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In order to meet the further demand of the next-generation electronic devices in the transplantable, lightweight and portable performances, flexible and stretchable inorganic electronics attract much more attention in both industry and academia in recent years. Compared to organic electronics, stretchable and flexible inorganic electronics are fabricated with the integrated structures of inorganic components on complaint substrates, which own the stretchability and flexibility via mechanical design. Thus stretchable and flexible inorganic electronics have the high electron mobility and excellent conformability to non-planar environment subjected to large deformation. This paper reviews the recent progress on principle, design based on mechanics, integration based on transfer printing and the reliability analysis of stretchable and flexible inorganic electronics. Finally, the prospective is also described for future application in bioengineering and medicine.
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Keywords:
- stretchable and flexible electronics /
- inorganic semiconductor /
- buckling /
- adhesion
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[23] Chen X, Hutchinson J W 2004 J. Appl. Mech. 71 597
[24] Huang Z Y, Hong W, Suo Z 2005 J. Mech. Phys. Solids 532 101
[25] Li C R, Cao Z X, Chen X 2008 Physics 37 215 (in Chinese) [李超荣, 曹则贤, 陈曦 2008 物理 37 215]
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[69] Chen H, Feng X, Huang Y, Huang Y, Rogers J A 2013 J. Mech. Phys. Solids 61 1737
[70] Kim T W, Bhushan B 2008 J. R. Soc. Interface. 5 319
[71] Poulard C, Restagno F, Weil R, Leger L 2011 Soft Matter 7 2543
[72] Persson B N J 2003 J. Chem. Phys. 118 7614
[73] Persson B N J, Gorb S 2003 J. Chem. Phys. 119 11437
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[75] Lamblet M, Verneuil E, Vilmin T, Buguin A, Silberzan P, Leger L 2007 Langmuir 23 6966
[76] Majumder A, Ghatak A, Sharma A 2007 Science 318 258
[77] Vajpayee S, Jagota A, HuiC Y 2010 J. Adhes. 86 39
[78] Arzt E, Gorb S, Spolenak R 2003 Proc. Natl. Acad. Sci. 100 10603
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[81] Park S, Ahn J H, Feng X, Wang S, Huang Y, Rogers J A 2008 Adv. Funct. Mater. 18 2673
[82] Dai L C, Feng X, Liu B, Fang D N 2010 Appl. Phys. Lett. 97 221903
[83] Huang Y, Feng X, Qu B R 2011 Rev. Sci. Instrum. 82 104704
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