acoust. 25 138 (in Chinese) [关建飞, 沈中华, 许伯强, 倪晓武, 陆建 2006 应用声学 25 138]
[14] Podymova N B, Karabutov A A, Cherepetskaya E B 2014 Laser Phys. 24 8
[15] Cavuto A, Martarelli M, Pandarese G, Revel G M, Tomasini E P 2015 Ultrasonics 55 48
[16] Li X K 2014 Ph. D. Dissertation (Chongqing: Chongqing University) (in Chinese) [李新科 2014 博士学位论文(重庆: 重庆大学)]
[17] Pang F Q 2008 M. S. Thesis (Taiyuan: North University of China) (in Chinese) [庞付全 2008 硕士学位论文 (太原: 中北大学)]
[18] Sun M J, Cheng X Z, Wan G N, Liu T, Fu Y, Wang Y 2015 Proceedings of the International Symposium on Surface Topography & Optical Microscopy Harbin, China, July 23-25 2015 p13
[19] Cox B T, Laufer J G, Beard P C 2009 Photons Plus Ultrasound: Imaging and Sensing 2009 (USA: SPIE) p13
[20] Sun M J, Cheng X Z, Wang Y, Zhang X, Shen Y, Feng N Z 2016 Acta Phys. Sin. 65 038105 (in Chinese) [孙明健, 程星振, 王艳, 章欣, 沈毅, 冯乃章 2016 65 038105]
[21] Sun M J, Lin X W, Wu Z H, Liu Y, Shen Y, Feng N Z 2014 Proceedings of Instrumentation and Measurement Technology Conference, 2014 IEEE International Montevideo, Uruguay, May 12-15 2014 p896
[22] Ding Y S, Yang S X, Gan C B 2015 J. Vibra. Shock 34 33 (in Chinese) [丁一珊, 杨世锡, 甘春标 2015 振动与冲击 34 33]
[23] Wang L V 2008 IEEE J. Sel. Top. Quant. Electron. 14 171
[24] Lévesque D, Rousset G, Bertrand L 1986 Can. J. Phys. 64 1030
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