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Based on the one-dimensional analytical thermal model for N strata stacked chips without through-silicon via (TSV), the equivalent thermal model for TSV is presented in this paper. And then, the corresponding analytical thermal model with considering TSV is deriveed. Finally, Matlab software is used to verify and analyze the influence of TSV on the thermal management of 3D IC intergration. The analysis results indicate that the TSV can effectively improve the heat dissipation of 3D IC circuits, and the increase of TSVss pitch can raise the temperature of the 3D IC circuit.
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Keywords:
- 3D IC /
- thermal management /
- through silicon via /
- equivalent thermal model
[1] Xie Y, Chang Y W, Wang Y 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), Taiwan, Taibei, January 18-21, 2010 p169
[2] Andry P S, Tsang C K, Webb B C, Sprogis E J, Wright S L, Bang B, Manzer D G2008 IBM J. Resear. and Develop. 52 571
[3] [4] [5] Lau J H, Lim Y Y, Lim T G, Tang G Y, Khong C H 2008 Proceedings of SPIE- Photonics Packaging, Integration, and Interconnects VIII, San Jose, USA, January 19-24, 2008 DOI:689907
[6] John H L, Tang G Y 2009 IEEE 59th Electronic Components and Technology Conference San Diego, CA, USA, May 26-29, 2009 p635
[7] [8] [9] Zhang J S, Wu Y P, Wang Y G, Tao Y 2010 Acta Phys. Sin. 59 4395 (in Chinese)[张金松、吴懿平、王永国、陶 媛 2010 59 4395]
[10] [11] Shiv G S, Chuan S T 2009 IEEE International Conference on 3D System Integration, Washington, DC, USA, September 28-30, 2009 DOI:5306527
[12] [13] Puttaswamy K, Loh G H 2006 Proceedings of the 16th ACM Great Lakes Symposium on VLSI, Washington, DC, USA, September 12-14, 2006 p19
[14] [15] Cong J, Luo G J 2009 14th Asia and South Pacific Design Automation Conference (ASP-DAC), Yokohama, Japan, January 19-22, 2009 p361
[16] Yan H X, Zhou Q, Hong X L 2009 Integration, the VLSI Journal 42 175
[17] [18] [19] Jain A, Jones R E, Chatterjee R, Pozder S, Huang Z H 2008 11th Intersociety Conference Thermal and Thermo-mechanical Phenomena in Electronics Systems (ITHERM), Orlando, Florida, USA, May 28-31 2008 p1139
[20] Choi K M 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), Taiwan, Taibei, January 18-21, 2010 p163
[21] [22] Yoon K Y, Kim G, Lee W J, Song T G, Lee J H, Lee H D, Park K W 2009 IEEE 11th Electronics Packaging Technology Conference, Singapore, December 9-11, 2009 p702
[23] [24] Zhu Z M, Zhong B, Yang Y T 2010 Acta Phys. Sin. 59 493 (in Chinese)[朱樟明、钟 波、杨银堂 2010 59 493]
[25] -
[1] Xie Y, Chang Y W, Wang Y 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), Taiwan, Taibei, January 18-21, 2010 p169
[2] Andry P S, Tsang C K, Webb B C, Sprogis E J, Wright S L, Bang B, Manzer D G2008 IBM J. Resear. and Develop. 52 571
[3] [4] [5] Lau J H, Lim Y Y, Lim T G, Tang G Y, Khong C H 2008 Proceedings of SPIE- Photonics Packaging, Integration, and Interconnects VIII, San Jose, USA, January 19-24, 2008 DOI:689907
[6] John H L, Tang G Y 2009 IEEE 59th Electronic Components and Technology Conference San Diego, CA, USA, May 26-29, 2009 p635
[7] [8] [9] Zhang J S, Wu Y P, Wang Y G, Tao Y 2010 Acta Phys. Sin. 59 4395 (in Chinese)[张金松、吴懿平、王永国、陶 媛 2010 59 4395]
[10] [11] Shiv G S, Chuan S T 2009 IEEE International Conference on 3D System Integration, Washington, DC, USA, September 28-30, 2009 DOI:5306527
[12] [13] Puttaswamy K, Loh G H 2006 Proceedings of the 16th ACM Great Lakes Symposium on VLSI, Washington, DC, USA, September 12-14, 2006 p19
[14] [15] Cong J, Luo G J 2009 14th Asia and South Pacific Design Automation Conference (ASP-DAC), Yokohama, Japan, January 19-22, 2009 p361
[16] Yan H X, Zhou Q, Hong X L 2009 Integration, the VLSI Journal 42 175
[17] [18] [19] Jain A, Jones R E, Chatterjee R, Pozder S, Huang Z H 2008 11th Intersociety Conference Thermal and Thermo-mechanical Phenomena in Electronics Systems (ITHERM), Orlando, Florida, USA, May 28-31 2008 p1139
[20] Choi K M 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), Taiwan, Taibei, January 18-21, 2010 p163
[21] [22] Yoon K Y, Kim G, Lee W J, Song T G, Lee J H, Lee H D, Park K W 2009 IEEE 11th Electronics Packaging Technology Conference, Singapore, December 9-11, 2009 p702
[23] [24] Zhu Z M, Zhong B, Yang Y T 2010 Acta Phys. Sin. 59 493 (in Chinese)[朱樟明、钟 波、杨银堂 2010 59 493]
[25]
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